MSASH168SC7224KTCA01 - Taiyo Yuden
Public Made by Adomby adom
MLCC 0.22 uF +/-10 %, 100 V, X7S, 0603 (1608 metric)
Land pattern check: MSASH168SC7224KTCA01
The footprint on this page is KiCad's standard library footprint Capacitor_SMD:C_0603_1608Metric, renamed to
C_0603_1608Metric_MSASH168SC7224KTCA01 so it can sit beside other parts in one library folder. The copper is unchanged. This page compares it with
the land pattern Taiyo Yuden publishes for this exact part number as a DXF drawing on the product page (kept unchanged in
../provenance/manufacturer/MSASH168SC7224KTCA01-land.dxf): two lands 0.6 mm long and 0.8 mm wide with a 0.8 mm gap, 2.0 mm overall
(layer L1; the solder resist openings on layer Resist are 0.05 mm larger all round).
Numbers
| Dimension | KiCad C_0603_1608Metric (used) | Taiyo Yuden land (DXF) | Difference |
|---|---|---|---|
| gap between lands | 0.65 mm | 0.80 mm | -0.15 mm |
| land length | 0.90 mm | 0.60 mm | +0.30 mm |
| land width | 0.95 mm | 0.80 mm | +0.15 mm |
| overall length | 2.45 mm | 2.00 mm | +0.45 mm |
The DXF carries outlines only, no dimension text; the numbers above are read from its polyline coordinates.
Result
KiCad's pads (0.90 x 0.95 mm, gap 0.65 mm) are larger than Taiyo Yuden's land on every side and contain it completely: they are 0.30 mm longer, 0.15 mm wider and reach 0.15 mm further under the part. KiCad generates this footprint to IPC-7351 nominal density. Both cover the terminal band (e 0.35 +/-0.25 mm) and both are ordinary reflow lands for a 1608 part; this page keeps the KiCad pads, as its library footprint. A design that wants the maker's land should make each pad 0.6 x 0.8 mm with pad centres 1.4 mm apart. Taiyo Yuden's precautions document (c_mlcc_prec_e, linked from the product page) warns that excessive solder can cause mechanical stress that cracks the chip and gives its recommended land sizes for that reason.
The drawing and land-check.json come from provenance/tools/landcheck.py.
# Land pattern check: MSASH168SC7224KTCA01
The footprint on this page is KiCad's standard library footprint `Capacitor_SMD:C_0603_1608Metric`, renamed to
`C_0603_1608Metric_MSASH168SC7224KTCA01` so it can sit beside other parts in one library folder. The copper is unchanged. This page compares it with
the land pattern Taiyo Yuden publishes for this exact part number as a DXF drawing on the product page (kept unchanged in
`../provenance/manufacturer/MSASH168SC7224KTCA01-land.dxf`): two lands 0.6 mm long and 0.8 mm wide with a 0.8 mm gap, 2.0 mm overall
(layer L1; the solder resist openings on layer Resist are 0.05 mm larger all round).
## Numbers
| Dimension | KiCad C_0603_1608Metric (used) | Taiyo Yuden land (DXF) | Difference |
|---|---|---|---|
| gap between lands | 0.65 mm | 0.80 mm | -0.15 mm |
| land length | 0.90 mm | 0.60 mm | +0.30 mm |
| land width | 0.95 mm | 0.80 mm | +0.15 mm |
| overall length | 2.45 mm | 2.00 mm | +0.45 mm |
The DXF carries outlines only, no dimension text; the numbers above are read from its polyline coordinates.
## Result
KiCad's pads (0.90 x 0.95 mm, gap 0.65 mm) are larger than Taiyo Yuden's land on every side and
contain it completely: they are 0.30 mm longer, 0.15 mm wider and reach 0.15 mm further under the part. KiCad generates
this footprint to IPC-7351 nominal density. Both cover the terminal band (e 0.35 +/-0.25 mm) and both are ordinary reflow
lands for a 1608 part; this page keeps the KiCad pads, as its library footprint. A design that wants the maker's land
should make each pad 0.6 x 0.8 mm with pad centres 1.4 mm apart. Taiyo Yuden's
precautions document (c_mlcc_prec_e, linked from the product page) warns that excessive solder can cause mechanical stress
that cracks the chip and gives its recommended land sizes for that reason.
The drawing and [land-check.json](land-check.json) come from `provenance/tools/landcheck.py`.