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MS5N100FT

MASPOWER · MOSFETs · TO-220

MS5N100FT from MASPOWER, in a TO-220. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; continuous gate-source voltage ±20 V, transient ±30 V, threshold 2.0 to 5.0 V at VDS=VGS, ID=250 µA.
2 D passive Drain; drain-source voltage 1000 V, continuous drain current 5 A at TC=25 °C and 3 A at TC=100 °C, pulsed 18 A.
3 S passive Source; connected to the MOSFET body diode anode, source-drain current 5 A continuous and 18 A pulsed.

Key specifications

Parameter Value
Manufacturer MASPOWER
Package TO-220
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source voltage VDS 1000 V VGS=0 1
Transient gate-source voltage VGSM -30 30 V 1
Continuous gate-source voltage VGSS -20 20 V 1
Avalanche current repetitive or not-repetitive IAR 5 A pulse width limited by Tj Max 1
Single pulse avalanche energy EAS 583 mJ starting Tj=25℃ Id=IAR Vdd=50V 1
Drain current (continuous) at TC=25℃ ID 5 A TC=25℃ 1
Drain current (continuous) at TC=100℃ ID 3 A TC=100℃ 1
Drain current (pulsed) IDM 18 A 1
Total dissipation PD 198 W TC=25℃ 1
Operating junction temperature TJ -55 150 ℃ 1
Maximum lead temperature for soldering TL 300 ℃ 1
Drain-source breakdown voltage V(BR)DSS 1000 V ID=1mA VGS=0 2
Zero gate voltage drain current IDSS 1 μA VDS=Max rating 2
Zero gate voltage drain current IDSS 50 μA VDS=Max rating, TC=125℃ 2
Gate body leakage current IGSS -100 100 nA VGS=±20V 2
Gate threshold voltage VGS(th) 2 5 V VDS=VGS ID=250μA 2
Static drain-source on resistance RDS(on) 3.5 4.5 Ω VGS=10V ID=1A 2
Source drain forward on voltage VSD 0.8 1.2 V ISD=5A,VGS=0V 2
Source drain current ISD 5 A 2
Source drain current (pulsed) ISDM 18 A 2
Thermal resistance junction-case Rthj-c 0.63 ℃/W max 3
Thermal resistance junction-ambient Rthc-a 35 ℃/W max 3
Forward transconductance gfs 5.6 S VDS = 27 V, ID = 5A 2
Input capacitance Ciss 506 pF VDS=25V,f=1MHz,VGS=0 2
Output capacitance Coss 59 pF VDS=25V,f=1MHz,VGS=0 2
Reverse transfer capacitance Crss 3 pF VDS=25V,f=1MHz,VGS=0 2
Total gate charge Qg 18.68 nC VDD=800V, ID=2.5A, VGS=10V, RG = 4.7 Ω 2
Gate-source charge Qgs 2.1 nC VDD=800V, ID=2.5A, VGS=10V, RG = 4.7 Ω 2
Gate-drain charge Qgd 7.3 nC VDD=800V, ID=2.5A, VGS=10V, RG = 4.7 Ω 2
Turn-on delay time td(on) 35.6 ns VDD = 800 V, ID = 2.5 A, RG = 25Ω, VGS = 10 V 2
Rise time tr 22.9 ns VDD = 800 V, ID = 2.5 A, RG = 25Ω, VGS = 10 V 2
Turn-off delay time td(off) 42.7 ns VDD = 800 V, ID = 2.5 A, RG = 25Ω, VGS = 10 V 2
Fall time tf 13.6 ns VDD = 800 V, ID = 2.5 A, RG = 25Ω, VGS = 10 V 2
Reverse recovery time Trr 1.02 us ISD=5A, di/dt=200A/μs, VR=100V, Tj=150℃ 3
Reverse recovery charge Qrr 3.68 uC ISD=5A, di/dt=200A/μs, VR=100V, Tj=150℃ 3

CAD (KiCad official)

  • Symbol: MS5N100FT
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220 (KiCad packages3D, STEP)
  • 3D model files: ms5n100ft-etched.step / ms5n100ft-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ms5n100ft.step / ms5n100ft.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MASPOWER datasheet (11 pp, sha256 dcb061b508d620cf, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF