# MRA4007T3G-FS

**FUXINSEMI** · Diodes - General Purpose · SMA(DO-214AC)

MRA4007T3G-FS from FUXINSEMI, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | cathode | passive | Cathode terminal, marked by the cathode band on the package; the series is rated for 200 V to 1000 V maximum repetitive peak reverse voltage (VRRM). |
| 2 | anode | passive | Anode terminal; the series is rated for 2.0 A maximum average forward rectified current (IO). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | FUXINSEMI |
| Package | SMA(DO-214AC) |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum repetitive peak reverse voltage | VRRM |  |  | 1000 | V |  | 1 |
| Maximum RMS voltage | VRMS |  |  | 700 | V |  | 1 |
| Maximum continuous reverse voltage | VR |  |  | 1000 | V |  | 1 |
| Maximum average forward rectified current | IO |  |  | 2 | A |  | 1 |
| Non-repetitive peak forward surge current | IFSM |  |  | 50 | A | 8.3ms single half sine-wave (JEDEC method) | 1 |
| Typical junction capacitance | CJ |  | 30 |  | pF | Measured at 1MHz, applied reverse voltage 4.0V D.C (Note 1) | 1 |
| Maximum reverse leakage current at TJ=25°C | IR |  |  | 5 | μA | TJ=25°C, at rated VR | 1 |
| Maximum reverse leakage current at TJ=125°C | IR |  |  | 50 | μA | TJ=125°C, at rated VR | 1 |
| Operating junction temperature range | TJ | -55 |  | 150 | °C |  | 1 |
| Storage temperature range | TSTG | -65 |  | 175 | °C |  | 1 |
| Typical thermal resistance junction to ambient | RθJA |  | 48 |  | °C/W | Mounted on FR-4 PCB copper, minimum recommended pad layout (Note 2) | 1 |
| Typical thermal resistance junction to case | RθJC |  | 26 |  | °C/W | Mounted on FR-4 PCB copper, minimum recommended pad layout (Note 2) | 1 |

## CAD (KiCad official)

- Symbol: `MRA4007T3G-FS`
- Footprint: `Diode_SMD:D_SMA`
- 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
- 3D model files: `mra4007t3g-fs-etched.step` / `mra4007t3g-fs-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mra4007t3g-fs.step` / `mra4007t3g-fs.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [FUXINSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8757278599257047040) (4 pp, sha256 `0af97ea408ba5661`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/mra4007t3g-fs-datasheet.pdf)