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MSESD08CI
Public Made by Adomby adom
MSKSEMI ESD Protection Devices, SOD-323. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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MSESD08CI
MSKSEMI · ESD Protection Devices · SOD-323
MSESD08CI from MSKSEMI, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MSKSEMI |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| ESD per IEC 61000-4-2 (Air) | VESD | -30 | 30 | kV | ESD per IEC 61000-4-2 (Air) | 2 | |
| ESD per IEC 61000-4-2 (Contact) | VESD | -30 | 30 | kV | ESD per IEC 61000-4-2 (Contact) | 2 | |
| Operating Temperature Range | TJ | -40 | 85 | °C | 2 | ||
| Storage Temperature Range | Tstg | -55 | 150 | °C | 2 | ||
| Reverse Leakage Current | IR | 1 | 100 | nA | VRWM = 8V | 4 | |
| Reverse Working Voltage | VRWM | 8 | V | 4 | |||
| Breakdown Voltage | VBR | 8.5 | V | IT = 1mA | 4 | ||
| Clamping Voltage | VC | 14 | V | IPP = 1A (8 x 20µs pulse) | 4 | ||
| Clamping Voltage | VC | 19 | V | IPP = 13A (8 x 20µs pulse) | 4 | ||
| Peak Pulse Current | IPP | 13 | A | tp=8/20µs | 4 | ||
| Junction Capacitance | CJ | 1 | pF | VR = 0V, f = 1MHz | 4 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Lead Finish: Matte Tin Case Material: “Green” Molding Compound. UL Flammability Classification Rating94V-0 | 2 |
CAD (KiCad official)
- Symbol:
MSESD08CI - Footprint:
Diode_SMD:D_SOD-323 - 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files:
msesd08ci-etched.step/msesd08ci-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);msesd08ci.step/msesd08ci.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MSKSEMI datasheet (8 pp, sha256
5e6285e17b2fc971, retrieved 2026-11-05, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# MSESD08CI
**MSKSEMI** · ESD Protection Devices · SOD-323
MSESD08CI from MSKSEMI, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MSKSEMI |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| ESD per IEC 61000-4-2 (Air) | VESD | -30 | | 30 | kV | ESD per IEC 61000-4-2 (Air) | 2 |
| ESD per IEC 61000-4-2 (Contact) | VESD | -30 | | 30 | kV | ESD per IEC 61000-4-2 (Contact) | 2 |
| Operating Temperature Range | TJ | -40 | | 85 | °C | | 2 |
| Storage Temperature Range | Tstg | -55 | | 150 | °C | | 2 |
| Reverse Leakage Current | IR | | 1 | 100 | nA | VRWM = 8V | 4 |
| Reverse Working Voltage | VRWM | | 8 | | V | | 4 |
| Breakdown Voltage | VBR | | 8.5 | | V | IT = 1mA | 4 |
| Clamping Voltage | VC | | 14 | | V | IPP = 1A (8 x 20µs pulse) | 4 |
| Clamping Voltage | VC | | 19 | | V | IPP = 13A (8 x 20µs pulse) | 4 |
| Peak Pulse Current | IPP | | 13 | | A | tp=8/20µs | 4 |
| Junction Capacitance | CJ | | 1 | | pF | VR = 0V, f = 1MHz | 4 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | Lead Finish: Matte Tin Case Material: “Green” Molding Compound. UL Flammability Classification Rating94V-0 | 2 |
## CAD (KiCad official)
- Symbol: `MSESD08CI`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `msesd08ci-etched.step` / `msesd08ci-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `msesd08ci.step` / `msesd08ci.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [MSKSEMI datasheet](docs/msesd08ci-datasheet.pdf) (8 pp, sha256 `5e6285e17b2fc971`, retrieved 2026-11-05, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/msesd08ci-datasheet.pdf)