component
MSPM0L1227SRHBR
Public Made by Adomby adom
Texas Instruments , VQFN-32(5x5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
MSPM0L1227SRHBR
Texas Instruments · IC · VQFN-32(5x5)
MSPM0L1227SRHBR from Texas Instruments, in a VQFN-32(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PA0 | bidirectional | 5V-tolerant open-drain GPIO (ODIO) with UART0_TX, I2C0_SDA, TIMA0_C0, FCC_IN, BSLSDA and WAKE functions; needs a pullup for output high. |
| 2 | PA1 | bidirectional | 5V-tolerant open-drain GPIO (ODIO) with UART0_RX, I2C0_SCL, TIMA0_C1, SPI0_CS3, BSLSCL and WAKE functions; needs a pullup for output high. |
| 3 | NRST | input | Active-low reset input that must be pulled high (47kΩ pullup with 10nF capacitor recommended) or the device will not start. |
| 4 | VBAT,VDD | power_in | Supply pin for 1.62V to 3.6V, with VBAT internally shorted to VDD on the 32-pin package; recommended 10µF and 0.1µF low-ESR decoupling to VSS. |
| 5 | VSS | power_in | Ground reference for the device. |
| 6 | PA2 | bidirectional | Standard-drive GPIO with SPI0_CS0, SPI1_CS0, TIMA0 and UART4_CTS functions, and ROSC analog function for the external 100kΩ SYSOSC resistor. |
| 7 | PA3 | bidirectional | LFSSIO GPIO with SPI0_CS1, I2C1_SDA, UART2_CTS, UART1_TX functions and LFXIN analog function for the 32kHz crystal. |
| 8 | PA4 | bidirectional | LFSSIO GPIO with SPI0_POCI, I2C1_SCL, UART1_RX, LFCLK_IN functions and LFXOUT analog function for the 32kHz crystal. |
| 9 | PA5 | bidirectional | Standard-drive GPIO with SPI0_PICO, I2C1_SDA, UART0_CTS, UART1_TX functions and HFXIN analog function for the HF crystal. |
| 10 | PA6 | bidirectional | Standard-drive GPIO with SPI0_SCK, I2C1_SCL, UART0_RTS, UART1_RX, HFCLK_IN functions and HFXOUT analog function for the HF crystal. |
| 11 | PA7 | bidirectional | LFSSIO GPIO with COMP0_OUT, CLK_OUT, SPI0_CS2, SPI0_POCI and TIMx functions, plus TIO0 tamper input. |
| 12 | PA8 | bidirectional | Standard-drive GPIO with UART1_TX, SPI0_CS0, I2C0_SDA, HFCLK_IN, UART0_RTS functions and LCD0 analog function. |
| 13 | PA9 | bidirectional | Standard-drive GPIO with UART1_RX, SPI0_PICO, I2C0_SCL, CLK_OUT, RTC_OUT functions and LCD1 analog function. |
| 14 | PA10 | bidirectional | High-drive GPIO with UART0_TX, SPI0_POCI, I2C0_SDA, CLK_OUT functions, BSLTX, WAKE input and LCD2 analog function. |
| 15 | PA11 | bidirectional | High-drive GPIO with UART0_RX, SPI0_SCK, I2C0_SCL, COMP0_OUT functions, BSLRX, WAKE input and LCD3 analog function. |
| 16 | PA12 | bidirectional | Standard-drive GPIO with UART3_CTS, SPI0_SCK, COMP0_OUT, FCC_IN functions and analog A_18. |
| 17 | PA13 | bidirectional | Standard-drive GPIO with UART3_RTS, SPI0_POCI, UART3_RX, RTC_OUT functions and analog A_17 and COMP0_IN2-. |
| 18 | PA14 | bidirectional | Standard-drive GPIO with UART0_CTS, SPI0_PICO, UART3_TX, CLK_OUT functions and analog A_16 and COMP0_IN2+. |
| 19 | PA15 | bidirectional | Standard-drive GPIO with UART0_RTS, I2C1_SCL, I2C2_SCL functions and analog A_15 and COMP0_IN3+. |
| 20 | PA16 | bidirectional | Standard-drive GPIO with COMP0_OUT, SPI1_POCI, I2C1_SDA, I2C2_SDA, FCC_IN functions and analog A_14. |
| 21 | PA17 | bidirectional | Standard-drive GPIO with wake, UART1_TX, SPI1_SCK, I2C1_SCL functions, WAKE and analog A_13 and COMP0_IN1-. |
| 22 | PA18 | bidirectional | Standard-drive GPIO with wake, UART1_RX, SPI1_PICO, I2C1_SDA functions, BSL_invoke, WAKE and analog A_12 and COMP0_IN1+. |
| 23 | PA19 | bidirectional | Standard-drive GPIO that carries the SWDIO serial wire debug data signal, with SPI1_POCI and I2C1_SDA functions. |
| 24 | PA20 | bidirectional | Standard-drive GPIO that carries the SWCLK serial wire debug clock input, with SPI1_SCK and I2C1_SCL functions. |
| 25 | PA21 | bidirectional | Standard-drive GPIO with UART2_TX, SPI0_CS3, UART1_CTS functions and analog A_8 and VREF- external reference input. |
| 26 | PA22 | bidirectional | Standard-drive GPIO with UART2_RX, SPI0_CS2, UART1_RTS, CLK_OUT, I2C0_SCL functions and analog A_7. |
| 27 | PA23 | bidirectional | Standard-drive GPIO with UART2_TX, SPI0_CS3, I2C2_SCL functions and analog VREF+ external reference input. |
| 28 | PA24 | bidirectional | Standard-drive GPIO with UART2_RX, SPI0_CS2, I2C2_SDA functions and analog A_3. |
| 29 | PA25 | bidirectional | Standard-drive GPIO with UART3_RX, SPI1_CS3, COMP0_OUT functions and analog A_2. |
| 30 | PA26 | bidirectional | Standard-drive GPIO with UART3_TX, SPI1_CS0, UART2_RTS functions and analog A_1 and COMP0_IN0+. |
| 31 | PA27 | bidirectional | Standard-drive GPIO with UART3_RX, SPI1_CS1, CLK_OUT, RTC_OUT, COMP0_OUT functions and analog A_0 and COMP0_IN0-. |
| 32 | VCORE | power_out | Internal core regulator output that must only connect to a 470nF (0.47µF) capacitor to VSS, with no external voltage or load applied. |
| 33 | Thermal Pad | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-32(5x5) |
| Category | |
| Pins | 33 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VDD | -0.3 | 4.1 | V | At VDD pin | 42 | |
| Battery backup supply | VBAT | -0.3 | 4.1 | V | At VBAT pin, with respect to VSS | 42 | |
| Input voltage, 5-V tolerant open-drain pins | VI | -0.3 | 5.5 | V | Applied to any 5-V tolerant open-drain pins | 42 | |
| Input voltage, common pins | VI | -0.3 | V | Applied to any common tolerance pins; max printed as VDD + 0.3 (4.1 MAX) | 42 | ||
| Current of VDD pin | IVDD | 80 | mA | Current into VDD pin (source), VDD >= 2.7V | 42 | ||
| Current of VBAT pin | IVBAT | 20 | mA | Current into VBAT pin (source), VBAT >= 2.7V | 42 | ||
| Current of VSS pin | IVSS | 80 | mA | Current out of VSS pin (sink), VDD, VBAT>=2.7V | 42 | ||
| Current of SD IO pin | IIO | 6 | mA | Current sunk or sourced by SD IO pin, VDD>=2.7V | 42 | ||
| Current of HS IO pin | IIO | 6 | mA | Current sunk or sourced by HS IO pin, VDD >=2.7V | 42 | ||
| Current of HD IO pin | IIO | 20 | mA | Current sunk or sourced by HD IO pin | 42 | ||
| Current of OD IO pin | IIO | 20 | mA | Current sunk by OD IO pin | 42 | ||
| Supported diode current, LCD pin | ID | -2 | 0.4 | mA | Diode current on pin supporting LCD function | 42 | |
| Supported diode current, non-LCD pin | ID | -2 | 0.05 | mA | Diode current on pin not supporting LCD function (excluding Open Drain IO) | 42 | |
| Junction temperature | TJ | -40 | 130 | °C | 42 | ||
| Storage temperature | Tstg | -40 | 150 | °C | 42 | ||
| ESD HBM | V(ESD) | -2000 | 2000 | V | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins | 42 | |
| ESD CDM | V(ESD) | -500 | 500 | V | Charged device model (CDM), per JEDEC specification JESD22-C101, all pins | 42 | |
| Supply voltage | VDD | 1.62 | 3.6 | V | 42 | ||
| VBAT supply voltage | VBAT | 1.62 | 3.6 | V | At VBAT pin, with respect to VSS | 42 | |
| Voltage on VCORE pin | VCORE | 1.35 | V | Voltage on VCORE pin | 42 | ||
| VDD capacitor | CVDD | 10 | uF | Capacitor connected between VDD and VSS | 42 | ||
| VBAT capacitor | CVBAT | 1 | µF | Capacitor connected between VBAT and VSS | 42 | ||
| VCORE capacitor | CVCORE | 470 | nF | Capacitor connected between VCORE and VSS | 42 | ||
| Ambient temperature | TA | -40 | 125 | °C | 42 | ||
| Max junction temperature | TJ | 130 | °C | 42 | |||
| MCLK frequency, 1 flash wait state | fMCLK | 32 | MHz | MCLK, CPUCLK, ULPCLK frequency with 1 flash wait state | 43 | ||
| MCLK frequency, 0 flash wait states | fMCLK | 24 | MHz | MCLK, CPUCLK, ULPCLK frequency with 0 flash wait states | 43 | ||
| Junction-to-ambient thermal resistance | RθJA | 32.1 | °C/W | VQFN-32 (RHB) | 43 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 23.6 | °C/W | VQFN-32 (RHB) | 43 | ||
| Junction-to-board thermal resistance | RθJB | 13 | °C/W | VQFN-32 (RHB) | 43 | ||
| Junction-to-top characterization parameter | ΨJT | 0.3 | °C/W | VQFN-32 (RHB) | 43 | ||
| Junction-to-board characterization parameter | ΨJB | 13 | °C/W | VQFN-32 (RHB) | 43 | ||
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | 3.3 | °C/W | VQFN-32 (RHB) | 43 | ||
| Power-on reset level, rising | VPOR+ | 0.95 | 1.3 | 1.56 | V | Rising | 47 |
| Power-on reset level, falling | VPOR- | 0.9 | 1.25 | 1.53 | V | Falling | 47 |
| POR hysteresis | VHYS, POR | 25 | 45 | 70 | mV | 47 | |
| BOR0 level, cold start rising | VBOR0+, COLD | 1.48 | 1.54 | 1.61 | V | Cold start, rising | 47 |
| BOR0 level, rising | VBOR0+ | 1.56 | 1.59 | 1.62 | V | Rising | 47 |
| BOR0 level, falling | VBOR0- | 1.55 | 1.58 | 1.61 | V | Falling | 47 |
| BOR1 level, rising | VBOR1+ | 2.13 | 2.17 | 2.21 | V | Rising | 47 |
| BOR2 level, rising | VBOR2+ | 2.73 | 2.77 | 2.82 | V | Rising | 47 |
| BOR3 level, rising | VBOR3+ | 2.88 | 2.96 | 3.04 | V | Rising | 47 |
| Internal switch resistance between VBAT and VDD | Rswitch | 0.9 | 1.4 | 2.7 | kΩ | 48 | |
| Flash program and erase supply voltage | VDDPGM/ERASE | 1.62 | 3.6 | V | 48 | ||
| Flash word program time | tPROG (WORD, 64) | 50 | 275 | µs | 48 | ||
| Sector erase time | tERASE (SEC) | 20 | 200 | ms | <10k erase/program cycles | 48 | |
| SYSOSC accuracy, FCL on, 25 °C | fSYSOSC | -0.41 | 0.58 | % | SETUSEFCL=1, Ta = 25 ℃ | 50 | |
| SYSOSC accuracy, FCL on, internal ROSC | fSYSOSC | -2 | 1.4 | % | SETUSEFCL=1 -40 ℃ ≤ Ta ≤ 125 ℃ | 50 | |
| LFOSC accuracy | -5 | 5 | % | -40 ℃ ≤ Ta ≤ 125 ℃ | 50 | ||
| High level input voltage ODIO | VIH | 2 | 5.5 | V | ODIO, VDD≥2.7V | 52 | |
| Low level input voltage ODIO | VIL | -0.3 | 0.8 | V | ODIO, VDD≥2.7V | 52 | |
| High-Z leakage current non-LCD pins | Ilkg | 50 | nA | SDIO | 52 | ||
| Low level output voltage SDIO | VOL | 0.4 | V | SDIO, VDD≥2.7V, /IIO/,max=6mA; VDD≥1.71V, /IIO/,max=2mA; Tj≤85 °C | 53 | ||
| ADC analog input range | Vin(ADC) | 0 | V | Applies to all ADC analog input pins; max printed VDD | 54 | ||
| ADC operating supply current | I(ADC) | 460 | 600 | μA | FS = 1.68MSPS, Internal reference OFF, VR+ = VDD | 54 | |
| ADC INL | Ej | -2 | 2 | LSB | External reference | 55 | |
| ADC DNL | Ek | -1 | 1 | LSB | External reference | 55 | |
| ADC offset error | EO | -3.5 | 3.5 | mV | External reference | 55 | |
| ADC gain error | EG | -4 | 4 | LSB | External reference | 55 | |
| VREF output voltage 2.5V | VREF | 2.46 | 2.5 | 2.54 | V | BUFCONFIG = 0 | 58 |
| VREF output voltage 1.4V | VREF | 1.38 | 1.4 | 1.42 | V | BUFCONFIG = 1 | 58 |
| VREF temperature coefficient | TCVREF | 75 | ppm/°C | BUFCONFIG = {0, 1} | 57 | ||
| Comparator input offset voltage | Voffset | -20 | 20 | mV | 58 | ||
| Temperature sensor temperature coefficient | TSc | -1.9 | -1.8 | -1.7 | mV/℃ | -40℃ ≤ Tj ≤ 130℃ | 55 |
CAD (KiCad official)
- Symbol:
MSPM0L1227SRHBR - Footprint:
Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm - 3D model: VQFN-32(5x5) (KiCad packages3D, STEP)
- 3D model files:
mspm0l1227srhbr-etched.step/mspm0l1227srhbr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mspm0l1227srhbr.step/mspm0l1227srhbr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (134 pp, sha256
ec3945476714eea7, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# MSPM0L1227SRHBR
**Texas Instruments** · IC · VQFN-32(5x5)
MSPM0L1227SRHBR from Texas Instruments, in a VQFN-32(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PA0 | bidirectional | 5V-tolerant open-drain GPIO (ODIO) with UART0_TX, I2C0_SDA, TIMA0_C0, FCC_IN, BSLSDA and WAKE functions; needs a pullup for output high. |
| 2 | PA1 | bidirectional | 5V-tolerant open-drain GPIO (ODIO) with UART0_RX, I2C0_SCL, TIMA0_C1, SPI0_CS3, BSLSCL and WAKE functions; needs a pullup for output high. |
| 3 | NRST | input | Active-low reset input that must be pulled high (47kΩ pullup with 10nF capacitor recommended) or the device will not start. |
| 4 | VBAT,VDD | power_in | Supply pin for 1.62V to 3.6V, with VBAT internally shorted to VDD on the 32-pin package; recommended 10µF and 0.1µF low-ESR decoupling to VSS. |
| 5 | VSS | power_in | Ground reference for the device. |
| 6 | PA2 | bidirectional | Standard-drive GPIO with SPI0_CS0, SPI1_CS0, TIMA0 and UART4_CTS functions, and ROSC analog function for the external 100kΩ SYSOSC resistor. |
| 7 | PA3 | bidirectional | LFSSIO GPIO with SPI0_CS1, I2C1_SDA, UART2_CTS, UART1_TX functions and LFXIN analog function for the 32kHz crystal. |
| 8 | PA4 | bidirectional | LFSSIO GPIO with SPI0_POCI, I2C1_SCL, UART1_RX, LFCLK_IN functions and LFXOUT analog function for the 32kHz crystal. |
| 9 | PA5 | bidirectional | Standard-drive GPIO with SPI0_PICO, I2C1_SDA, UART0_CTS, UART1_TX functions and HFXIN analog function for the HF crystal. |
| 10 | PA6 | bidirectional | Standard-drive GPIO with SPI0_SCK, I2C1_SCL, UART0_RTS, UART1_RX, HFCLK_IN functions and HFXOUT analog function for the HF crystal. |
| 11 | PA7 | bidirectional | LFSSIO GPIO with COMP0_OUT, CLK_OUT, SPI0_CS2, SPI0_POCI and TIMx functions, plus TIO0 tamper input. |
| 12 | PA8 | bidirectional | Standard-drive GPIO with UART1_TX, SPI0_CS0, I2C0_SDA, HFCLK_IN, UART0_RTS functions and LCD0 analog function. |
| 13 | PA9 | bidirectional | Standard-drive GPIO with UART1_RX, SPI0_PICO, I2C0_SCL, CLK_OUT, RTC_OUT functions and LCD1 analog function. |
| 14 | PA10 | bidirectional | High-drive GPIO with UART0_TX, SPI0_POCI, I2C0_SDA, CLK_OUT functions, BSLTX, WAKE input and LCD2 analog function. |
| 15 | PA11 | bidirectional | High-drive GPIO with UART0_RX, SPI0_SCK, I2C0_SCL, COMP0_OUT functions, BSLRX, WAKE input and LCD3 analog function. |
| 16 | PA12 | bidirectional | Standard-drive GPIO with UART3_CTS, SPI0_SCK, COMP0_OUT, FCC_IN functions and analog A_18. |
| 17 | PA13 | bidirectional | Standard-drive GPIO with UART3_RTS, SPI0_POCI, UART3_RX, RTC_OUT functions and analog A_17 and COMP0_IN2-. |
| 18 | PA14 | bidirectional | Standard-drive GPIO with UART0_CTS, SPI0_PICO, UART3_TX, CLK_OUT functions and analog A_16 and COMP0_IN2+. |
| 19 | PA15 | bidirectional | Standard-drive GPIO with UART0_RTS, I2C1_SCL, I2C2_SCL functions and analog A_15 and COMP0_IN3+. |
| 20 | PA16 | bidirectional | Standard-drive GPIO with COMP0_OUT, SPI1_POCI, I2C1_SDA, I2C2_SDA, FCC_IN functions and analog A_14. |
| 21 | PA17 | bidirectional | Standard-drive GPIO with wake, UART1_TX, SPI1_SCK, I2C1_SCL functions, WAKE and analog A_13 and COMP0_IN1-. |
| 22 | PA18 | bidirectional | Standard-drive GPIO with wake, UART1_RX, SPI1_PICO, I2C1_SDA functions, BSL_invoke, WAKE and analog A_12 and COMP0_IN1+. |
| 23 | PA19 | bidirectional | Standard-drive GPIO that carries the SWDIO serial wire debug data signal, with SPI1_POCI and I2C1_SDA functions. |
| 24 | PA20 | bidirectional | Standard-drive GPIO that carries the SWCLK serial wire debug clock input, with SPI1_SCK and I2C1_SCL functions. |
| 25 | PA21 | bidirectional | Standard-drive GPIO with UART2_TX, SPI0_CS3, UART1_CTS functions and analog A_8 and VREF- external reference input. |
| 26 | PA22 | bidirectional | Standard-drive GPIO with UART2_RX, SPI0_CS2, UART1_RTS, CLK_OUT, I2C0_SCL functions and analog A_7. |
| 27 | PA23 | bidirectional | Standard-drive GPIO with UART2_TX, SPI0_CS3, I2C2_SCL functions and analog VREF+ external reference input. |
| 28 | PA24 | bidirectional | Standard-drive GPIO with UART2_RX, SPI0_CS2, I2C2_SDA functions and analog A_3. |
| 29 | PA25 | bidirectional | Standard-drive GPIO with UART3_RX, SPI1_CS3, COMP0_OUT functions and analog A_2. |
| 30 | PA26 | bidirectional | Standard-drive GPIO with UART3_TX, SPI1_CS0, UART2_RTS functions and analog A_1 and COMP0_IN0+. |
| 31 | PA27 | bidirectional | Standard-drive GPIO with UART3_RX, SPI1_CS1, CLK_OUT, RTC_OUT, COMP0_OUT functions and analog A_0 and COMP0_IN0-. |
| 32 | VCORE | power_out | Internal core regulator output that must only connect to a 470nF (0.47µF) capacitor to VSS, with no external voltage or load applied. |
| 33 | Thermal Pad | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-32(5x5) |
| Category | |
| Pins | 33 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VDD | -0.3 | | 4.1 | V | At VDD pin | 42 |
| Battery backup supply | VBAT | -0.3 | | 4.1 | V | At VBAT pin, with respect to VSS | 42 |
| Input voltage, 5-V tolerant open-drain pins | VI | -0.3 | | 5.5 | V | Applied to any 5-V tolerant open-drain pins | 42 |
| Input voltage, common pins | VI | -0.3 | | | V | Applied to any common tolerance pins; max printed as VDD + 0.3 (4.1 MAX) | 42 |
| Current of VDD pin | IVDD | | | 80 | mA | Current into VDD pin (source), VDD >= 2.7V | 42 |
| Current of VBAT pin | IVBAT | | | 20 | mA | Current into VBAT pin (source), VBAT >= 2.7V | 42 |
| Current of VSS pin | IVSS | | | 80 | mA | Current out of VSS pin (sink), VDD, VBAT>=2.7V | 42 |
| Current of SD IO pin | IIO | | | 6 | mA | Current sunk or sourced by SD IO pin, VDD>=2.7V | 42 |
| Current of HS IO pin | IIO | | | 6 | mA | Current sunk or sourced by HS IO pin, VDD >=2.7V | 42 |
| Current of HD IO pin | IIO | | | 20 | mA | Current sunk or sourced by HD IO pin | 42 |
| Current of OD IO pin | IIO | | | 20 | mA | Current sunk by OD IO pin | 42 |
| Supported diode current, LCD pin | ID | -2 | | 0.4 | mA | Diode current on pin supporting LCD function | 42 |
| Supported diode current, non-LCD pin | ID | -2 | | 0.05 | mA | Diode current on pin not supporting LCD function (excluding Open Drain IO) | 42 |
| Junction temperature | TJ | -40 | | 130 | °C | | 42 |
| Storage temperature | Tstg | -40 | | 150 | °C | | 42 |
| ESD HBM | V(ESD) | -2000 | | 2000 | V | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins | 42 |
| ESD CDM | V(ESD) | -500 | | 500 | V | Charged device model (CDM), per JEDEC specification JESD22-C101, all pins | 42 |
| Supply voltage | VDD | 1.62 | | 3.6 | V | | 42 |
| VBAT supply voltage | VBAT | 1.62 | | 3.6 | V | At VBAT pin, with respect to VSS | 42 |
| Voltage on VCORE pin | VCORE | | 1.35 | | V | Voltage on VCORE pin | 42 |
| VDD capacitor | CVDD | 10 | | | uF | Capacitor connected between VDD and VSS | 42 |
| VBAT capacitor | CVBAT | 1 | | | µF | Capacitor connected between VBAT and VSS | 42 |
| VCORE capacitor | CVCORE | 470 | | | nF | Capacitor connected between VCORE and VSS | 42 |
| Ambient temperature | TA | -40 | | 125 | °C | | 42 |
| Max junction temperature | TJ | | | 130 | °C | | 42 |
| MCLK frequency, 1 flash wait state | fMCLK | | | 32 | MHz | MCLK, CPUCLK, ULPCLK frequency with 1 flash wait state | 43 |
| MCLK frequency, 0 flash wait states | fMCLK | | | 24 | MHz | MCLK, CPUCLK, ULPCLK frequency with 0 flash wait states | 43 |
| Junction-to-ambient thermal resistance | RθJA | | 32.1 | | °C/W | VQFN-32 (RHB) | 43 |
| Junction-to-case (top) thermal resistance | RθJC(top) | | 23.6 | | °C/W | VQFN-32 (RHB) | 43 |
| Junction-to-board thermal resistance | RθJB | | 13 | | °C/W | VQFN-32 (RHB) | 43 |
| Junction-to-top characterization parameter | ΨJT | | 0.3 | | °C/W | VQFN-32 (RHB) | 43 |
| Junction-to-board characterization parameter | ΨJB | | 13 | | °C/W | VQFN-32 (RHB) | 43 |
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | | 3.3 | | °C/W | VQFN-32 (RHB) | 43 |
| Power-on reset level, rising | VPOR+ | 0.95 | 1.3 | 1.56 | V | Rising | 47 |
| Power-on reset level, falling | VPOR- | 0.9 | 1.25 | 1.53 | V | Falling | 47 |
| POR hysteresis | VHYS, POR | 25 | 45 | 70 | mV | | 47 |
| BOR0 level, cold start rising | VBOR0+, COLD | 1.48 | 1.54 | 1.61 | V | Cold start, rising | 47 |
| BOR0 level, rising | VBOR0+ | 1.56 | 1.59 | 1.62 | V | Rising | 47 |
| BOR0 level, falling | VBOR0- | 1.55 | 1.58 | 1.61 | V | Falling | 47 |
| BOR1 level, rising | VBOR1+ | 2.13 | 2.17 | 2.21 | V | Rising | 47 |
| BOR2 level, rising | VBOR2+ | 2.73 | 2.77 | 2.82 | V | Rising | 47 |
| BOR3 level, rising | VBOR3+ | 2.88 | 2.96 | 3.04 | V | Rising | 47 |
| Internal switch resistance between VBAT and VDD | Rswitch | 0.9 | 1.4 | 2.7 | kΩ | | 48 |
| Flash program and erase supply voltage | VDDPGM/ERASE | 1.62 | | 3.6 | V | | 48 |
| Flash word program time | tPROG (WORD, 64) | | 50 | 275 | µs | | 48 |
| Sector erase time | tERASE (SEC) | | 20 | 200 | ms | <10k erase/program cycles | 48 |
| SYSOSC accuracy, FCL on, 25 °C | fSYSOSC | -0.41 | | 0.58 | % | SETUSEFCL=1, Ta = 25 ℃ | 50 |
| SYSOSC accuracy, FCL on, internal ROSC | fSYSOSC | -2 | | 1.4 | % | SETUSEFCL=1 -40 ℃ ≤ Ta ≤ 125 ℃ | 50 |
| LFOSC accuracy | | -5 | | 5 | % | -40 ℃ ≤ Ta ≤ 125 ℃ | 50 |
| High level input voltage ODIO | VIH | 2 | | 5.5 | V | ODIO, VDD≥2.7V | 52 |
| Low level input voltage ODIO | VIL | -0.3 | | 0.8 | V | ODIO, VDD≥2.7V | 52 |
| High-Z leakage current non-LCD pins | Ilkg | | | 50 | nA | SDIO | 52 |
| Low level output voltage SDIO | VOL | | | 0.4 | V | SDIO, VDD≥2.7V, /IIO/,max=6mA; VDD≥1.71V, /IIO/,max=2mA; Tj≤85 °C | 53 |
| ADC analog input range | Vin(ADC) | 0 | | | V | Applies to all ADC analog input pins; max printed VDD | 54 |
| ADC operating supply current | I(ADC) | | 460 | 600 | μA | FS = 1.68MSPS, Internal reference OFF, VR+ = VDD | 54 |
| ADC INL | Ej | -2 | | 2 | LSB | External reference | 55 |
| ADC DNL | Ek | -1 | | 1 | LSB | External reference | 55 |
| ADC offset error | EO | -3.5 | | 3.5 | mV | External reference | 55 |
| ADC gain error | EG | -4 | | 4 | LSB | External reference | 55 |
| VREF output voltage 2.5V | VREF | 2.46 | 2.5 | 2.54 | V | BUFCONFIG = 0 | 58 |
| VREF output voltage 1.4V | VREF | 1.38 | 1.4 | 1.42 | V | BUFCONFIG = 1 | 58 |
| VREF temperature coefficient | TCVREF | | | 75 | ppm/°C | BUFCONFIG = {0, 1} | 57 |
| Comparator input offset voltage | Voffset | -20 | | 20 | mV | | 58 |
| Temperature sensor temperature coefficient | TSc | -1.9 | -1.8 | -1.7 | mV/℃ | -40℃ ≤ Tj ≤ 130℃ | 55 |
## CAD (KiCad official)
- Symbol: `MSPM0L1227SRHBR`
- Footprint: `Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm`
- 3D model: VQFN-32(5x5) (KiCad packages3D, STEP)
- 3D model files: `mspm0l1227srhbr-etched.step` / `mspm0l1227srhbr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mspm0l1227srhbr.step` / `mspm0l1227srhbr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/gpn/mspm0l2228) (134 pp, sha256 `ec3945476714eea7`, retrieved 2026-10-27, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/mspm0l1227srhbr-datasheet.pdf)