# MX25L1606EM2I-12G

**MXIC Macronix** · NOR FLASH · SOP-8-208mil

MX25L1606EM2I-12G from MXIC Macronix, in a SOP-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CS# | input | Chip select input; serial access to the device is enabled by CS#, and the device enters standby mode when CS# is high and the device is not in operation. |
| 2 | SO/SIO1 | bidirectional | Serial data output for 1 x I/O, and SIO1 serial data output in Dual Output mode. |
| 3 | WP# | input | Write protection input, as described in the datasheet pin description (the protection behavior is detailed in the data protection section, which is not on the supplied pages). |
| 4 | GND | power_in | Ground reference for the device. |
| 5 | SI/SIO0 | bidirectional | Serial data input for 1 x I/O, and serial data input and output (SIO0) in Dual Output mode. |
| 6 | SCLK | input | Clock input for the serial interface. |
| 7 | HOLD# | input | Hold input that pauses the device without deselecting it. |
| 8 | VCC | power_in | +3.3V power supply; DC and AC characteristics are specified for VCC = 2.7V to 3.6V. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MXIC Macronix |
| Package | SOP-8-208mil |
| Category | Memory |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage VCC (read, erase, program) | VCC | 2.7 |  | 3.6 | V | Read, erase and program operations | 5 |
| Input Load Current | ILI | -2 |  | 2 | uA | VCC = VCC Max, VIN = VCC or GND | 34 |
| Output Leakage Current | ILO | -2 |  | 2 | uA | VCC = VCC Max, VOUT = VCC or GND | 34 |
| VCC Standby Current | ISB1 |  | 15 | 25 | uA | VIN = VCC or GND, CS# = VCC | 34 |
| VCC Read Current at 86MHz | ICC1 |  |  | 25 | mA | f=86MHz, fT=80MHz (2 x I/O read), SCLK=0.1VCC/0.9VCC, SO=Open | 34 |
| VCC Program Current (PP) | ICC2 |  | 15 | 20 | mA | Program in Progress, CS# = VCC | 34 |
| VCC Write Status Register Current (WRSR) | ICC3 |  | 3 | 20 | mA | Program status register in progress, CS#=VCC | 34 |
| VCC Sector Erase Current (SE) | ICC4 |  | 9 | 20 | mA | Erase in Progress, CS#=VCC | 34 |
| VCC Chip Erase Current (CE) | ICC5 |  | 15 | 20 | mA | Erase in Progress, CS#=VCC | 34 |
| Input Low Voltage | VIL | -0.5 |  |  | V | Max printed as 0.3VCC (not numeric) | 34 |
| Output Low Voltage | VOL |  |  | 0.4 | V | IOL = 1.6mA | 34 |
| Clock Frequency fSCLK (FAST_READ, PP, SE, BE, CE, DP, RES, RDP, WREN, WRDI, RDID, RDSR, WRSR, RDSFDP) | fSCLK |  |  | 86 | MHz | Printed min is DC | 35 |
| Clock Frequency fTSCLK (DREAD) | fTSCLK |  |  | 80 | MHz | Printed min is DC | 35 |
| Clock Frequency fRSCLK (READ) | fRSCLK |  |  | 33 | MHz | Printed min is DC | 35 |
| Ambient Operating Temperature (Industrial grade) |  | -40 |  | 85 | °C | Industrial grade | 32 |
| Storage Temperature |  | -55 |  | 125 | °C |  | 32 |
| Applied Input Voltage |  | -0.5 |  | 4.6 | V |  | 32 |
| Applied Output Voltage |  | -0.5 |  | 4.6 | V |  | 32 |
| VCC to Ground Potential | VCC | -0.5 |  | 4.6 | V |  | 32 |
| Pin overshoot below Vss |  | -2 |  |  | V | Periods up to 20ns; upper limit printed as Vcc + 2.0V (not numeric) | 32 |
| Input voltage on SO (latch-up table) |  | -1 |  |  | V | Max printed as VCC + 1.0V (not numeric) | 49 |
| Input voltage on power pins, SI, CS# (latch-up table) |  | -1 |  |  | V | Max printed as 2 VCCmax (not numeric) | 49 |
| Latch-up current |  | -100 |  | 100 | mA | Includes all pins except VCC; VCC = 3.0V, one pin at a time | 49 |
| Write Status Register Time (tW) | tW |  | 5 | 40 | ms |  | 49 |
| Byte Program Time (tBP, via page program command) | tBP |  | 9 | 50 | us | Via page program command | 49 |
| Page Program Cycle Time (tPP) | tPP |  | 0.6 | 3 | ms |  | 49 |
| Sector Erase Cycle Time (tSE) | tSE |  | 40 | 200 | ms |  | 49 |
| Block Erase Cycle Time (tBE) | tBE |  | 0.4 | 2 | s |  | 49 |
| Chip Erase Cycle Time (tCE) | tCE |  | 6.5 | 20 | s |  | 49 |
| Erase/Program Cycles |  |  | 100000 |  | cycles | Typical per features list | 5 |

## CAD (KiCad official)

- Symbol: `MX25L1606EM2I-12G`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8-208mil (KiCad packages3D, STEP)
- 3D model files: `mx25l1606em2i-12g-etched.step` / `mx25l1606em2i-12g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mx25l1606em2i-12g.step` / `mx25l1606em2i-12g.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MXIC Macronix datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588884631307358208) (61 pp, sha256 `8efd8bf05545b663`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/mx25l1606em2i-12g-datasheet.pdf)