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MX25R6435FM2IL0

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MXIC Macronix NOR FLASH, SOP-8-208mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MX25R6435FM2IL0

MXIC Macronix · NOR FLASH · SOP-8-208mil

MX25R6435FM2IL0 from MXIC Macronix, in a SOP-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CS# input Chip Select, active low, selects the device for command and data transfer.
2 SO/SIO1 bidirectional Serial Data Output for 1 x I/O mode, and Serial Data Input & Output for 4 x I/O read mode.
3 WP#/SIO2 bidirectional Write Protection, active low, or Serial Data Input & Output for 4 x I/O read mode; has an internal pull-up that is disabled when the pin is physically connected in the system.
4 GND power_in Ground reference for the device.
5 SI/SIO0 bidirectional Serial Data Input for 1 x I/O mode, and Serial Data Input & Output for 4 x I/O read mode.
6 SCLK input Clock Input that synchronizes serial data transfers.
7 RESET#/SIO3 bidirectional Hardware Reset pin, active low, or Serial Data Input & Output for 4 x I/O read mode; the datasheet notes this pin depends on part number options, and the ordering table lists RESET# for this MPN. Internal pull-up is disabled when physically connected in the system.
8 VCC power_in Power Supply pin for the device.

Key specifications

Parameter Value
Manufacturer MXIC Macronix
Package SOP-8-208mil
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Ambient Operating Temperature (Industrial grade) -40 85 °C Industrial grade 64
Storage Temperature -65 150 °C 64
VCC to Ground Potential -0.5 4 V MX25R (1.65V-3.6V) 64
Device operation range (VCC) 1.65 3.6 V Device operation range 66
VCC Rise Time tVR 1 500000 us/V 72
Input Load Current ILI -2 2 uA VCC = VCC Max, VIN = VCC or GND 66
Output Leakage Current ILO -2 2 uA VCC = VCC Max, VOUT = VCC or GND 66
VCC Standby Current ISB1 5 24 uA VIN = VCC or GND, CS# = VCC 66
Deep Power-down Current ISB2 0.007 0.35 uA VIN = VCC or GND, CS# = VCC 66
VCC Read Current ICC1 2.8 4.5 mA f=16MHz (4x I/O), SCLK=0.1VCC/0.9VCC, SO=Open 66
VCC Read Current ICC1 2.2 4 mA f=33MHz, SCLK=0.1VCC/0.9VCC, SO=Open 66
VCC Read Current ICC1 1.9 3.5 mA f=8MHz (2x I/O), SCLK=0.1VCC/0.9VCC, SO=Open 66
VCC Program Current (PP) ICC2 3.5 6 mA Program in Progress, CS# = VCC 66
VCC Write Status Register (WRSR) Current ICC3 3.1 6 mA Program status register in progress, CS#=VCC 66
VCC Sector/Block (64K) Erase Current (SE/BE) ICC4 3.1 6 mA Erase in Progress, CS#=VCC 66
VCC Chip Erase Current (CE) ICC5 3.1 6 mA Erase in Progress, CS#=VCC 66
Input Low Voltage VIL -0.5 V 66
Output Low Voltage VOL 0.2 V IOL = 100uA 66
Clock Frequency for FAST_READ, RDSFDP, PP, SE, BE32K, BE, CE, DP, RES, WREN, WRDI, RDID, RDSR, WRSR fSCLK 33 MHz 68
Clock Frequency for READ instructions fRSCLK 33 MHz 68
Clock Frequency for 2READ/DREAD instructions fTSCLK 8 MHz 68
Clock Frequency for 4READ/QREAD instructions fQ 8 MHz 68
Clock Frequency for 4PP (Quad page program) f4PP 33 MHz 68
Clock High Time tCH 13 ns Normal Read (fRSCLK) 68
Clock Low Time tCL 13 ns Normal Read (fRSCLK) 68
CS# Active Setup Time (relative to SCLK) tSLCH 5 ns 68
CS# Not Active Hold Time (relative to SCLK) tCHSL 5 ns 68
Data In Setup Time tDVCH 2 ns 68
Data In Hold Time tCHDX 3 ns 68
CS# Active Hold Time (relative to SCLK) tCHSH 5 ns 68
CS# Not Active Setup Time (relative to SCLK) tSHCH 5 ns 68
CS# Deselect Time tSHSL 5 ns From Read to next Read 68
CS# Deselect Time tSHSL 30 ns From Write/Erase/Program to Read Status Register 68
Output Disable Time tSHQZ 8 ns 68
Clock Low to Output Valid tCLQV 12 ns Loading: 30pF 68
Clock Low to Output Valid tCLQV 10 ns Loading: 15pF 68
Output Hold Time tCLQX 0 ns 68
Write Protect Setup Time tWHSL 10 ns 68
Write Protect Hold Time tSHWL 10 ns 68
CS# High to Deep Power-down Mode tDP 10 us 68
Delay Time for Release from Deep Power-Down Mode tDPDD 30 us once entering Deep Power-Down Mode 68
CS# Toggling Time before Release from Deep Power-down Mode to enter Standby Mode tCRDP 20 ns 68
Recovery Time for Release from deep power down mode tRDP 35 us 68
Write Status Register Cycle Time tW 10 30 ms 68
Write Status Register Cycle Time for Mode Switching tWMS 20 us 68
Erase Suspend Latency tESL 60 us 69
Program Suspend Latency tPSL 60 us 69
Latency between Program Resume and next Suspend tPRS 0.3 us 69
Latency between Erase Resume and next Suspend tERS 0.3 us 69
Byte-Program tBP 40 100 us 69
Page Program Cycle Time tPP 3.2 10 ms 69
Sector Erase Cycle Time tSE 58 240 ms 69
Block Erase (32KB) Cycle Time tBE32K 1 3 s 69
Block Erase (64KB) Cycle Time tBE 0.8 3.5 s 69
Chip Erase Cycle Time tCE 120 240 s 69

CAD (KiCad official)

  • Symbol: MX25R6435FM2IL0
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8-208mil (KiCad packages3D, STEP)
  • 3D model files: mx25r6435fm2il0-etched.step / mx25r6435fm2il0-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mx25r6435fm2il0.step / mx25r6435fm2il0.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MXIC Macronix datasheet (86 pp, sha256 69f8fbf48105f662, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF