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MX25L12835FM2I-10G

Public Made by Adom

by adom

MXIC(Macronix) NOR FLASH, SOIC-8-208mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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MX25L12835FM2I-10G

MXIC(Macronix) · NOR FLASH · SOIC-8-208mil

MX25L12835FM2I-10G from MXIC(Macronix), in a SOIC-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CS# input Chip Select input; serial access to the device is enabled by CS#, and the device goes to standby mode when CS# is high and not in operation.
2 SO/SIO1 bidirectional Serial Data Output for 1xI/O, or Serial Data Input & Output for 2xI/O or 4xI/O read mode.
3 WP#/SIO2 bidirectional Write protection input, active low, or Serial Data Input & Output for 4xI/O read mode.
4 GND power_in Ground.
5 SI/SIO0 bidirectional Serial Data Input for 1xI/O, or Serial Data Input & Output for 2xI/O or 4xI/O read mode.
6 SCLK input Clock input for the serial interface.
7 RESET#/SIO3 bidirectional Hardware Reset pin, active low (has internal pull up), or Serial Data Input & Output for 4xI/O read mode.
8 VCC power_in +3V power supply.

Key specifications

Parameter Value
Manufacturer MXIC(Macronix)
Package SOIC-8-208mil
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VCC Power Supply VCC 2.7 3.6 V 92
Ambient Operating Temperature (Industrial) -40 85 °C 85
Storage Temperature -65 150 °C 85
VCC to Ground Potential VCC -0.5 4 V 85
Input Load Current ILI -2 2 uA VCC = VCC Max, VIN = VCC or GND 87
Output Leakage Current ILO -2 2 uA VCC = VCC Max, VOUT = VCC or GND 87
VCC Standby Current ISB1 10 50 uA VIN = VCC or GND, CS# = VCC 87
VCC Read Current ICC1 14 25 mA f=133MHz, (4 x I/O read), SCLK=0.1VCC/0.9VCC, SO=Open 87
VCC Read Current ICC1 20 mA f=104MHz, (4 x I/O read), SCLK=0.1VCC/0.9VCC, SO=Open 87
VCC Read Current ICC1 15 mA f=84MHz, SCLK=0.1VCC/0.9VCC, SO=Open 87
VCC Program Current (PP) ICC2 14 20 mA Program in Progress, CS# = VCC 87
VCC Write Status Register Current ICC3 10 12 mA Program status register in progress, CS#=VCC 87
VCC Sector/Block Erase Current ICC4 14 25 mA Erase in Progress, CS#=VCC 87
VCC Chip Erase Current ICC5 14 25 mA Erase in Progress, CS#=VCC 87
Input Low Voltage VIL -0.5 0.8 V 87
Output Low Voltage VOL 0.2 V IOL = 100uA 87
Input Capacitance CIN 6 pF VIN = 0V, TA = 25°C, f = 1.0 MHz 85
Output Capacitance COUT 8 pF VOUT = 0V, TA = 25°C, f = 1.0 MHz 85
Clock Frequency for all commands (except Read) fSCLK 133 MHz 88
Clock Frequency for READ instructions fRSCLK 50 MHz 88
Clock Frequency for 2READ instructions fTSCLK 84 MHz 88
Clock Frequency for 4READ instructions fQ 84 MHz 88
Clock High Time tCH 3.3 ns Others (fSCLK) 88
Clock Low Time tCL 3.3 ns Others (fSCLK) 88
Data In Setup Time tDVCH 2 ns 88
Data In Hold Time tCHDX 2 ns 88
CS# Deselect Time tSHSL 7 ns Read 88
CS# Deselect Time tSHSL 30 ns Write/Erase/Program 88
Output Disable Time tSHQZ 8 ns 88
Clock Low to Output Valid tCLQV 8 ns Loading: 30pF 88
Clock Low to Output Valid tCLQV 6 ns Loading: 15pF 88
Output Hold Time tCLQX 1 ns 88
Write Status/Configuration Register Cycle Time tW 40 ms 88
Byte-Program Time tBP 16 30 us 88
Page Program Cycle Time tPP 0.5 1.5 ms 88
Sector Erase Cycle Time tSE 30 120 ms 88
Block Erase (32KB) Cycle Time tBE32 150 650 ms 88
Block Erase (64KB) Cycle Time tBE 280 650 ms 88
Chip Erase Cycle Time tCE 50 80 s 88
VCC Rise Time tVR 500000 us/V 90
VCC(min.) to device operation tVSL 800 us 92
Write Inhibit Voltage VWI 1.5 2.5 V 92
VCC voltage to be below for ensuring initialization VPWD 0.9 V 92
Minimum duration for ensuring initialization tPWD 300 us 92

CAD (KiCad official)

  • Symbol: MX25L12835FM2I-10G
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8-208mil (KiCad packages3D, STEP)
  • 3D model files: mx25l12835fm2i-10g-etched.step / mx25l12835fm2i-10g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mx25l12835fm2i-10g.step / mx25l12835fm2i-10g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MXIC(Macronix) datasheet (101 pp, sha256 5a7882a2abdc6296, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF