# mSMD050-24V

**TECHFUSE** · Resettable Fuses · 1812

mSMD050-24V from TECHFUSE, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | TECHFUSE |
| Package | 1812 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum operating voltage (Vmax) | Vmax |  |  | 24 | Vdc | Maximum operating voltage at rated current (Imax) | 2 |
| Maximum fault current (Imax) | Imax |  |  | 100 | A | Maximum fault current at rated voltage (Vmax) | 2 |
| Hold current (Ihold) | Ihold |  |  | 0.5 | A | Maximum current device will not trip, 25°C still air | 2 |
| Trip current (Itrip) | Itrip | 1 |  |  | A | Minimum current at which device will always trip, 25°C still air | 2 |
| Power dissipation in tripped state (Pd) | Pd |  |  | 0.8 | W | Tripped state, 25°C still air, at rated voltage | 2 |
| Minimum device resistance prior to tripping (Rimin) | Rimin | 0.15 |  |  |  | 25°C, prior to tripping | 2 |
| Maximum surface temperature in tripped state |  |  |  | 125 | °C | Device in tripped state | 2 |
| Ambient operating temperature |  | -40 |  | 85 | °C | Ambient operating conditions | 2 |
| Storage temperature |  |  |  | 40 | °C | Storage conditions; 70% R.H. max | 4 |
| Maximum recommended solder paste thickness |  |  |  | 0.25 | mm | Recommended maximum paste thickness for reflow | 4 |

## CAD (KiCad official)

- Symbol: `mSMD050-24V`
- Footprint: `Fuse:Fuse_1812_4532Metric`
- 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal _1806_ height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `msmd050-24v-etched.step` / `msmd050-24v-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `msmd050-24v.step` / `msmd050-24v.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [TECHFUSE datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8586175153810116608) (4 pp, sha256 `763fb24e1dcbf9b7`, retrieved 2026-10-15, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/msmd050-24v-datasheet.pdf)