# MURD10H60

**Changjing** · Fast Recovery / High Efficiency Diodes · TO-252-2L

MURD10H60 from Changjing, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connection; the datasheet lists this pin as NO CONNECTION. |
| 2 | CATHODE | passive | Cathode of the hyperfast rectifier diode, rated for 600 V VRRM and 10 A average forward current at TC=150℃. |
| 3 | ANODE | passive | Anode of the hyperfast rectifier diode, with forward voltage of 1.25 V max at IF=10 A and Tj=25℃. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Changjing |
| Package | TO-252-2L |
| Category | Diodes |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Repetitive Peak Reverse Voltage | VRRM |  |  | 600 | V |  | 1 |
| Average Forward Current | IF(AV) |  |  | 10 | A | TC=150℃ | 1 |
| RMS Forward Current | IF(RMS) |  |  | 14 | A | TC=150℃ | 1 |
| Non-Repetitive Surge Forward Current | IFSM |  |  | 144 | A | 8.3ms | 1 |
| Power dissipation | PD |  |  | 100 | W |  | 1 |
| Thermal Resistance From Junction to Case | RΘJC |  |  | 1.5 | ℃/W |  | 1 |
| Operating Junction Temperature Range | Tj | -55 |  | 175 | ℃ |  | 1 |
| Storage Temperature Range | Tstg | -55 |  | 175 | ℃ |  | 1 |
| Reverse Voltage (breakdown) | V(BR) | 600 |  |  | V | IR=100μA | 2 |
| Reverse Current | IR |  |  | 10 | μA | VR=600V, Tj=25℃ | 2 |
| Reverse Current | IR |  |  | 500 | μA | VR=600V, Tj=150℃ | 2 |
| Forward Voltage | VF |  | 1.25 | 1.6 | V | IF=10A, Tj=25℃ | 2 |

## CAD (KiCad official)

- Symbol: `MURD10H60`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252-2L (KiCad packages3D, STEP)
- 3D model files: `murd10h60-etched.step` / `murd10h60-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `murd10h60.step` / `murd10h60.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Changjing datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8602964494419042304) (6 pp, sha256 `f745062dc584eb9a`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/murd10h60-datasheet.pdf)