# MURS3GB-TP

**MCC(Micro Commercial Components)** · Diodes - Fast Recovery Rectifiers · DO-214AA(SMB)

MURS3GB-TP from MCC(Micro Commercial Components), in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MCC(Micro Commercial Components) |
| Package | DO-214AA(SMB) |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Recurrent Peak Reverse Voltage | VRRM |  |  | 400 | V |  | 1 |
| Maximum RMS Voltage | VRMS |  |  | 280 | V |  | 1 |
| Maximum DC Blocking Voltage | VDC |  |  | 400 | V |  | 1 |
| Average Forward Current | IF(AV) |  |  | 3 | A | TL=110°C | 1 |
| Peak Forward Surge Current | IFSM |  |  | 100 | A | 8.3ms, Half Sine | 1 |
| Maximum Instantaneous Forward Voltage | VF |  | 0.92 | 1 | V | IFM=3.0A; TJ=25°C, pulse test | 1 |
| Maximum DC Reverse Current | IR |  |  | 5 | μA | At rated DC blocking voltage, TJ=25°C | 1 |
| Maximum DC Reverse Current | IR |  |  | 350 | μA | At rated DC blocking voltage, TJ=100°C | 1 |
| Maximum Reverse Recovery Time | TRR |  | 25 | 35 | ns | IF=0.5A; IR=1.0A; Irr=0.25A | 1 |
| Pulse Energy in Avalanche Mode, Non Repetitive | ER |  |  | 25 | mJ | I(BR)R=1A, TJ=25°C | 1 |
| Operating Junction Temperature Range | TJ | -55 |  | 150 | °C |  | 1 |
| Storage Temperature Range | Tstg | -55 |  | 150 | °C |  | 1 |
| Typical Junction Capacitance | CJ |  | 40 |  | pF | Measured at 1.0MHz, VR=4.0V | 1 |
| Typical Thermal Resistance Junction to Lead | RθJL |  | 25 |  | °C/W |  | 1 |
| Typical Thermal Resistance Junction to Ambient | RθJA |  | 35 |  | °C/W |  | 1 |

## CAD (KiCad official)

- Symbol: `MURS3GB-TP`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
- 3D model files: `murs3gb-tp-etched.step` / `murs3gb-tp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `murs3gb-tp.step` / `murs3gb-tp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MCC(Micro Commercial Components) datasheet](docs/murs3gb-tp-datasheet.pdf) (3 pp, sha256 `8a0d9fba67e6abc2`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/murs3gb-tp-datasheet.pdf)