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README

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MSP430FR2310IPW16R

Texas Instruments · Microcontrollers (MCU/MPU/SOC) · TSSOP-16

MSP430FR2310IPW16R from Texas Instruments, in a TSSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 P1.1/UCB0CLK/ACLK/C1/A1 bidirectional General-purpose LVCMOS I/O powered from DVCC (reset default OFF after BOR), multiplexed with eUSCI_B0 clock, ACLK output, eCOMP0 comparator input C1 and ADC input A1.
2 P1.0/UCB0STE/SMCLK/C0/A0/Veref+ bidirectional General-purpose LVCMOS I/O powered from DVCC (reset default OFF after BOR), multiplexed with eUSCI_B0 slave transmit enable, SMCLK output, eCOMP0 comparator input C0, ADC input A0 and ADC positive reference Veref+.
3 TEST/SBWTCK input TEST is the Test Mode pin that selects digital I/O on the JTAG pins and always has an internal pulldown enabled, so it should be left open if unused; it also carries SBWTCK, the Spy-Bi-Wire input clock.
4 RST/NMI/SBWTDIO bidirectional Active-low reset input (RST), also the nonmaskable interrupt input (NMI) and Spy-Bi-Wire data input/output (SBWTDIO); if unused, tie to DVCC with a 47-kΩ pullup or internal pullup and a 10-nF (or 1.1-nF with SBW) pulldown.
5 DVCC power_in Main power supply for the digital and analog modules, specified at 1.8 V to 3.6 V, with a recommended 4.7 µF to 10 µF capacitor at DVCC.
6 DVSS power_in Power ground for the digital and analog modules, at 0 V reference.
7 P2.7/TB0CLK/XIN bidirectional General-purpose LVCMOS I/O powered from DVCC (reset default OFF after BOR), multiplexed with Timer_B0 clock input TB0CLK and the crystal oscillator input XIN.
8 P2.6/MCLK/XOUT bidirectional General-purpose LVCMOS I/O powered from DVCC (reset default OFF after BOR), multiplexed with the MCLK output and the crystal oscillator output XOUT.
9 P2.0/TB1.1/COUT bidirectional General-purpose LVCMOS I/O powered from DVCC (reset default OFF after BOR), multiplexed with Timer_B1 capture/compare channel TB1.1 and the eCOMP0 comparator output COUT.
10 P1.7/UCA0TXD/UCA0SIMO/TB0.2/TDO/TRI0+/A7/VREF+ bidirectional General-purpose LVCMOS I/O powered from DVCC (reset default OFF after BOR), multiplexed with eUSCI_A0 UART transmit or SPI SIMO, Timer_B0 channel TB0.2, JTAG TDO, TIA0 positive input TRI0+, ADC input A7, and VREF+ reference output (ground referenced).
11 P1.6 / UCA0RXD / UCA0SOMI / TB0.1 / TDI / TCLK / A6 bidirectional General-purpose LVCMOS I/O powered from DVCC (reset default OFF after BOR), multiplexed with eUSCI_A0 UART receive or SPI SOMI, Timer_B0 channel TB0.1, JTAG TDI/TCLK and ADC input A6; TI recommends disabling the pin interrupt while in JTAG debug.
12 TRI0- input Dedicated low-leakage TIA0 negative input pad that exists only in the TSSOP-16 package, with leakage reduced to 5 pA; leave open if unused (the pin is then a high-impedance output).
13 P1.5/UCA0CLK/TMS/TRI0O/A5 bidirectional General-purpose LVCMOS I/O powered from DVCC (reset default OFF after BOR), multiplexed with eUSCI_A0 clock, JTAG TMS, TIA0 output TRI0O and ADC input A5.
14 P1.4/UCA0STE/TCK/OA0+/A4 bidirectional General-purpose LVCMOS I/O powered from DVCC (reset default OFF after BOR), multiplexed with eUSCI_A0 slave transmit enable, JTAG TCK, SAC0 op-amp positive input OA0+ and ADC input A4.
15 P1.3/UCB0SOMI/UCB0SCL/OA0O/A3 bidirectional General-purpose LVCMOS I/O powered from DVCC (reset default OFF after BOR), multiplexed with eUSCI_B0 SPI SOMI or I2C SCL, SAC0 op-amp output OA0O and ADC input A3.
16 P1.2 / UCB0SIMO / UCB0SDA / TB0TRG / OA0- / A2 / Veref- bidirectional General-purpose LVCMOS I/O powered from DVCC (reset default OFF after BOR), multiplexed with eUSCI_B0 SPI SIMO or I2C SDA, Timer_B0 external trigger TB0TRG, SAC0 op-amp negative input OA0-, ADC input A2 and ADC negative reference Veref-.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package TSSOP-16
Category Embedded Processors & Controllers
Pins 16

CAD (KiCad official)

  • Symbol: MSP430FR2310IPW16R
  • Footprint: Package_SO:TSSOP-16_4.4x5mm_P0.65mm
  • 3D model: TSSOP-16 (KiCad packages3D, STEP)
  • 3D model files: msp430fr2310ipw16r-etched.step / msp430fr2310ipw16r-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); msp430fr2310ipw16r.step / msp430fr2310ipw16r.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (99 pp, sha256 ace23ae4fc6ae702, retrieved 2026-10-11, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF