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MX25R1635FM1IL0

Public Made by Adom

by adom

MXIC(Macronix) NOR FLASH, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MX25R1635FM1IL0

MXIC(Macronix) · NOR FLASH · SOP-8

MX25R1635FM1IL0 from MXIC(Macronix), in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CS# input Chip Select input.
2 SO/SIO1 bidirectional Serial Data Output (for 1 x I/O) or Serial Data Input & Output (for 2 x I/O and 4 x I/O read modes).
3 WP#/SIO2 bidirectional Write Protection (active low) or Serial Data Input & Output for 4 x I/O read mode; internal pull-up is active while the pin is not physically connected.
4 GND power_in Ground.
5 SI/SIO0 bidirectional Serial Data Input (for 1 x I/O) or Serial Data Input & Output (for 4 x I/O read mode).
6 SCLK input Clock input.
7 RESET#/SIO3 bidirectional Hardware Reset pin (active low) or Serial Data Input & Output for 4 x I/O read mode; this part number (M1IL0) uses the RESET# option, and the internal pull-up is active while the pin is not physically connected.
8 VCC power_in Power supply, 1.65V-3.6V for read, erase and program operations.

Key specifications

Parameter Value
Manufacturer MXIC(Macronix)
Package SOP-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Ambient Operating Temperature (Industrial) -40 85 °C Industrial grade 64
Storage Temperature -65 150 °C 64
Applied Input Voltage -0.5 V -0.5V to VCC+0.5V 64
Applied Output Voltage -0.5 V -0.5V to VCC+0.5V 64
VCC to Ground Potential VCC -0.5 4 V MX25R (1.65V-3.6V) 64
Operation Voltage VCC 1.65 3.6 V Read, Erase and Program Operations 4
Input Capacitance CIN 6 pF TA = 25°C, f = 1.0 MHz, VIN = 0V 64
Output Capacitance COUT 8 pF TA = 25°C, f = 1.0 MHz, VOUT = 0V 64
Input Load Current ILI -2 2 uA VCC = VCC Max, VIN = VCC or GND 66
Output Leakage Current ILO -2 2 uA VCC = VCC Max, VOUT = VCC or GND 66
VCC Standby Current ISB1 5 24 uA VIN = VCC or GND, CS# = VCC 66
Deep Power-down Current ISB2 0.007 0.35 uA VIN = VCC or GND, CS# = VCC 66
VCC Read Current ICC1 2.8 4.5 mA f=16MHz (4x I/O), SCLK=0.1VCC/0.9VCC, SO=Open 66
VCC Read Current ICC1 2.2 4 mA f=33MHz, SCLK=0.1VCC/0.9VCC, SO=Open 66
VCC Read Current ICC1 1.9 3.5 mA f=8MHz (2x I/O), SCLK=0.1VCC/0.9VCC, SO=Open 66
VCC Program Current (PP) ICC2 3.5 6 mA Program in Progress, CS# = VCC 66
VCC Write Status Register (WRSR) Current ICC3 3.1 6 mA Program status register in progress, CS#=VCC 66
VCC Sector/Block (64K) Erase Current (SE/BE) ICC4 3.1 6 mA Erase in Progress, CS#=VCC 66
VCC Chip Erase Current (CE) ICC5 3.1 6 mA Erase in Progress, CS#=VCC 66
High Voltage Applied at WP# pin Vhv 7 8 V Test Condition, VCC=2.0V 66
Input Low Voltage VIL -0.5 V Max printed as 0.2VCC 66
Output Low Voltage VOL 0.2 V IOL = 100uA 66
Clock Frequency (FAST_READ, RDSFDP, PP, SE, BE32K, BE, CE, DP, RES, WREN, WRDI, RDID, RDSR, WRSR) fSCLK 0 33 MHz Ultra Low Power Mode; min printed as D.C. 68
Clock Frequency for READ instructions fRSCLK 33 MHz Ultra Low Power Mode 68
Clock Frequency for 2READ/DREAD instructions fTSCLK 8 MHz Ultra Low Power Mode 68
Clock Frequency for 4READ/QREAD instructions fQ 8 MHz Ultra Low Power Mode 68
Clock Frequency for 4PP f4PP 33 MHz Ultra Low Power Mode 68
Clock High Time, Normal Read tCH 13 ns Normal Read (fRSCLK) 68
Clock Low Time, Normal Read tCL 13 ns Normal Read (fRSCLK) 68
CS# Active Setup Time (relative to SCLK) tSLCH 5 ns 68
CS# Not Active Hold Time (relative to SCLK) tCHSL 5 ns 68
Data In Setup Time tDVCH 2 ns 68
Data In Hold Time tCHDX 3 ns 68
CS# Deselect Time, Read to next Read tSHSL 5 ns From Read to next Read 68
CS# Deselect Time, Write/Erase/Program to Read Status Register tSHSL 30 ns From Write/Erase/Program to Read Status Register 68
Output Disable Time tSHQZ 8 ns 68
Clock Low to Output Valid tCLQV 12 ns Loading: 30pF 68
Clock Low to Output Valid tCLQV 10 ns Loading: 15pF 68
Output Hold Time tCLQX 0 ns 68
Write Status Register Cycle Time tW 10 30 ms 68
Erase Suspend Latency tESL 60 us Ultra Low Power Mode 69
Program Suspend Latency tPSL 60 us Ultra Low Power Mode 69
Byte-Program tBP 40 100 us 69
Page Program Cycle Time tPP 3.2 10 ms 69
Sector Erase Cycle Time tSE 58 240 ms 69
Block Erase (32KB) Cycle Time tBE32K 1 3 s 69
Block Erase (64KB) Cycle Time tBE 0.8 3.5 s 69
Chip Erase Cycle Time tCE 30 60 s 69
Erase/Program Cycle 100000 cycles Ultra Low Power Mode 75

CAD (KiCad official)

  • Symbol: MX25R1635FM1IL0
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: mx25r1635fm1il0-etched.step / mx25r1635fm1il0-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mx25r1635fm1il0.step / mx25r1635fm1il0.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MXIC(Macronix) datasheet (86 pp, sha256 c460d612ac50864b, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF