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Contents

README

markdown

MURS320-13-F

Diodes Incorporated · Diodes - General Purpose · SMC(DO-214AB)

MURS320-13-F from Diodes Incorporated, in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SMC(DO-214AB)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage VRRM, VRWM, VR 200 V 2
RMS Reverse Voltage VR(RMS) 140 V 2
Average Rectified Output Current IO 3 A TL = 140°C 2
Non-Repetitive Peak Forward Surge Current IFSM 75 A 8.3ms single half sine-wave superimposed on rated load 2
Forward Voltage VFM 0.875 V IF = 3.0A, TJ = 25°C 2
Forward Voltage VFM 0.71 V IF = 3.0A, TJ = 150°C 2
Peak Reverse Current IRM 5 μA TJ = 25°C, at rated DC blocking voltage (Note 4) 2
Peak Reverse Current IRM 100 μA TJ = 150°C, at rated DC blocking voltage (Note 4) 2
Reverse Recovery Time trr 25 ns IF = 0.5A, IR = 1.0A, Irr = 0.25A (Note 7) 2
Maximum Forward Recovery Time tfr 25 ns IF = 1.0A, di/dt = 100A/μS, recovery to 1.0V (Note 8) 2
Typical Total Capacitance CT 45 pF 1.0MHz, applied reverse voltage 0V DC (Note 5) 2
Typical Thermal Resistance, Junction to Lead RθJL 11 °C/W Unit mounted on PC board with 5.0 mm2 copper pads as heat sink (Note 6) 2
Operating and Storage Temperature Range TJ, TSTG -65 175 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Terminals: Lead Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: MURS320-13-F
  • Footprint: Diode_SMD:D_SMC
  • 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
  • 3D model files: murs320-13-f-etched.step / murs320-13-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); murs320-13-f.step / murs320-13-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 eaec5d21257cc2bd, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF