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MPQ6626GF-AEC1-Z

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Monolithic Power Systems Gate Drive ICs, TSSOP-28-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MPQ6626GF-AEC1-Z

Monolithic Power Systems · Gate Drive ICs · TSSOP-28-EP

MPQ6626GF-AEC1-Z from Monolithic Power Systems, in a TSSOP-28-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connection.
2 GND power_in Ground.
3 OUT1 output Half-bridge output 1.
4 OUT5 output Half-bridge output 5.
5 NC unconnected No connection.
6 DI input Serial data input, with an internal 125kΩ pull-down resistor.
7 VCC power_in Logic supply voltage, recommended 3.15V to 5.25V.
8 DO tri_state Serial data output, tri-state when CS is high.
9 EN input Enable pin: pull low to set standby mode, pull high for normal operation.
10 NC unconnected No connection.
11 OUT6 output Half-bridge output 6.
12 OUT4 output Half-bridge output 4.
13 GND power_in Ground.
14 NC unconnected No connection.
15 NC unconnected No connection.
16 GND power_in Ground.
17 OUT3 output Half-bridge output 3.
18 NC unconnected No connection.
19 VS2 power_in Power supply for drivers 3, 4 and 6; connect to VS1 externally (5.5V to 40V operating).
20 TEST passive Test pin for internal use; connect to ground.
21 TEST passive Test pin for internal use; connect to ground.
22 CS input Chip select input, active low.
23 CLK input Serial clock input, up to 5MHz.
24 VS1 power_in Power supply for drivers 1, 2 and 5, all pre-drivers and the charge pump; connect to VS2 externally.
25 NC unconnected No connection.
26 OUT2 output Half-bridge output 2.
27 GND power_in Ground.
28 NC unconnected No connection.
29 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Monolithic Power Systems
Package TSSOP-28-EP
Category Power Management
Pins 29

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating supply current (VS) IVSO 5.5 6.5 mA VVS < 28V, EN = VCC, no load 6
Operating supply current (VCC) IVCCO 100 150 μA 3.15V < VVCC < 5.25V, EN = high, DI = CLK = low, CS = high, no load 6
Quiescent current (VS) IVSQ 1 5 μA VVS = 13.2V, VVCC = 0V or VVCC = 5V, EN = low 6
Quiescent current (VCC) IVCCQ 1 5 μA 3.15V < VVCC < 5.25V, EN = low, DI = CLK = low, CS = high 6
Discharge current (VSx) IVS 3 mA VVS = 40V, EN = low 6
Power-on reset threshold VVCC 2.3 2.7 3 V VCC increasing 6
Power-on reset delay 30 100 160 μs After switching on VVCC 6
VS under-voltage lockout threshold VVS 3.5 4.5 V VS decreasing 6
VS under-voltage lockout threshold hysteresis VUVOFF 0.1 0.3 0.5 V 6
VS under-voltage lockout delay time 7 21 ms 6
VS over-voltage lockout threshold VOVOFF 33 36 39 V OVLO = 1, VS increasing 6
VS over-voltage lockout threshold hysteresis 1 2.5 4 V 6
HS + LS switch on resistance RDS(ON) 1.3 2.2 Ω TJ = -40°C to +125°C 6
HS + LS switch on resistance RDS(ON) 2.8 Ω TJ = 150°C 6
Over-current limit IOCP 1 1.3 2.5 A VVS = 13.2V 6
Over-current shutdown delay time tDOC 10 25 50 μs 6
Open load detection current IOLD 1 16 45 mA VVS = 13.2V, LS switch on 6
Open load delay time tDOLD 200 350 600 μs 6
Output enable time 50 65 μs VVS = 13.2V, RLOAD = 50Ω 6
Output disable time 50 65 μs VVS = 13.2V, RLOAD = 50Ω 6
Delay time HBCNFx high to OUTx high 75 105 μs VVS = 13.2V, RLOAD = 50Ω 6
Delay time HBCNFx low to OUTx low 65 95 μs VVS = 13.2V, RLOAD = 50Ω 6
Output rise time 13 27 42 μs VVS = 13.2V, 10% to 90% VOUT, RLOAD = 50Ω 6
Output fall time 11 20 27 μs VVS = 13.2V, 10% to 90% VOUT, RLOAD = 50Ω 6
Dead time 1.5 μs VVS = 13V, RLOAD = 50Ω 7
EN low-level threshold 0.6 V 7
EN high-level threshold 2 V 7
EN threshold hysteresis 0.4 V 7
EN pull-down resistor 125 kΩ VEN = VVCC 7
Input low-level threshold (DI, CLK, CS) 0.6 V 7
Input high-level threshold (DI, CLK, CS) 2 V 7
Input threshold hysteresis (DI, CLK, CS) 150 mV 7
Pull-down resistor of DI, CLK pin 125 kΩ VDI, VCLK = VVCC 7
Pull-up current of CS pin 125 kΩ VCS = 0V 7
Input capacitance CIN 15 pF Not tested in production 7
DO low-level output 0.4 V 7
DO leakage current (tri-state) -5 5 μA 0V < VDO < VVCC, VCS = VVCC 7
Thermal pre-warning threshold TJW 120 140 170 °C Not tested in production 7
Thermal shutdown threshold TJSD 150 175 200 °C Not tested in production 7
Ratio thermal shutdown/thermal pre-warning 1.05 1.2 Not tested in production 7
CLK frequency fCLK 5 MHz 8
CLK period time tPCLK 200 ns VCC = 5V 8
CLK period time tPCLK 500 ns VCC = 3.3V 8
CLK high time t5 85 ns 8
DI set-up time t11 50 ns 8
CS high time t9 5 μs 8
DO valid time t10 20 50 ns CDO = 40pF 8
Supply voltage VVS 45 V 5
Output voltage VOUTx -0.3 V -0.3V to VVS + 0.3V 5
Logic supply voltage VVCC -0.3 6 V 5
Junction temperature TJ 150 °C 5
Storage temperature -65 150 °C 5
Supply voltage VVS 5.5 40 V 5
Logic supply voltage VVCC 3.15 5.25 V 5
Operating junction temperature TJ -40 150 °C 5
Junction-to-case thermal resistance θJC 6 °C/W TSSOP-28EP, JESD51-7 4-layer PCB 5

CAD (KiCad official)

  • Symbol: MPQ6626GF-AEC1-Z
  • Footprint: Package_SO:TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm
  • 3D model: TSSOP-28-EP (KiCad packages3D, STEP)
  • 3D model files: mpq6626gf-aec1-z-etched.step / mpq6626gf-aec1-z-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mpq6626gf-aec1-z.step / mpq6626gf-aec1-z.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Monolithic Power Systems datasheet (22 pp, sha256 d705b31b96f93ce1, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF