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MS9N150HGC0

MASPOWER · MOSFETs · TO-247

MS9N150HGC0 from MASPOWER, in a TO-247. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; continuous gate-source voltage ±20 V (transient ±30 V), threshold 2.5 V to 5.5 V at VDS = VGS, ID = 250 µA.
2 D passive Drain; drain-source voltage up to 1500 V, continuous drain current 9 A at TC = 25 °C (6 A at 100 °C), pulsed 36 A; also connected to the mounting tab.
3 S passive Source; source-drain diode current 9 A continuous and 40 A pulsed, forward voltage 1.2 V max at ISD = 1 A.

Key specifications

Parameter Value
Manufacturer MASPOWER
Package TO-247
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source voltage VDSS 1500 V VGS = 0 1
Transient gate-source voltage VGSM -30 30 V 1
Continuous gate-source voltage VGSS -20 20 V 1
Drain current (continuous) ID 9 A TC = 25 °C 1
Drain current (continuous) ID 6 A TC = 100 °C 1
Drain current-pulsed IDM 36 A note 1: pulse width limited by max junction temperature 1
Total dissipation PTOT 657 W TC = 25 °C 1
Total dissipation PTOT 263 W TC = 100 °C 1
Operating junction temperature TJ -55 150 °C 1
Maximum lead temperature for soldering purpose TL 300 1
Avalanche current, repetitive or not-repetitive IAR 9 A pulse width limited by TJ max 1
Single pulse avalanche energy EAS 800 mJ starting TJ = 25 °C, ID = IAR, VDD = 50 V 1
Drain-source breakdown voltage V(BR)DSS 1500 V ID =250μA, VGS = 0 2
Zero gate voltage drain current IDSS 500 µA VDS=VDSS, TC=125 °C 2
Gate-body leakage current IGSS -100 100 nA VGS = ± 20 V 2
Gate threshold voltage VGS(th) 2.5 5.5 V VDS = VGS, ID = 250 µA 2
Static drain-source on resistance RDS(on) 2 2.8 Ω VGS = 10V, ID = 1A 2
Forward on voltage VSD 0.68 1.2 V ISD= 1 A, VGS= 0 2
Thermal resistance junction-case Rthj-case 0.19 ℃/W 3
Thermal resistance junction-ambient Rthj-amb 50 ℃/W 3

CAD (KiCad official)

  • Symbol: MS9N150HGC0
  • Footprint: Package_TO_SOT_THT:TO-247-3_Vertical
  • 3D model: TO-247 (KiCad packages3D, STEP)
  • 3D model files: ms9n150hgc0-etched.step / ms9n150hgc0-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ms9n150hgc0.step / ms9n150hgc0.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MASPOWER datasheet (6 pp, sha256 f22afd5a620d9cde, retrieved 2026-11-07, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF