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MT25QL128ABA1EW7-0SIT
Public Made by Adomby adom
Micron Tech Pre-ordered Products, DFN-8(5x6). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
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Datasheet
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README
markdownMT25QL128ABA1EW7-0SIT
Micron Tech · Pre-ordered Products · DFN-8(5x6)
MT25QL128ABA1EW7-0SIT from Micron Tech, in a DFN-8(5x6). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S# | input | Chip select: driving S# HIGH puts the device in standby (unless an internal program, erase or write status register cycle is in progress) and tri-states outputs, and driving it LOW enables the device; a falling edge is required before any command after power-up. |
| 2 | DQ1 | bidirectional | Serial I/O bit 1 carrying address, data and command information; it is an output for legacy x1 commands in XIO-SPI and an I/O for dual and quad operation. |
| 3 | W#/DQ2 | bidirectional | Write protect input that freezes the status register when its enable bit is 1 and W# is LOW, and serves as DQ2 I/O in quad modes; it has no internal pull-up, cannot be left floating and must be driven. |
| 4 | VSS | power_in | Core and I/O ground connection. |
| 5 | DQ0 | bidirectional | Serial I/O bit 0 carrying address, data and command information; it is an input for legacy x1 commands in XIO-SPI and an I/O for dual and quad operation. |
| 6 | C | input | Serial clock that times the interface: commands are latched on the rising edge, and in STR address/data are latched on the rising edge with data output on the falling edge, while in DTR both edges are used. |
| 7 | DQ3/HOLD# | bidirectional | Serial I/O bit 3 shared with HOLD# input, which pauses serial communication without deselecting the device (HOLD# is disabled in QIO-SPI mode or DTR operation); DQ3 must be driven HIGH or pulled up during single and dual I/O commands. |
| 8 | VCC | power_in | Core and I/O power supply (2.7-3.6V for the L voltage option). |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Micron Tech |
| Package | DFN-8(5x6) |
| Category | Electronic Tools/Instruments/Consumables |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VCC | 2.7 | 3.6 | V | 81 | ||
| Ambient operating temperature | TA | -40 | 85 | °C | 81 | ||
| Storage temperature | TSTG | -65 | 150 | °C | 81 | ||
| Supply voltage | VCC | -0.6 | 4 | V | 81 | ||
| Electrostatic discharge voltage (HBM) | VESD | -2000 | 2000 | V | 81 | ||
| Input/output capacitance (DQ0/DQ1/DQ2/DQ3) | CIN/OUT | 10 | pF | 81 | |||
| Input capacitance (other pins) | CIN | 6 | pF | 81 | |||
| Input/Chip select capacitance | CIN/S# | 10 | pF | 81 | |||
| Load capacitance | CL | 30 | pF | 82 | |||
| Input rise and fall times | 1.5 | ns | 82 | ||||
| Input leakage current | ILI | -2 | 2 | µA | 83 | ||
| Output leakage current | ILO | -2 | 2 | µA | 83 | ||
| Standby current (IT range) | ICC1 | 15 | 50 | µA | S# = VCC, VIN = VSS or VCC | 83 | |
| Deep power-down current (IT range) | ICC2 | 5 | 30 | µA | S# = VCC, VIN = VSS or VCC | 83 | |
| Operating current (fast-read extended I/O) | ICC3 | 16 | mA | C = 0.1VCC/0.9VCC at 133 MHz, DQ1 = open | 83 | ||
| Operating current (fast-read extended I/O) | ICC3 | 8 | mA | C = 0.1VCC/0.9VCC at 54 MHz, DQ1 = open | 83 | ||
| Operating current (fast-read dual I/O) | ICC3 | 20 | mA | C = 0.1VCC/0.9VCC at 133 MHz, DQ1 = open | 83 | ||
| Operating current (fast-read quad I/O) | ICC3 | 22 | mA | C = 0.1VCC/0.9VCC at 133 MHz, DQ1 = open | 83 | ||
| Operating current (fast-read quad I/O DTR) | ICC3 | 28 | mA | C = 0.1VCC / 0.9VCC at 80 MHz DTR, DQ=open | 83 | ||
| Operating current (fast-read quad I/O DTR) | ICC3 | 31 | mA | C = 0.1VCC / 0.9VCC at 90 MHz DTR, DQ=open | 83 | ||
| Operating current (PROGRAM operations) | ICC4 | 35 | mA | S# = VCC | 83 | ||
| Operating current (WRITE operations) | ICC5 | 35 | mA | S# = VCC | 83 | ||
| Operating current (erase) | ICC6 | 35 | mA | S# = VCC | 83 | ||
| Output low voltage | VOL | 0.4 | V | IOL = 1.6mA | 84 | ||
| Clock frequency, all commands other than READ (STR) | fC | 133 | MHz | STR | 85 | ||
| Clock frequency, all commands other than READ (DTR) | fC | 90 | MHz | DTR | 85 | ||
| Clock frequency for READ command (03h) (STR) | fR | 54 | MHz | STR | 85 | ||
| Clock frequency for READ command (03h) (DTR) | fR | 27 | MHz | DTR | 85 | ||
| Clock HIGH time (STR) | tCH | 3.375 | ns | STR | 85 | ||
| Clock HIGH time (DTR) | tCH | 5 | ns | DTR | 85 | ||
| Clock LOW time (STR) | tCL | 3.375 | ns | STR | 85 | ||
| Clock LOW time (DTR) | tCL | 5 | ns | DTR | 85 | ||
| S# active setup time | tSLCH | 3.375 | ns | STR/DTR | 85 | ||
| S# not active hold time | tCHSL | 3.375 | ns | STR/DTR | 85 | ||
| Data in setup time (STR) | tDVCH | 1.75 | ns | STR | 85 | ||
| Data in hold time | tCHDX | 2.3 | ns | STR/DTR | 85 | ||
| S# deselect time after a READ command | tSHSL1 | 20 | ns | STR/DTR | 85 | ||
| S# deselect time after a nonREAD command | tSHSL2 | 50 | ns | STR/DTR | 85 | ||
| Output disable time | tSHQZ | 7 | ns | STR/DTR | 85 | ||
| Clock LOW to output valid under 30pF | tCLQV | 6 | ns | STR/DTR | 85 | ||
| Clock LOW to output valid under 10pF | tCLQV | 5 | ns | STR/DTR | 85 | ||
| Output hold time | tCLQX | 1.5 | ns | STR/DTR | 85 | ||
| Write protect setup time | tWHSL | 20 | ns | STR/DTR | 86 | ||
| Write protect hold time | tSHWL | 100 | ns | STR/DTR | 86 | ||
| S# HIGH to deep power-down | tDP | 3 | µs | STR/DTR | 86 | ||
| S# HIGH to standby mode (DPD exit time) | tRDP | 30 | µs | STR/DTR | 86 | ||
| WRITE STATUS REGISTER cycle time | tW | 1.3 | 8 | ms | STR/DTR | 86 | |
| WRITE NONVOLATILE CONFIGURATION REGISTER cycle time | tWNVCR | 0.2 | 1 | s | STR/DTR | 86 | |
| Page program time (256 bytes) | tPP | 120 | 1800 | µs | STR/DTR | 86 | |
| PROGRAM OTP cycle time (64 bytes) | tPOTP | 0.12 | 0.8 | ms | STR/DTR | 86 | |
| Sector erase time | tSE | 0.15 | 1 | s | STR/DTR | 86 | |
| 4KB subsector erase time | tSSE | 0.05 | 0.4 | s | STR/DTR | 86 | |
| 32KB subsector erase time | tSSE | 0.1 | 1 | s | STR/DTR | 86 | |
| 128Mb bulk erase time | tBE | 38 | 114 | s | STR/DTR | 86 | |
| Reset pulse width | tRLRH | 50 | ns | 87 | |||
| Suspend latency (Program) | 7 | 25 | µs | Program | 91 | ||
| Suspend latency (Subsector erase) | 15 | 30 | µs | Subsector erase | 91 | ||
| Suspend latency (Erase) | 15 | 30 | µs | Erase | 91 |
CAD (KiCad official)
- Symbol:
MT25QL128ABA1EW7-0SIT - Footprint:
Package_DFN_QFN:DFN-S-8-1EP_6x5mm_P1.27mm - 3D model: DFN-8(5x6) (KiCad packages3D, STEP)
- 3D model files:
mt25ql128aba1ew7-0sit-etched.step/mt25ql128aba1ew7-0sit-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mt25ql128aba1ew7-0sit.step/mt25ql128aba1ew7-0sit.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Micron Tech datasheet (93 pp, sha256
1cbf328ecd1ee6f0, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).