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MPQ4420GJ-AEC1-Z

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Monolithic Power Systems DC-DC Converters, TSOT-23-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MPQ4420GJ-AEC1-Z

Monolithic Power Systems · DC-DC Converters · TSOT-23-8

MPQ4420GJ-AEC1-Z from Monolithic Power Systems, in a TSOT-23-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 PG output Power Good open-drain output that goes high when the output voltage exceeds 90% of the nominal voltage.
2 IN power_in Supply voltage input operating from 4V to 30V, requiring input capacitor C1 for decoupling and a wide PCB trace.
3 SW power_out Switch output node, to be connected using a wide PCB trace.
4 GND power_in System ground and reference ground of the regulated output voltage, connected with copper traces and vias with careful PCB layout.
5 BST passive Bootstrap pin requiring a capacitor between SW and BST to form the floating high-side driver supply, with a 20Ω resistor in series with the capacitor strongly recommended to reduce SW spike voltage.
6 EN/SYNC input Enable input (high enables the device) that also accepts an external clock of 200kHz to 2.2MHz to set the switching frequency.
7 VCC power_out Bias supply (internal regulator output) to be decoupled with a 0.1μF to 0.22μF capacitor not exceeding 0.22μF.
8 FB input Feedback input connected to the tap of an external resistor divider from the output to GND to set the output voltage, with frequency fold-back when FB is below 660mV.

Key specifications

Parameter Value
Manufacturer Monolithic Power Systems
Package TSOT-23-8
Category Power Management
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Current (Quiescent) IQ 0.5 0.7 mA VEN = 2V, VFB = 1V 4
Supply Current (Shutdown) ISHDN 8 μA VEN = 0V 4
HS Switch-ON Resistance RON_HS 90 155 mΩ VBST-SW=5V 4
LS Switch-ON Resistance RON_LS 55 105 mΩ VCC =5V 4
Switch Leakage ILKG_SW 1 μA VEN = 0V, VSW =12V 4
Current Limit ILIMIT 3 4.2 5.5 A Under 40% Duty Cycle 4
Oscillator Frequency fSW 320 410 500 kHz VFB=750mV 4
Fold-Back Frequency fFB 70 100 130 kHz VFB<400mV 4
Maximum Duty Cycle DMAX 92 95 % VFB=750mV, 410kHz 4
Sync Frequency Range fSYNC 0.2 2.4 MHz 4
Feedback Voltage VFB 780 792 804 mV TJ=25°C 4
Feedback Voltage VFB 776 808 mV 4
Feedback Current IFB 10 100 nA VFB=820mV 4
EN Rising Threshold VEN_RISING 1.15 1.4 1.65 V 4
EN Falling Threshold VEN_FALLING 1.05 1.25 1.45 V 4
EN Input Current IEN 4 6 μA VEN=2V 4
EN Input Current IEN 0 0.2 μA VEN=0 4
VIN Under-Voltage Lockout Threshold-Rising INUVRISING 3.3 3.5 3.7 V 4
VIN Under-Voltage Lockout Threshold-Falling INUVFALLING 3.1 3.3 3.5 V 4
VCC Regulator VCC 4.6 4.9 5.2 V ICC=0mA 4
VCC Load Regulation 1.5 4 % ICC=5mA 4
Soft-Start Period tSS 0.55 1.45 2.45 ms VOUT from 10% to 90% 4
Thermal Shutdown 150 170 °C Derived from bench characterization. Not tested in production 4
PG Rising Threshold PGVth_RISING 86.5 90 93.5 % as percentage of VFB 4
PG Falling Threshold PGVth_FALLING 80.5 84 87.5 % as percentage of VFB 4
PG Rising Delay PGTd_RISING 40 90 160 μs 5
PG Falling Delay PGTd_FALLING 30 55 95 μs 5
PG Sink Current Capability VPG 0.1 0.3 V Sink 4mA 5
PG Leakage Current ILKG_PG 10 100 nA 5
Minimum ON Time tON_MIN 70 ns Derived from bench characterization. Not tested in production 4
EN Threshold Hysteresis VEN_HYS 150 mV 4
VIN Under-Voltage Lockout Threshold-Hysteresis INUVHYS 200 mV 4
Thermal Hysteresis 30 °C Derived from bench characterization. Not tested in production 4
PG Threshold Hysteresis PGVth_HYS 6 % as percentage of VFB 5
Input Voltage VIN -0.3 40 V 3
Switch Voltage VSW -0.3 41 V 3
All Other Pins -0.3 6 V 3
Continuous Power Dissipation 1.25 W TA = +25°C, TSOT23-8 3
Junction Temperature TJ 150 °C 3
Storage Temperature -65 150 °C 3
Continuous Supply Voltage VIN 4 30 V 3
Output Voltage VOUT 0.8 V 0.8V to 0.9xVIN 3
Operating Junction Temperature TJ -40 150 °C 3
Thermal Resistance Junction-to-Ambient θJA 100 °C/W TSOT23-8, JESD51-7 4-layer PCB 3
Thermal Resistance Junction-to-Case θJC 55 °C/W TSOT23-8, JESD51-7 4-layer PCB 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper 4 GND System Ground. This pin is the reference ground of the regulated output voltage, and PCB layout requires special care. For best results, connect to GND with copper traces and vias. 6

CAD (KiCad official)

  • Symbol: MPQ4420GJ-AEC1-Z
  • Footprint: Package_TO_SOT_SMD:TSOT-23-8
  • 3D model: TSOT-23-8 (KiCad packages3D, STEP)
  • 3D model files: mpq4420gj-aec1-z-etched.step / mpq4420gj-aec1-z-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mpq4420gj-aec1-z.step / mpq4420gj-aec1-z.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Monolithic Power Systems datasheet (20 pp, sha256 364317dbc2502319, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF