component
MURS360BJ
Public Made by Adomby adom
WeEn Semiconductors Diodes - Fast Recovery Rectifiers, SMB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMURS360BJ
WeEn Semiconductors · Diodes - Fast Recovery Rectifiers · SMB
MURS360BJ from WeEn Semiconductors, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode of the ultrafast power diode, rated for a repetitive peak reverse voltage VRRM of 600 V and average forward current IF(AV) of 3 A (Tlead ≤ 105 °C). |
| 2 | A | passive | Anode of the ultrafast power diode; forward current flows from anode to cathode (pin 1). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | WeEn Semiconductors |
| Package | SMB |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Repetitive peak reverse voltage | VRRM | 600 | V | 3 | |||
| Crest working reverse voltage | VRWM | 600 | V | 3 | |||
| Reverse voltage DC | VR | 600 | V | DC | 3 | ||
| Average forward current | IF(AV) | 3 | A | δ = 0.5; square-wave pulse; Tlead ≤ 105 °C; Fig. 1; Fig. 2; Fig. 3 | 3 | ||
| Repetitive peak forward current | IFRM | 6 | A | δ = 0.5; tp = 25 μs; Tlead ≤ 105 °C; square-wave pulse | 3 | ||
| Non-repetitive peak forward current | IFSM | 100 | A | tp = 10 ms; Tj(init) = 25 °C; sine-wave pulse; Fig. 4 | 3 | ||
| Non-repetitive peak forward current | IFSM | 110 | A | tp = 8.3 ms; Tj(init) = 25 °C; sine-wave pulse | 3 | ||
| Storage temperature | Tstg | -65 | 175 | °C | 3 | ||
| Junction temperature | Tj | 175 | °C | 3 | |||
| Thermal resistance from junction to lead | Rth(j-lead) | 23 | 25 | K/W | mounted on a minimum footprint printed-circuit board (FR4); Fig. 5 | 5 | |
| Thermal resistance from junction to ambient free air | Rth(j-a) | 75 | K/W | mounted on a minimum footprint printed-circuit board (FR4) | 5 | ||
| Forward voltage | VF | 1.3 | V | IF = 3 A; Tj = 25 °C; Fig. 6 | 6 | ||
| Forward voltage | VF | 0.88 | 1.05 | V | IF = 3 A; Tj = 150 °C; Fig. 6 | 6 | |
| Reverse current | IR | 3 | μA | VR = 600 V; Tj = 25 °C | 6 | ||
| Reverse current | IR | 1 | mA | VR = 600 V; Tj = 150 °C | 6 | ||
| Reverse charge | Qr | 122 | nC | IF = 3 A; VR = 400 V; dIF/dt = 200 A/μs; Tj = 25 °C; Fig. 7 | 6 | ||
| Reverse charge | Qr | 199 | nC | IF = 3 A; VR = 400 V; dIF/dt = 200 A/μs; Tj = 125 °C; Fig. 7 | 6 | ||
| Reverse recovery time | trr | 50 | ns | IF = 1 A; VR = 30 V; dIF/dt = 50 A/μs; Tj = 25 °C; Fig. 7 | 6 | ||
| Reverse recovery time (step recovery) | trr | 50 | ns | IF = 0.5 A; IR = 1 A; IR(meas) = 0.25 A; Tj = 25 °C; Step recovery | 6 | ||
| Reverse recovery time | trr | 52 | ns | IF = 3 A; VR = 400 V; dIF/dt = 200 A/μs; Tj = 25 °C; Fig. 7 | 6 | ||
| Reverse recovery time | trr | 65 | ns | IF = 3 A; VR = 400 V; dIF/dt = 200 A/μs; Tj = 125 °C; Fig. 7 | 6 | ||
| Peak reverse recovery current | IRM | 4.7 | A | IF = 3 A; VR = 400 V; dIF/dt = 200 A/μs; Tj = 25 °C; Fig. 7 | 6 | ||
| Peak reverse recovery current | IRM | 6.1 | A | IF = 3 A; VR = 400 V; dIF/dt = 200 A/μs; Tj = 125 °C; Fig. 7 | 6 | ||
| Non-repetitive avalanche energy | Eas | 10.8 | mJ | IR = 1.2 A; Tj(init) = 25 °C; L = 15 mH | 6 |
CAD (KiCad official)
- Symbol:
MURS360BJ - Footprint:
Diode_SMD:D_SMB - 3D model: SMB (KiCad packages3D, STEP)
- 3D model files:
murs360bj-etched.step/murs360bj-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);murs360bj.step/murs360bj.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: WeEn Semiconductors datasheet (10 pp, sha256
af4de9b8f8d0d0f2, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).