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MS60N03

MSKSEMI · MOSFETs · TO-252-2

MS60N03 from MSKSEMI, in a TO-252-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; controls the channel, with VGS limited to ±20 V and a threshold of 1.0 to 2.5 V.
2 D passive Drain, which is also the tab; VDS is rated at 30 V and continuous ID is 60 A at TC=25℃.
3 S passive Source; maximum continuous body-diode current is 50 A.

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package TO-252-2
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source Voltage VDS 30 V 2
Gate-source Voltage VGS -20 20 V 2
Drain Current ID 60 A TC=25℃ 2
Drain Current ID 35 A TC=100℃ 2
Pulsed Drain Current IDM 150 A 2
Total Power Dissipation PD 34 W TC=25℃ 2
Total Power Dissipation PD 17 W TC=100℃ 2
Single Pulse Avalanche Energy EAS 80 mJ 2
Thermal Resistance Junction-to-Case RθJC 4.4 ℃/ W 2
Junction and Storage Temperature Range TJ,TSTG -55 175 ℃ 2
Drain-Source Breakdown Voltage BVDSS 30 V VGS= 0V, ID=250μA 3
Zero Gate Voltage Drain Current IDSS 1 μA VDS=30V,VGS=0V; TJ=25℃ 3
Zero Gate Voltage Drain Current IDSS 5 μA VDS=30V,VGS=0V; TJ=55℃ 3
Gate-Body Leakage Current IGSS -100 100 nA VGS= ±20V, VDS=0V 3
Gate Threshold Voltage VGS(th) 1 1.5 2.5 V VDS= VGS, ID=250μA 3
Static Drain-Source On-Resistance RDS(ON) 6.5 9 mΩ VGS= 10V, ID=15A 3
Static Drain-Source On-Resistance RDS(ON) 8.6 11 mΩ VGS= 4.5V, ID=15A 3
Diode Forward Voltage VSD 0.85 1.2 V IS=15A,VGS=0V 3
Maximum Body-Diode Continuous Current IS 50 A 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper solder mounting surface of the drain pins. RθJC is guaranteed by design, while RθJA is determined by the board design. The maximum rating presented here is based on mounting on a 1 in 2 pad of 2oz cop 3

CAD (KiCad official)

  • Symbol: MS60N03
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252-2 (KiCad packages3D, STEP)
  • 3D model files: ms60n03-etched.step / ms60n03-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ms60n03.step / ms60n03.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (7 pp, sha256 3396e1495d4e5a51, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF