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Contents

README

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MURA105T3G

onsemi · Diodes - General Purpose · SMA

MURA105T3G from onsemi, in a SMA. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CATHODE passive Cathode lead, marked by the polarity band on the SMA package; the MURA105 is rated for a 50 V peak repetitive reverse voltage (VRRM) and 1.0 A average forward current at TL = 155°C.
2 ANODE passive Anode lead of the rectifier, per the SMA Style 1 pin assignment (pin 2 is the anode, opposite the polarity band).

Key specifications

Parameter Value
Manufacturer onsemi
Package SMA
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage VRRM 50 V 2
Working Peak Reverse Voltage VRWM 50 V 2
DC Blocking Voltage VR 50 V 2
Average Rectified Forward Current IF(AV) 1 A TL = 155°C 2
Average Rectified Forward Current IF(AV) 2 A TL = 135°C 2
Non-Repetitive Peak Surge Current IFSM 50 A Surge applied at rated load conditions, halfwave, single phase, 60 Hz 2
Operating Junction Temperature Range TJ -65 175 °C 2
Thermal Resistance, Junction-to-Lead PsiJL 24 °C/W Note 2: JEDEC 51, historically RJL 2
Thermal Resistance, Junction-to-Ambient RJA 216 °C/W Note 1: surface mounted on minimum pad size recommended, PC Board FR-4 2
Maximum Instantaneous Forward Voltage vF 0.875 V iF = 1.0 A, TJ = 25°C 2
Maximum Instantaneous Forward Voltage vF 0.66 V iF = 1.0 A, TJ = 150°C 2
Maximum Instantaneous Reverse Current iR 2 A Rated dc voltage, TJ = 25°C 2
Maximum Instantaneous Reverse Current iR 50 A Rated dc voltage, TJ = 150°C 2
Maximum Reverse Recovery Time trr 30 ns iF = 1.0 A, di/dt = 50 A/s 2
Typical Capacitance C 45 pF 0 V (figure note, Figure 5) 4
Maximum Capacitance C 48 pF 0 V (figure note, Figure 6) 4

CAD (KiCad official)

  • Symbol: MURA105T3G
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA (KiCad packages3D, STEP)
  • 3D model files: mura105t3g-etched.step / mura105t3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mura105t3g.step / mura105t3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (6 pp, sha256 6af810e68bbd20b5, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF