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Ray Publish 0.1.0 9d2d408 17d ago

MSRV05-4

MSKSEMI · ESD And Surge Protection (TVS/ESD) · SOT-23-6

MSRV05-4 from MSKSEMI, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IO1 bidirectional Connect to I/O line; the device protects 4 unidirectional lines with a 5 V working voltage (VRWM).
2 GND power_in Connect to GND; this is the reference for the ESD/transient clamping paths.
3 IO2 bidirectional Connect to I/O line; the device protects 4 unidirectional lines with a 5 V working voltage (VRWM).
4 IO3 bidirectional Connect to I/O line; the device protects 4 unidirectional lines with a 5 V working voltage (VRWM).
5 Vcc power_in Connect to Vcc, the supply pin of the protected interface.
6 IO4 bidirectional Connect to I/O line; the device protects 4 unidirectional lines with a 5 V working voltage (VRWM).

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package SOT-23-6
Category Circuit Protection
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak pulse power (tp=8/20us)@25℃ Ppk 60 W tp=8/20us @25℃ 3
Peak pulse current (tp=8/20us)@25℃ IPP 4.5 A tp=8/20us @25℃ 3
ESD (IEC61000-4-2 air discharge) @25℃ VESD -17 17 kV IEC61000-4-2 air discharge @25℃ 3
ESD (IEC61000-4-2 contact discharge) @25℃ VESD -12 12 kV IEC61000-4-2 contact discharge @25℃ 3
Junction temperature TJ 150 ℃ 3
Operating temperature TOP -40 125 ℃ Over operating free-air temperature range 3
Storage temperature TSTG -55 150 ℃ 3
Lead temperature TL 260 ℃ 3
Reverse Stand-off Voltage VRWM 5 V 3
Reverse Breakdown Voltage VBR 6 V IT=1mA 3
Reverse Leakage Current IR 1 uA VRWM=5V 3
Clamping Voltage VC 9 V IPP=1A; tp=8/20us 3
Clamping Voltage VC 12 V IPP=4.5A; tp=8/20us 3
Junction Capacitance (I/O to GND) CJ 0.6 0.8 pF I/O to GND; VR=0V; f=1MHz 3
Junction Capacitance (between I/O) CJ 0.3 0.4 pF Between I/O; VR=0V; f=1MHz 3

CAD (KiCad official)

  • Symbol: MSRV05-4
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: msrv05-4-etched.step / msrv05-4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); msrv05-4.step / msrv05-4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (6 pp, sha256 e33cd7cd048905ac, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF