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Ray Publish 0.1.0 5bc39f1 13d ago

MURS340T3G

onsemi · Diodes - General Purpose · SMC(DO-214AB)

MURS340T3G from onsemi, in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer onsemi
Package SMC(DO-214AB)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage VRRM 400 V 2
Working Peak Reverse Voltage VRWM 400 V 2
DC Blocking Voltage VR 400 V 2
Average Rectified Forward Current IF(AV) 3 A TL = 130°C 2
Average Rectified Forward Current IF(AV) 4 A TL = 115°C 2
Non-Repetitive Peak Surge Current IFSM 100 A Surge at rated load, halfwave, single phase, 60 Hz 2
Operating Junction Temperature TJ -65 175 °C 2
Maximum Instantaneous Forward Voltage vF 1.25 V iF = 3.0 A, TJ = 25°C 2
Maximum Instantaneous Forward Voltage vF 1.28 V iF = 4.0 A, TJ = 25°C 2
Maximum Instantaneous Forward Voltage vF 1.05 V iF = 3.0 A, TJ = 150°C 2
Maximum Instantaneous Reverse Current iR 10 µA Rated dc Voltage, TJ = 25°C 2
Maximum Instantaneous Reverse Current iR 250 µA Rated dc Voltage, TJ = 150°C 2
Maximum Reverse Recovery Time trr 75 ns iF = 1.0 A, di/dt = 50 A/µs 2
Maximum Reverse Recovery Time trr 50 ns iF = 0.5 A, iR = 1.0 A, IREC to 0.25 A 2
Maximum Forward Recovery Time tfr 50 ns iF = 1.0 A, di/dt = 100 A/µs, recovery to 1.0 V 2
Thermal Resistance, Junction-to-Lead RJL 11 °C/W Junction-to-Lead 2
Typical Peak Reverse Recovery Current IRM 0.8 A IF = 1.0 A, di/dt = 50 A/µs 2

CAD (KiCad official)

  • Symbol: MURS340T3G
  • Footprint: Diode_SMD:D_SMC
  • 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
  • 3D model files: murs340t3g-etched.step / murs340t3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); murs340t3g.step / murs340t3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (6 pp, sha256 73808bfb8193845a, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF