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Contents

README

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NCE2312A

Wuxi NCE Power Semiconductor · MOSFETs · SOT-23

NCE2312A from Wuxi NCE Power Semiconductor, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; drive with VGS up to ±10V maximum, with RDS(ON) < 35mΩ at VGS=2.5V and < 28mΩ at VGS=4.5V.
2 S passive Source terminal of the N-channel MOSFET; continuous body-diode forward current IS is 5A maximum.
3 D passive Drain; VDS maximum 20V, continuous drain current ID 5A and pulsed IDM 15A.

Key specifications

Parameter Value
Manufacturer Wuxi NCE Power Semiconductor
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Gate Threshold Voltage VGS(th) 0.5 0.65 1 V VDS=VGS,ID=250μA 2
Drain-Source On-State Resistance RDS(ON) 20 35 mΩ VGS=2.5V, ID=4.5 A 2
Drain-Source On-State Resistance RDS(ON) 17 28 mΩ VGS=4.5V, ID=5A 2
Drain-Source Breakdown Voltage BVDSS 20 22 V VGS=0V ID=250μA 1
Zero Gate Voltage Drain Current IDSS 1 μA VDS=20V,VGS=0V 1
Gate-Body Leakage Current IGSS -100 100 nA VGS=±10V,VDS=0V 2
Forward Transconductance gFS 25 S VDS=15V,ID=5A 2
Diode Forward Voltage VSD 1.2 V VGS=0V,IS=1A 2
Diode Forward Current IS 5 A Note 2 2
Drain-Source Voltage VDS 20 V 1
Gate-Source Voltage VGS -10 10 V 1
Drain Current-Continuous ID 5 A 1
Drain Current-Pulsed IDM 15 A Note 1 (pulse width limited by maximum junction temperature) 1
Maximum Power Dissipation PD 1.25 W 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance, Junction-to-Ambient RθJA 100 ℃/W Surface mounted on FR4 Board, t ≤ 10 sec (Note 2) 1

CAD (KiCad official)

  • Symbol: NCE2312A
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: nce2312a-etched.step / nce2312a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nce2312a.step / nce2312a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi NCE Power Semiconductor datasheet (7 pp, sha256 82f5be0bb9538b56, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF