component
mSMD035
Public Made by Adomby adom
TECHFUSE Resettable Fuses, 1812. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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mSMD035
TECHFUSE · Resettable Fuses · 1812
mSMD035 from TECHFUSE, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One terminal pad of the non-polarized PPTC (tin-plated nickel-copper), rated 30 Vdc max, 0.35 A hold and 0.70 A trip current at 25°C, 100 A max fault current. |
| 2 | 2 | passive | Second terminal pad of the non-polarized PPTC (tin-plated nickel-copper), rated 30 Vdc max, 0.35 A hold and 0.70 A trip current at 25°C, 100 A max fault current. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TECHFUSE |
| Package | 1812 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Rated voltage (Vmax) | Vmax | 30 | Vdc | Maximum operating voltage at rated current (Imax) | 2 | ||
| Maximum fault current (Imax) | Imax | 100 | A | At rated voltage (Vmax) | 2 | ||
| Trip current (Itrip) | Itrip | 0.7 | A | 25°C still air; minimum current at which device always trips | 2 | ||
| Minimum resistance prior to tripping (Rimin) | Rimin | 0.1 | Ω | 25°C | 2 | ||
| Maximum resistance one hour post reflow (R1max) | R1max | 0.23 | Ω | 25°C, measured one hour post reflow | 2 | ||
| Power dissipation in tripped state (Pd) | Pd | 0.8 | W | Tripped state, 25°C still air, at rated voltage | 2 | ||
| Time to trip | 8 | Sec | Typical time-to-trip at 25°C; test current not printed | 2 | |||
| Hold current (Ihold) nominal | Ihold | 0.35 | A | 25°C still air; maximum current device will not trip | 2 | ||
| Ambient operating temperature | Tamb | -40 | 85 | °C | Ambient operating conditions | 2 | |
| Maximum surface temperature in tripped state | 125 | °C | Device in tripped state | 2 | |||
| Maximum ambient operating temperature vs hold current: Ihold at -40°C | Ihold | 0.51 | A | Ambient -40°C | 2 | ||
| Maximum ambient operating temperature vs hold current: Ihold at -20°C | Ihold | 0.45 | A | Ambient -20°C | 2 | ||
| Maximum ambient operating temperature vs hold current: Ihold at 0°C | Ihold | 0.4 | A | Ambient 0°C | 2 | ||
| Maximum ambient operating temperature vs hold current: Ihold at 25°C | Ihold | 0.35 | A | Ambient 25°C | 2 | ||
| Maximum ambient operating temperature vs hold current: Ihold at 40°C | Ihold | 0.3 | A | Ambient 40°C | 2 | ||
| Maximum ambient operating temperature vs hold current: Ihold at 50°C | Ihold | 0.26 | A | Ambient 50°C | 2 | ||
| Maximum ambient operating temperature vs hold current: Ihold at 60°C | Ihold | 0.24 | A | Ambient 60°C | 2 | ||
| Maximum ambient operating temperature vs hold current: Ihold at 70°C | Ihold | 0.21 | A | Ambient 70°C | 2 | ||
| Maximum ambient operating temperature vs hold current: Ihold at 85°C | Ihold | 0.17 | A | Ambient 85°C | 2 | ||
| Storage temperature | 40 | °C | Storage conditions, maximum | 4 | |||
| Storage relative humidity | 70 | %R.H. | Storage conditions, maximum | 4 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | Termination Pad Characteristics Terminal pad materials: Tin-plated Nickel-Copper Terminal pad solderability: Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. Rework | 3 |
CAD (KiCad official)
- Symbol:
mSMD035 - Footprint:
Fuse:Fuse_1812_4532Metric - 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal 1806 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
msmd035-etched.step/msmd035-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);msmd035.step/msmd035.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TECHFUSE datasheet (4 pp, sha256
0a6daece1b218f5c, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# mSMD035
**TECHFUSE** · Resettable Fuses · 1812
mSMD035 from TECHFUSE, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One terminal pad of the non-polarized PPTC (tin-plated nickel-copper), rated 30 Vdc max, 0.35 A hold and 0.70 A trip current at 25°C, 100 A max fault current. |
| 2 | 2 | passive | Second terminal pad of the non-polarized PPTC (tin-plated nickel-copper), rated 30 Vdc max, 0.35 A hold and 0.70 A trip current at 25°C, 100 A max fault current. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TECHFUSE |
| Package | 1812 |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Rated voltage (Vmax) | Vmax | | | 30 | Vdc | Maximum operating voltage at rated current (Imax) | 2 |
| Maximum fault current (Imax) | Imax | | | 100 | A | At rated voltage (Vmax) | 2 |
| Trip current (Itrip) | Itrip | 0.7 | | | A | 25°C still air; minimum current at which device always trips | 2 |
| Minimum resistance prior to tripping (Rimin) | Rimin | 0.1 | | | Ω | 25°C | 2 |
| Maximum resistance one hour post reflow (R1max) | R1max | | | 0.23 | Ω | 25°C, measured one hour post reflow | 2 |
| Power dissipation in tripped state (Pd) | Pd | | 0.8 | | W | Tripped state, 25°C still air, at rated voltage | 2 |
| Time to trip | | | 8 | | Sec | Typical time-to-trip at 25°C; test current not printed | 2 |
| Hold current (Ihold) nominal | Ihold | | 0.35 | | A | 25°C still air; maximum current device will not trip | 2 |
| Ambient operating temperature | Tamb | -40 | | 85 | °C | Ambient operating conditions | 2 |
| Maximum surface temperature in tripped state | | | | 125 | °C | Device in tripped state | 2 |
| Maximum ambient operating temperature vs hold current: Ihold at -40°C | Ihold | | 0.51 | | A | Ambient -40°C | 2 |
| Maximum ambient operating temperature vs hold current: Ihold at -20°C | Ihold | | 0.45 | | A | Ambient -20°C | 2 |
| Maximum ambient operating temperature vs hold current: Ihold at 0°C | Ihold | | 0.4 | | A | Ambient 0°C | 2 |
| Maximum ambient operating temperature vs hold current: Ihold at 25°C | Ihold | | 0.35 | | A | Ambient 25°C | 2 |
| Maximum ambient operating temperature vs hold current: Ihold at 40°C | Ihold | | 0.3 | | A | Ambient 40°C | 2 |
| Maximum ambient operating temperature vs hold current: Ihold at 50°C | Ihold | | 0.26 | | A | Ambient 50°C | 2 |
| Maximum ambient operating temperature vs hold current: Ihold at 60°C | Ihold | | 0.24 | | A | Ambient 60°C | 2 |
| Maximum ambient operating temperature vs hold current: Ihold at 70°C | Ihold | | 0.21 | | A | Ambient 70°C | 2 |
| Maximum ambient operating temperature vs hold current: Ihold at 85°C | Ihold | | 0.17 | | A | Ambient 85°C | 2 |
| Storage temperature | | | | 40 | °C | Storage conditions, maximum | 4 |
| Storage relative humidity | | | | 70 | %R.H. | Storage conditions, maximum | 4 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | Termination Pad Characteristics Terminal pad materials: Tin-plated Nickel-Copper Terminal pad solderability: Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. Rework | 3 |
## CAD (KiCad official)
- Symbol: `mSMD035`
- Footprint: `Fuse:Fuse_1812_4532Metric`
- 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal _1806_ height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `msmd035-etched.step` / `msmd035-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `msmd035.step` / `msmd035.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [TECHFUSE datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603109978526142464) (4 pp, sha256 `0a6daece1b218f5c`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/msmd035-datasheet.pdf)