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MWCT1012VLF

NXP Semicon · Power Management Specialized - PMIC · LQFP-48(7x7)

MWCT1012VLF from NXP Semicon, in a LQFP-48(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 TCK input JTAG test clock input that synchronizes the test logic and shifts serial data to the JTAG/EOnCE port, with an internal pull-up and Schmitt-trigger input for noise immunity.
2 RESET input Active-low hardware reset input that places the device in the reset state when asserted low, with a Schmitt-trigger input and internal reset de-asserted synchronously after a fixed number of clocks.
3 GPIOC0 bidirectional Port C GPIO (default after reset) that can alternately serve as EXTAL, the crystal oscillator input for an external crystal or ceramic resonator, or as external clock input CLKIN0.
4 GPIOC1 bidirectional Port C GPIO (default after reset) that can alternately serve as XTAL, the crystal oscillator output for an external crystal or ceramic resonator.
5 GPIOC2 bidirectional Port C GPIO (default after reset) whose alternates on WCT1012 include SCI0 transmit data TXD0, crossbar input XB_IN2, buffered clock output CLKO0 and quad timer B channel 0 TB0.
6 GPIOC3 bidirectional Port C GPIO (default after reset) whose alternates include quad timer A channel 0 TA0, analog comparator A output CMPA_O, SCI0 receive data RXD0 and external clock input CLKIN1.
7 GPIOC4 bidirectional Port C GPIO (default after reset) whose alternates on WCT1012 include quad timer A channel 1 TA1, analog comparator B output CMPB_O, crossbar input XB_IN8 and external watchdog monitor output EWM_OUT.
8 GPIOA4 bidirectional Port A GPIO (default after reset); the datasheet assigns its analog functions (ANA4, CMPD_IN0, ANC8) only to WCT1011 and WCT1013, so no analog function is stated for WCT1012.
9 GPIOA0 bidirectional Port A GPIO (default after reset) that can alternately serve as ADCA analog input channel 0, analog comparator A input CMPA_IN3, or analog comparator C output CMPC_O.
10 GPIOA1 bidirectional Port A GPIO (default after reset) that can alternately serve as ADCA analog input channel 1 or analog comparator A input CMPA_IN0.
11 GPIOA2 bidirectional Port A GPIO (default after reset) that can alternately serve as ADCA analog input channel 2, ADCA high reference VREFHA (selected by ADC control register) or analog comparator A input CMPA_IN1.
12 GPIOA3 bidirectional Port A GPIO (default after reset) that can alternately serve as ADCA analog input channel 3, ADCA low reference VREFLA (selected by ADC control register) or analog comparator A input CMPA_IN2.
13 GPIOC5 bidirectional Port C GPIO (default after reset) that can alternately serve as the 12-bit DAC output DAC_O or crossbar input XB_IN7.
14 GPIOB4 bidirectional Port B GPIO (default after reset); the datasheet assigns its analog functions (ANB4, CMPC_IN1, ANC12) only to WCT1011 and WCT1013, so no analog function is stated for WCT1012.
15 VDDA power_in Analog power supply pin that supplies 3.3 V to the analog modules and must be connected to a clean analog supply.
16 VSSA power_in Analog ground pin that supplies the analog ground to the analog modules and must be connected to a clean power supply.
17 GPIOB0 bidirectional Port B GPIO (default after reset) that can alternately serve as ADCB analog input channel 0 or analog comparator B input CMPB_IN3.
18 GPIOB1 bidirectional Port B GPIO (default after reset) that can alternately serve as ADCB analog input channel 1 or analog comparator B input CMPB_IN0; the DACB_O function is stated for WCT1011 only.
19 VCAP1 power_out Core voltage regulator output that requires a 2.2 µF or greater bypass capacitor between this pin and VSS for proper device operation.
20 GPIOB2 bidirectional Port B GPIO (default after reset) that can alternately serve as ADCB analog input channel 2, ADCB high reference VREFHB (selected by ADC control register) or analog comparator C input CMPC_IN3.
21 GPIOB3 bidirectional Port B GPIO (default after reset) that can alternately serve as ADCB analog input channel 3, ADCB low reference VREFLB (selected by ADC control register) or analog comparator C input CMPC_IN0.
22 VSS1 power_in I/O ground pin that provides ground to the on-chip digital module.
23 GPIOC6 bidirectional Port C GPIO (default after reset) that can alternately serve as quad timer A channel 2 TA2, crossbar input XB_IN3 or the analog comparator reference input CMP_REF (SS0 is stated for WCT1011 only).
24 GPIOC7 bidirectional Port C GPIO (default after reset) that can alternately serve as SPI0 slave select SS0 or SCI0 transmit data TXD0.
25 GPIOC8 bidirectional Port C GPIO (default after reset) that can alternately serve as SPI0 master-in/slave-out MISO0 (high-impedance when slave not selected), SCI0 receive data RXD0 or crossbar input XB_IN9.
26 GPIOC9 bidirectional Port C GPIO (default after reset) that can alternately serve as SPI0 serial clock SCLK0 or crossbar input XB_IN4.
27 GPIOC10 bidirectional Port C GPIO (default after reset) that can alternately serve as SPI0 master-out/slave-in MOSI0, crossbar input XB_IN5 or SPI0 MISO0.
28 GPIOF0 bidirectional Port F GPIO (default after reset) that can alternately serve as crossbar input XB_IN6, quad timer B channel 2 TB2 (stated for WCT1012 and WCT1013) or SPI1 serial clock SCLK1.
29 GPIOC11 bidirectional Port C GPIO (default after reset) that can alternately serve as CAN transmit CANTX, IIC1 serial clock SCL1 (stated for WCT1012 and WCT1013) or SCI1 transmit data TXD1.
30 GPIOC12 bidirectional Port C GPIO (default after reset) that can alternately serve as CAN receive CANRX, IIC1 serial data SDA1 (stated for WCT1012 and WCT1013) or SCI1 receive data RXD1.
31 VSS2 power_in I/O ground pin that provides ground to the on-chip digital module.
32 VDD2 power_in I/O power pin that supplies 3.3 V to the on-chip digital module.
33 GPIOE0 bidirectional Port E GPIO (default after reset) that can alternately serve as NanoEdge eFlexPWM sub-module 0 output B or input capture B.
34 GPIOE1 bidirectional Port E GPIO (default after reset) that can alternately serve as NanoEdge eFlexPWM sub-module 0 output A or input capture A.
35 GPIOE2 bidirectional Port E GPIO (default after reset) that can alternately serve as NanoEdge eFlexPWM sub-module 1 output B or input capture B.
36 GPIOE3 bidirectional Port E GPIO (default after reset) that can alternately serve as NanoEdge eFlexPWM sub-module 1 output A or input capture A.
37 GPIOC13 bidirectional Port C GPIO (default after reset) that can alternately serve as quad timer A channel 3 TA3, crossbar input XB_IN6 or external watchdog monitor output EWM_OUT.
38 GPIOF1 bidirectional Port F GPIO (default after reset) that can alternately serve as buffered clock output CLKO1, crossbar input XB_IN7 or analog comparator D output CMPD_O.
39 GPIOE4 bidirectional Port E GPIO (default after reset) that can alternately serve as NanoEdge eFlexPWM sub-module 2 output B or input capture B, or crossbar input XB_IN2.
40 GPIOE5 bidirectional Port E GPIO (default after reset) that can alternately serve as NanoEdge eFlexPWM sub-module 2 output A or input capture A, or crossbar input XB_IN3.
41 GPIOC14 bidirectional Port C GPIO (default after reset) that can alternately serve as IIC0 serial data SDA0, crossbar output XB_OUT4 or PWM fault input 4 (stated for WCT1011 only).
42 GPIOC15 bidirectional Port C GPIO (default after reset) that can alternately serve as IIC0 serial clock SCL0, crossbar output XB_OUT5 or PWM fault input 5 (stated for WCT1011 only).
43 VCAP2 power_out Core voltage regulator output that requires a 2.2 µF or greater bypass capacitor between this pin and VSS for proper device operation.
44 VDD3 power_in I/O power pin that supplies 3.3 V to the on-chip digital module.
45 VSS3 power_in I/O ground pin that provides ground to the on-chip digital module.
46 TDO tri_state JTAG/EOnCE test data output that is tri-stateable, provides serial output data, and changes on the falling edge of TCK (default function after reset; GPIOD1 is the alternate).
47 TMS input JTAG test mode select input sampled on the rising edge of TCK with an on-chip pull-up; keep debug capability by tying to VDD through a 2.2 kΩ resistor, otherwise tie directly to VDD.
48 TDI input JTAG test data input that is sampled on the rising edge of TCK and has an on-chip pull-up resistor (default function after reset; GPIOD0 is the alternate).

Key specifications

Parameter Value
Manufacturer NXP Semicon
Package LQFP-48(7x7)
Category Power Management ICs
Pins 48

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage Range VDD -0.3 4 V 4
Analog Supply Voltage Range VDDA -0.3 4 V 4
ADC High Voltage Reference VREFHx -0.3 4 V 4
Voltage difference VDD to VDDA ΔVDD -0.3 0.3 V 4
Voltage difference VSS to VSSA ΔVss -0.3 0.3 V 4
Digital Input Voltage Range VIN -0.3 5.5 V Pin Group 1 4
RESET Input Voltage Range VIN_RESET -0.3 4 V Pin Group 2 4
Oscillator Input Voltage Range VOSC -0.4 4 V Pin Group 4 4
Analog Input Voltage Range VINA -0.3 4 V Pin Group 3 4
Input clamp current, per pin VIC -5 mA VIN < VSS, 0.3 V 4
Output clamp current, per pin VOC -20 20 mA I/O configured as push-pull mode 4
Contiguous pin DC injection current, regional limit (sum of 16 contiguous pins) IIcont -25 25 mA 4
Output Voltage Range (normal push-pull mode) VOUT -0.3 4 V Pin Group 1,2 4
Output Voltage Range (open drain mode) VOUTOD -0.3 5.5 V Pin Group 1 4
Ambient Temperature TA -40 105 °C 4
Storage Temperature Range TSTG -55 150 °C 4
Solder temperature, lead-free TSDR 260 °C 5
ESD for Human Body Model (HBM) -2000 2000 V 5
Supply Voltage VDD, VDDA 2.7 3.3 3.6 V 6
ADC (Cyclic) Reference Voltage High VREFHA, VREFHB 3 V 6
Voltage difference VDD to VDDA ΔVDD -0.1 0 0.1 V 6
Voltage difference VSS to VSSA ΔVss -0.1 0 0.1 V 6
Input Voltage High (digital inputs) VIH 5.5 V Pin Group 1 6
Oscillator Input Voltage High VIHOSC 2 V XTAL driven by an external clock source 6
Oscillator Input Voltage Low VILOSC -0.3 0.8 V 6
Output Source Current High (at VOH min.), low drive strength IOH -2 mA Programmed for low drive strength; Pin Group 1 6
Output Source Current High (at VOH min.), high drive strength IOH -9 mA Programmed for high drive strength; Pin Group 1 6
Output Source Current Low (at VOL max.), low drive strength IOL 2 mA Programmed for low drive strength; Pin Group 1,2 7
Output Source Current Low (at VOL max.), high drive strength IOL 9 mA Programmed for high drive strength; Pin Group 1,2 7
Output Voltage Low VOL 0.5 V IOL = IOLmax 7
Digital Input Current High (pull-up enabled or disabled) IIH -2.5 0 2.5 µA VIN = 2.4 V to 5.5 V; Pin Group 1 7
Comparator Input Current High IIHC -2 0 2 µA VIN = VDDA 7
Comparator Input Current Low IILC -2 0 2 µA VIN = 0V 7
Internal Pull-Up Resistance RPull-Up 20 50 kΩ 7
Internal Pull-Down Resistance RPull-Down 20 50 kΩ 7
Output Current High Impedance State IOZ -1 0 1 µA 7
GPIO pin interrupt pulse width TINT_Pulse 1.5 Bus clock 7
Port rise and fall time (high drive strength), slew disabled TPort_H_DIS 5.5 15.1 ns 2.7 ≤ VDD ≤ 3.6 V 7
Port rise and fall time (high drive strength), slew enabled TPort_H_EN 1.5 6.8 ns 2.7 ≤ VDD ≤ 3.6 V 8
Port rise and fall time (low drive strength), slew disabled TPort_L_DIS 8.2 17.8 ns 2.7 ≤ VDD ≤ 3.6 V 8
Port rise and fall time (low drive strength), slew enabled TPort_L_EN 3.2 9.2 ns 2.7 ≤ VDD ≤ 3.6 V 8
Device (system and core) clock frequency fSYSCLK 0 100 MHz 8
Bus clock fBUS 100 MHz WCT1012 and WCT1013 maximum bus clock (note 10) 8
POR delay from VDD reaching 2.7 V to first instruction executes TPOR 199 225 µs over the operating temperature range 8
STOP mode to RUN mode TS2R 6.79 7.27 µs 8
Minimum RESET Assertion Duration tRA 16 ns 11
Delay from Interrupt Assertion to Fetch of first instruction (exiting STOP mode) tIF 361.3 570.9 ns 11
TCK clock pulse width tPW 50 ns 11
TCK low to TDO data valid tDV 30 ns 11
Frequency of operation (external clock driver) fOSC 50 MHz 12
Clock pulse width tPW 8 ns 12
PLL output frequency fOP_PLL 400 MHz 12
PLL lock time tLock_PLL 35.5 73.2 µs 12
Allowed Duty Cycle of input reference tDC_PLL 40 50 60 % 12
Frequency of operation (external crystal or resonator) fXOSC 4 8 16 MHz 12
8 MHz Output Frequency, RUN mode fROSC_8M 7.84 8 8.16 MHz RUN mode, 0 °C to 105 °C 12
8 MHz Output Frequency, RUN mode fROSC_8M 7.76 8 8.24 MHz RUN mode, -40 °C to 105 °C 12
200 kHz Output Frequency, RUN mode fROSC_200k 194 200 206 kHz RUN mode, -40 °C to 105 °C 12
32 kHz Output Frequency, RUN mode fROSC_32k 30.1 32 33.9 kHz RUN mode, -40 °C to 105 °C 12
Die junction temperature TJ -40 125 °C 22

CAD (KiCad official)

  • Symbol: MWCT1012VLF
  • Footprint: Package_QFP:LQFP-48_7x7mm_P0.5mm
  • 3D model: LQFP-48(7x7) (KiCad packages3D, STEP)
  • 3D model files: mwct1012vlf-etched.step / mwct1012vlf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mwct1012vlf.step / mwct1012vlf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: NXP Semicon datasheet (44 pp, sha256 b65721f2f360c474, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF