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README

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MSPM0G1506SRGER

TEXAS INSTRUMENTS · Global Sourcing Parts · VQFN-24(4x4)

MSPM0G1506SRGER from TEXAS INSTRUMENTS, in a VQFN-24(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 PA1 bidirectional 5V-tolerant open-drain GPIO with wake-up from SHUTDOWN, muxed with UART0_RX, I2C0_SCL (default BSL I2C_SCL), TIMA0_C1, TIMA_FAL2, TIMG8_IDX and TIMG8_C0; needs a pullup to output high.
2 NRST input Active-low reset input that must be pulled high to VDD for the device to release from reset and boot.
3 VDD power_in Power supply, 1.62V to 3.6V, with a 10uF and 0.1uF ceramic capacitor to VSS placed close to the pin.
4 VSS power_in Ground supply.
5 PA2 bidirectional Standard GPIO that serves as ROSC for an external 100kΩ resistor to VSS when the SYSOSC frequency correction loop is used, muxed with TIMG8_C1, SPI0_CS0, TIMG7_C1 and SPI1_CS0.
6 PA3 bidirectional Standard GPIO muxed with TIMG8_C0, SPI0_CS1, UART2_CTS, TIMA0_C2, COMP1_OUT, TIMG7_C0, TIMA0_C1 and I2C1_SDA.
7 PA4 bidirectional Standard GPIO with LFXOUT crystal output, muxed with TIMG8_C1, SPI0_POCI, UART2_RTS, TIMA0_C3, LFCLK_IN, TIMG7_C1, TIMA0_C1N and I2C1_SCL.
8 PA9 bidirectional High-speed GPIO muxed with UART1_RX, SPI0_PICO, UART0_CTS, TIMA0_C1, RTC_OUT, TIMA0_C0N, TIMA1_C1N and CLK_OUT.
9 PA10 bidirectional High-drive GPIO with wake-up from SHUTDOWN and 20mA drive, muxed with UART0_TX (default BSL UART_TX), SPI0_POCI, I2C0_SDA, TIMA1_C0, TIMG12_C0, TIMA0_C2, I2C1_SDA and CLK_OUT.
10 PA11 bidirectional High-drive GPIO with wake-up from SHUTDOWN and 20mA drive, muxed with UART0_RX (default BSL UART_RX), SPI0_SCK, I2C0_SCL, TIMA1_C1, COMP0_OUT, TIMA0_C2N and I2C1_SCL.
11 PA15 bidirectional Standard GPIO with analog functions A1_0, DAC_OUT, OPA0_IN2+, OPA1_IN2+, COMP0_IN3+ and COMP1_IN3+, muxed with UART0_RTS, SPI1_CS2, I2C1_SCL and timer signals.
12 PA16 bidirectional Standard GPIO with analog functions A1_1 and OPA1_OUT, muxed with COMP2_OUT, SPI1_POCI, I2C1_SDA, TIMA1_C1, TIMA1_C1N, TIMA0_C2N and FCC_IN.
13 PA17 bidirectional Standard GPIO with wake-up from SHUTDOWN and analog functions A1_2, OPA1_IN1- and COMP0_IN1-, muxed with UART1_TX, SPI1_SCK, I2C1_SCL and timer signals.
14 PA18 bidirectional Standard GPIO with wake-up from SHUTDOWN and analog functions A1_3, OPA1_IN1+, COMP0_IN1+ and GPAMP_IN-, muxed with UART1_RX, SPI1_PICO and I2C1_SDA; default BSL_invoke input.
15 PA19 bidirectional High-speed GPIO that serves as the SWDIO serial wire debug data input/output.
16 PA20 bidirectional Standard GPIO that serves as the SWCLK serial wire debug clock input.
17 PA21 bidirectional Standard GPIO with analog functions A1_7, COMP2_IN1- and VREF- (voltage reference ground), muxed with UART2_TX, TIMG8_C0, UART1_CTS, TIMA0_C0 and TIMG6_C0; no injection current allowed.
18 PA22 bidirectional Standard GPIO with analog functions A0_7, GPAMP_OUT and OPA0_OUT, muxed with UART2_RX, TIMG8_C1, UART1_RTS, TIMA0_C1, CLK_OUT, TIMA0_C0N and TIMG6_C1.
19 PA23 bidirectional Standard GPIO with analog functions COMP1_IN1- and VREF+ (voltage reference supply, external reference input or internal reference output), muxed with UART2_TX, SPI0_CS3 and timer signals.
20 PA24 bidirectional Standard GPIO with analog functions A0_3 and OPA0_IN1-, muxed with UART2_RX, SPI0_CS2, TIMA0_C3N, TIMG0_C1, UART3_RTS, TIMG7_C1 and TIMA1_C1.
21 PA25 bidirectional Standard GPIO with analog functions A0_2 and OPA0_IN1+, muxed with UART3_RX, SPI1_CS3, TIMG12_C1, TIMA0_C3 and TIMA0_C1N.
22 PA26 bidirectional Standard GPIO with analog functions A0_1, COMP0_IN0+, OPA0_IN0+ and GPAMP_IN+, muxed with UART3_TX, SPI1_CS0, TIMG8_C0, TIMA_FAL0 and TIMG7_C0.
23 VCORE power_out Regulated core power supply output that connects only to a 0.47uF capacitor to VSS (1.35V); no external voltage or load may be applied.
24 PA0 bidirectional 5V-tolerant open-drain GPIO with wake-up from SHUTDOWN, muxed with UART0_TX, I2C0_SDA (default BSL I2C_SDA), TIMA0_C0, TIMA_FAL1, TIMG8_C1 and FCC_IN; needs a pullup to output high.
25 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer TEXAS INSTRUMENTS
Package VQFN-24(4x4)
Category Global Sourcing Parts
Pins 25

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VDD -0.3 4.1 V At VDD pin 30
Input voltage, 5-V tolerant open-drain pins VI -0.3 5.5 V Applied to any 5-V tolerant open-drain pins 30
Input voltage, common tolerance pins VI -0.3 4.1 V Applied to any common tolerance pins; VDD + 0.3 (4.1 MAX) 30
Current into VDD pin IVDD 80 mA -40℃ ≤ Tj ≤ 130℃ 30
Current out of VSS pin IVSS 80 mA -40℃ ≤ Tj≤ 130℃ 30
Diode current at any device pin ID -2 2 mA Diode current at any device pin 30
Ambient temperature TA -40 125 °C Ambient Temperature 30
Junction temperature TJ -40 130 °C Junction temperature 30
Storage temperature Tstg -40 150 °C Storage temperature 30
Supply voltage VDD 1.62 3.6 V 30
Ambient temperature, S version TA -40 125 °C S version 30
Max junction temperature, S version TJ 130 °C S version 30
Capacitor between VDD and VSS CVDD 10 uF 30
Capacitor between VCORE and VSS CVCORE 470 nF 30
MCLK, CPUCLK frequency with 2 flash wait states fMCLK 80 MHz 2 flash wait states 31
ULPCLK frequency fULPCLK 40 MHz 31
Junction-to-ambient thermal resistance RθJA 40.3 °C/W VQFN-24 (RGE) 31
Junction-to-case (top) thermal resistance RθJC(top) 30.8 °C/W VQFN-24 (RGE) 31
Junction-to-board thermal resistance RθJB 17.9 °C/W VQFN-24 (RGE) 31
Power-on reset voltage level, rising VPOR+ 0.95 1.3 1.59 V Rising 34
Power-on reset voltage level, falling VPOR- 0.9 1.25 1.54 V Falling 34
Brown-out reset level 0, rising VBOR0+ 1.56 1.59 1.62 V Rising (1) 35
Program and erase supply voltage VDDPGM/ERASE 1.62 3.6 V 35
Supply current in SHUTDOWN mode IDDSHDN 40 80 nA VDD 3.3V, -40°C column 34
RUN current, 80MHz IDDRUN 8.2 mA MCLK=SYSPLL, CoreMark, execute from flash, 80MHz, 25°C column 33
STANDBY current, LFCLK=LFXT IDDSTBY0 2 7 uA LFCLK=LFXT, STOPCLKSTBY=0, RTC enabled, 32kHz, 25°C column 34
SYSOSC accuracy, FCL enabled, internal ROSC, 32MHz fSYSOSC -2.1 1.6 % SETUSEFCL=1 -40 ℃ ≤ Ta ≤ 125 ℃ 37
LFOSC accuracy -5 5 % -40 ℃ ≤ Ta ≤ 125 ℃ 38
Pull up resistance RPU 40 kΩ All I/O except ODIO 40
ADC integral linearity error EI -2 2 LSB External reference (2) 45
ADC offset error EO -5 5 mV Internal or External reference (2) (3) 45
ADC gain error EG -4 4 LSB External reference (2) 45
VREF output voltage VREF 1.38 1.4 1.42 V BUFCONFIG = 1 46
VREF output voltage VREF 2.46 2.5 2.54 V BUFCONFIG = 0 46
Comparator input offset voltage Voffset -20 20 mV 47
ESD HBM V(ESD) -2000 2000 V Human body model (HBM), all pins 30
ESD CDM V(ESD) -500 500 V Charged device model (CDM), all pins 30

CAD (KiCad official)

  • Symbol: MSPM0G1506SRGER
  • Footprint: Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
  • 3D model: VQFN-24(4x4) (KiCad packages3D, STEP)
  • 3D model files: mspm0g1506srger-etched.step / mspm0g1506srger-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mspm0g1506srger.step / mspm0g1506srger.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TEXAS INSTRUMENTS datasheet (135 pp, sha256 0e4369b6aeb4218c, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF