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Contents

README

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NCE30D0808J

Wuxi NCE Power Semiconductor · MOSFETs · DFN-6-EP(2x2)

NCE30D0808J from Wuxi NCE Power Semiconductor, in a DFN-6-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S1 passive Source of MOSFET 1 (pin 1 marked on the bottom view); N-channel, VDS 30V, ID 7.7A.
2 G1 input Gate of MOSFET 1; VGS rated ±20V, threshold 1V min to 3V max at 250μA.
3 D2 passive Drain of MOSFET 2 (also the exposed drain pad D2); VDS rated 30V.
4 S2 passive Source of MOSFET 2; N-channel, ID 7.7A continuous.
5 G2 input Gate of MOSFET 2; VGS rated ±20V, threshold 1V min to 3V max at 250μA.
6 D1 passive Drain of MOSFET 1 (also the exposed drain pad D1); VDS rated 30V.
7 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Wuxi NCE Power Semiconductor
Package DFN-6-EP(2x2)
Category Transistors/Thyristors
Pins 7

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 30 V TC=25℃ 1
Gate-Source Voltage VGS -20 20 V TC=25℃ 1
Drain Current-Continuous ID 7.7 A TC=25℃ 1
Drain Current-Pulsed IDM 31 A Repetitive rating: pulse width limited by maximum junction temperature (Note 1) 1
Maximum Power Dissipation PD 2 W TC=25℃ 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance, Junction-to-Ambient RθJA 62.5 ℃/W Surface Mounted on FR4 Board, t ≤ 10 sec (Note 2) 1
Drain-Source Breakdown Voltage BVDSS 30 33 V VGS=0V ID=250μA, TC=25℃ 1
Zero Gate Voltage Drain Current IDSS 1 μA VDS=30V,VGS=0V, TC=25℃ 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V, TC=25℃ 2
Gate Threshold Voltage VGS(th) 1 1.5 3 V VDS=VGS,ID=250μA, TC=25℃ 2
Drain-Source On-State Resistance RDS(ON) 22 25 mΩ VGS=10V, ID=7A, TC=25℃ 2
Drain-Source On-State Resistance RDS(ON) 28 34 mΩ VGS=4.5V, ID=5A, TC=25℃ 2
Diode Forward Voltage VSD 1.2 V VGS=0V,IS=7.7A, TC=25℃ 2
Diode Forward Current IS 7.7 A 2

CAD (KiCad official)

  • Symbol: NCE30D0808J
  • Footprint: Package_DFN_QFN:DFN-6-1EP_2x2mm_P0.65mm_EP1x1.6mm
  • 3D model: DFN-6-EP(2x2) (KiCad packages3D, STEP)
  • 3D model files: nce30d0808j-etched.step / nce30d0808j-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nce30d0808j.step / nce30d0808j.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi NCE Power Semiconductor datasheet (7 pp, sha256 a73264e200ccb940, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF