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Ray Publish 0.1.0 b07c315 15d ago

MPQ4559DN-LF-Z

Monolithic Power Systems · DC-DC Converters · SOIC-8-EP

MPQ4559DN-LF-Z from Monolithic Power Systems, in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SW output Switch node output from the high-side switch; a low VF Schottky rectifier to ground is required and must be placed close to the SW pin to reduce switching spikes.
2 EN input Enable input; pull below the specified threshold to shut down the chip, pull above the threshold or leave floating to enable it.
3 COMP passive Compensation pin, the output of the GM error amplifier, where control loop frequency compensation is applied.
4 FB input Feedback input to the error amplifier; sets the regulator voltage by comparing an external resistive divider tap to the internal 0.8V reference.
5 GND power_in Ground, also the exposed pad; connect close to the output capacitor avoiding high-current switch paths, and connect the exposed pad to the GND plane for optimal thermal performance.
6 FREQ passive Switching frequency program input; connect a resistor from this pin to ground to set the switching frequency.
7 VIN power_in Input supply (3.8V to 55V recommended) powering all internal control circuitry, both BS regulators and the high-side switch; place a decoupling capacitor to ground close to this pin.
8 BST passive Bootstrap positive supply for the internal floating high-side MOSFET driver; connect a bypass capacitor between this pin and SW.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Monolithic Power Systems
Package SOIC-8-EP
Category Power Management (PMIC)
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Feedback Voltage VFB 0.78 0.8 0.82 V 4.5V < VIN < 55V, TJ = 25C 3
Feedback Voltage VFB 0.772 0.829 V 4.5V < VIN < 55V, -40C ≤ TJ ≤ 85C 3
Feedback Voltage VFB 0.766 0.829 V 4.5V < VIN < 55V, -40C ≤ TJ ≤ 125C 3
Feedback Leakage Current IFB 0.1 1 μA 3
Upper Switch On Resistance RDS(ON) 175 250 330 mΩ VBST, VSW = 5V, TJ = 25C 3
Upper Switch On Resistance (full temp) RDS(ON) 160 400 mΩ VBST, VSW = 5V 3
Upper Switch Leakage ISW 1 μA VEN = 0V, VSW = 0V 3
Current Limit ILIM 1.9 2.3 4.5 A TJ = 25C, Duty Cycle ≤ 60% 3
Current Limit (full temp) ILIM 1.8 4.7 A Duty Cycle ≤ 60% 3
VIN UVLO Threshold 2.7 3 3.3 V TJ = 25C 3
VIN UVLO Threshold (full temp) 2.4 3 3.6 V 3
Soft-Start Time 0.19 0.5 ms 0V < VFB < 0.8V 3
Oscillator Frequency fSW 0.8 1 1.2 MHz RFREQ = 95kΩ, TJ = 25C 3
Oscillator Frequency (full temp) fSW 0.7 1.3 MHz RFREQ = 95kΩ 3
Shutdown Supply Current IS 12 20 µA VEN < 0.3V 3
Quiescent Supply Current IQ 140 200 µA No load, VFB = 0.9V (no switching) 3
EN Rising Threshold 1.4 1.55 1.7 V TJ = 25C 3
EN Rising Threshold (full temp) 1.3 1.8 V 3
COMP to Current Sense Transconductance GCS 5.7 A/V 3
Error Amp Voltage Gain 400 V/V 3
Error Amp Transconductance 120 µA/V ICOMP = ±3µA 3
Error Amp Min Source current 10 µA VFB = 0.7V 3
Error Amp Min Sink current -10 µA VFB = 0.9V 3
VIN UVLO Hysteresis 0.35 V 3
Thermal Shutdown 150 C Hysteresis = 20C 3
Minimum Off Time TOFF 100 ns 3
Minimum On Time TON 100 ns 3
EN Threshold Hysteresis 320 mV 3
Supply Voltage VIN -0.3 60 V 2
BST to SW -0.3 5 V 2
All Other Pins -0.3 5 V 2
Continuous Power Dissipation SOIC8E 2.5 W TA = +25°C 2
Junction Temperature TJ 150 °C 2
Storage Temperature -65 150 °C 2
Supply Voltage VIN VIN 3.8 55 V 2
Output Voltage VOUT VOUT 0.8 52 V 2
Operating Junction Temperature TJ -40 125 °C 2
Thermal Resistance Junction-Ambient SOIC8 (Exposed Pad) θJA 50 °C/W Measured on JESD51-7 4-layer board 2
Thermal Resistance Junction-Case SOIC8 (Exposed Pad) θJC 10 °C/W Measured on JESD51-7 4-layer board 2

CAD (KiCad official)

  • Symbol: MPQ4559DN-LF-Z
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: SOIC-8-EP (KiCad packages3D, STEP)
  • 3D model files: mpq4559dn-lf-z-etched.step / mpq4559dn-lf-z-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mpq4559dn-lf-z.step / mpq4559dn-lf-z.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Monolithic Power Systems datasheet (19 pp, sha256 022a6df274a2c6c7, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF