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MS8002D

Public Made by Adom

by adom

MSKSEMI Audio Amplifiers, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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MS8002D

MSKSEMI · Audio Amplifiers · SOP-8

MS8002D from MSKSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SD input System shutdown control, default high: a high level (VIH ≥ 2 V at VDD=5.0 V) shuts the amplifier down to minimum current, and a low level (VIL ≤ 0.6 V at VDD=5.0 V) enables normal operation.
2 Bypass input Reference voltage node where the bypass capacitor CBYP sets the amplifier start-up speed and affects noise, PSRR and turn-on/shutdown pop; the datasheet example uses 1 µF, and the start-up time test uses 1.0 µF.
3 IN+ input Positive audio input terminal of the differential input stage.
4 IN- input Negative audio input terminal of the differential input stage.
5 OUTP output Positive audio output terminal driving the speaker; the minimum load is 3 Ω at VDD=5.0 V.
6 VDD power_in Power supply pin; recommended supply range is 2.5 V to 5.5 V and the absolute maximum is -0.3 V to 6 V.
7 GND power_in Ground reference pin.
8 OUTN output Negative audio output terminal driving the speaker; the minimum load is 3 Ω at VDD=5.0 V.

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package SOP-8
Category Amplifiers/Comparators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VDD -0.3 6 V 4
Input voltage VI -0.3 V upper limit printed as VDD+0.3V 4
Operating temperature TA -40 85 ℃ 4
Junction temperature TJ -40 125 ℃ 4
Storage temperature TSTG -65 150 ℃ 4
Soldering temperature TSLD 300 ℃ 5 sec 4
Supply voltage VDD 2.5 5.5 V 4
SD high-level input voltage VIH 2 V VDD=5.0V 4
SD low-level input voltage VIL 0.6 V VDD=5.0V 4
Minimum load resistance RLMIN 3 Ω VDD=5.0V 4
Thermal resistance, junction to ambient θJA 115 ℃/W SOP8 4
Thermal resistance, junction to case θJC 63 ℃/W 4
Output power Po 1.6 W THD+N=10%, f=1KHZ, RL=8Ω, VDD=5.0V 5
Output power Po 1.1 W THD+N=10%, f=1KHZ, RL=8Ω, VDD=4.2V 5
Output power Po 0.85 W THD+N=10%, f=1KHZ, RL=8Ω, VDD=3.7V 5
Output power Po 1.3 W THD+N=1%, f=1KHZ, RL=8Ω, VDD=5.0V 5
Output power Po 0.86 W THD+N=1%, f=1KHZ, RL=8Ω, VDD=4.2V 5
Output power Po 0.66 W THD+N=1%, f=1KHZ, RL=8Ω, VDD=3.7V 5
Output power Po 2.6 W THD+N=10%, f=1KHZ, RL=4Ω, VDD=5.0V 5
Output power Po 1.7 W THD+N=10%, f=1KHZ, RL=4Ω, VDD=4.2V 5
Output power Po 2 W THD+N=1%, f=1KHZ, RL=4Ω, VDD=5.0V 5
Output power Po 1 W THD+N=1%, f=1KHZ, RL=4Ω, VDD=3.7V 5
Output power Po 2.8 W THD+N=10%, f=1KHZ, RL=3Ω, VDD=5.0V 5
Output power Po 1.95 W THD+N=10%, f=1KHZ, RL=3Ω, VDD=4.2V 5
Output power Po 1.46 W THD+N=10%, f=1KHZ, RL=3Ω, VDD=3.7V 5
Output power Po 1.5 W THD+N=1%, f=1KHZ, RL=3Ω, VDD=4.2V 5
Total harmonic distortion plus noise THD+N 0.3 % VDD=5.0V, PO=1.0W, RL=8Ω, f=1KHz 5
Total harmonic distortion plus noise THD+N 0.4 % VDD=3.7V, PO=0.5W, RL=8Ω 5
Gain GV 20 dB Rin=27K, Rf=150K, VDD=3.7V 5
Power supply rejection ratio PSRR 57 dB VDD=4.2V ±200mVp-p, f=1KHz 5
Signal-to-noise ratio SNR 89 dB VDD=5.0V, Vorms=1V, GV=20dB, f=1KHz 5
Residual noise Vn 35 μV VDD=5.0V, Input floating with Cin=0.1μF, A-weighting 5
Residual noise Vn 53 μV A-weighting 5
Dynamic range Dyn 98 dB VDD=5.0V, THD=1% f=1KHz 5
Quiescent current IQ 5 mA VDD=5.0V, VSD=0.3V, No Load 5
Quiescent current IQ 4 mA VDD=4.2V 5
Quiescent current IQ 3 mA VDD=3.7V 5
Shutdown current ISD 1 μA VDD=2.0V to 5.0V, VSD=3.3V 5
Output offset voltage Vos 3 mV VDD=5V, AC_GND 5
Startup time Tst 90 mS CByp=1.0uF 5
Over-temperature protection threshold OTP 175 °C Junction Temperature, No Load, VDD=5.0V 5
Over-temperature hysteresis OTH 30 °C 5

CAD (KiCad official)

  • Symbol: MS8002D
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: ms8002d-etched.step / ms8002d-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ms8002d.step / ms8002d.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (9 pp, sha256 4c354d44216b2cb6, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF