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Contents

README

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NAC1080XTMA2

Infineon Technologies · Others · SOIC-16

NAC1080XTMA2 from Infineon Technologies, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 M_B bidirectional Motor B analog input/output driven by the internal H-Bridge, which switches up to 3.6V at up to 250 mA peak current.
2 VCC_HB power_in H-Bridge output driver supply: connect to an external storage capacitor in passive supply mode or to the external 3.0-3.3V supply in active supply mode.
3 GPIO3 bidirectional 2.5V LVCMOS general purpose input/output with programmable direction and output value, configurable pull-up/pull-down and alternate functions.
4 GPIO2 bidirectional 2.5V LVCMOS general purpose input/output with programmable direction and output value, configurable pull-up/pull-down and alternate functions.
5 GPIO1 bidirectional 2.5V LVCMOS general purpose input/output with programmable direction and output value, configurable pull-up/pull-down and alternate functions.
6 GPIO0 bidirectional 2.5V LVCMOS general purpose input/output with programmable direction and output value, configurable pull-up/pull-down and alternate functions.
7 LA bidirectional NFC antenna pin LA, analog input/output that is internally load modulated.
8 LB bidirectional NFC antenna pin LB, analog input/output that is internally load modulated.
9 VCC_CB power_in Regulator input buffer: connect to the external supply (3.0-3.3V) in active mode or to an external capacitor (recommended 2.2 uF) in passive mode.
10 VCC power_in External supply input (3.0V to 3.3V) in active supply mode; left open in passive supply mode.
11 WAKE_UP bidirectional Analog input/output for external wake-up; connect to GND if not used in the target application.
12 GPIO6 bidirectional 2.5V LVCMOS general purpose input/output with programmable direction and output value, configurable pull-up/pull-down and alternate functions.
13 GPIO5 bidirectional 2.5V LVCMOS general purpose input/output with programmable direction and output value, configurable pull-up/pull-down and alternate functions.
14 GPIO4 bidirectional 2.5V LVCMOS general purpose input/output with programmable direction and output value, configurable pull-up/pull-down and alternate functions.
15 GND power_in Ground net.
16 M_A bidirectional Motor A analog input/output driven by the internal H-Bridge, which switches up to 3.6V at up to 250 mA peak current.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SOIC-16
Category Others
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input peak voltage between LA-LB VInpeak 3.6 VPeak 19
Absolute maximum field strength, indefinite exposure Habsmax 10 A/m Indefinite exposure without damage; chip functionality can be affected 19
Absolute maximum field strength, up to 10 s Habsmax12 12 A/m Tjoperating = 110°C 19
Input peak voltage at VCC, VCC_HB, VCC_CB VCC, VCC_HB, VCC_CB 0 3.6 V 19
ESD voltage Human Body Model VESD_HB 2 kV ANSI/ESDA/JEDEC JS-001 19
ESD voltage Charged Device Model VESD_CDM 500 V ANSI/ESDA/JEDEC JS-002 19
Storage Temperature TStorage -40 125 °C 19
Operating Temperature TAmbient -40 85 °C Ambient temperature range where device is operating 19
Supply Voltage VCC, VCC_HB, VCC_CB 2.8 3 3.3 V TA -25°C to 85°C 20
Supply Current ICC 5 mA average value and operating mode dependent, CPU running at 27 MHz, NVM access enabled 20
Power Down Mode Supply Current ICC_PD 30 uA Chip is in Power Down Mode and wait for Wake Up Event, RTC and Standby Timer active 20
HIGH Level input Voltage VIH 1.75 3.6 V 20
LOW Level input Voltage VIL 0 0.7 V 20
HIGH Level Output Voltage VOH 2.2 V load 1mA 20
Low Level Output Voltage VOL 0.2 V load 1mA 20
Pull-Up Resistance RPU 200 kOhm 20
Pull-Down Resistance RPD 200 kOhm 20
Wake Up Threshold HIGH Level VWU_HIGH 2 V 20
Wake Up Threshold Low Level VWU_LOW 0.4 V 20
Resonance Capacitance between LA and LB CChip 23.5 pF 20
Data Retention after 100 cycles DR 15 a 21
Rise Time (output) tR 2 7 ns capacitive load of 50pF 21
Fall Time (output) tF 2 7 ns capacitive load of 50pF 21
Input Slope Low to High tLH 2 10 ns 21
Input Slope High to Low tHL 2 10 ns 21
Current between M_A and M_B IHB 250 mA 21
Voltage at VCC_HB VDDHB 3 3.6 V VDDHB shall be smaller or equal to the voltage at pin VCC_CB 21

CAD (KiCad official)

  • Symbol: NAC1080XTMA2
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: nac1080xtma2-etched.step / nac1080xtma2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nac1080xtma2.step / nac1080xtma2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (25 pp, sha256 085bc15c4daed77f, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF