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MPQ3367AGR-AEC1-Z

Monolithic Power Systems · LED Drivers · QFN-24(4x4)

MPQ3367AGR-AEC1-Z from Monolithic Power Systems, in a QFN-24(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 DIM input PWM signal input for brightness control; DIM is pulled low internally and a 100Hz to 20kHz PWM signal is recommended.
2 MIX/AD passive Dimming-mode setting pin with an 18μA current-source output; below 0.3V selects mix dimming, 0.5V to 0.8V selects PWM dimming, 1.0V to 1.3V selects analog dimming, and floating uses the internal MODE register.
3 FREQ/SYNC input Switching frequency is set by a resistor to GND or the boost frequency is synchronized by an external clock; float this pin if the frequency is set by FSW1:0.
4 EN input IC enable pin; pull high to enable the IC and pull low to shut it down.
5 SCL/PSE bidirectional I2C clock pin; connect to SDA/PSE and pull up between 0.75V and 1V to enable phase-shift PWM dimming, and do not float the pin if unused (tie to a high level or GND).
6 SDA/PSE bidirectional I2C data pin; connect to SCL/PSE and pull up between 0.75V and 1V to enable phase-shift PWM dimming, and do not float the pin if unused (tie to a high level or GND).
7 COMP passive Compensation pin for the boost converter loop.
8 FF output Fault flag pin; open drain during normal operation and pulled low when a fault occurs.
9 ISET passive LED current setting pin; a current-setting resistor from ISET to GND configures the current in each LED string.
10 AGND power_in Analog ground pin.
11 LED6 passive LED string 6 current input; connect the string 6 cathode to this pin, or tie to GND if unused.
12 LED5 passive LED string 5 current input; connect the string 5 cathode to this pin, or tie to GND if unused.
13 LED4 passive LED string 4 current input; connect the string 4 cathode to this pin, or tie to GND if unused.
14 LED3 passive LED string 3 current input; connect the string 3 cathode to this pin, or tie to GND if unused.
15 LED2 passive LED string 2 current input; connect the string 2 cathode to this pin, or tie to GND if unused.
16 LED1 passive LED string 1 current input; connect the string 1 cathode to this pin, or tie to GND if unused.
17 PGND power_in Step-up converter power ground pin.
18 SW passive Drain pin of the internal low-side MOSFET; connect the power inductor to SW, with VSW rated -0.5V to 50V and -1.0V for less than 100ns.
19 OVP input Over-voltage protection setting pin; a resistor divider from VOUT to OVP and from OVP to GND sets the OVP threshold.
20 STH passive Short LED protection threshold pin with an 18μA current-source output; a resistor sets its voltage, and the pin should float to use the internal TH_S1:0 threshold.
21 ADR passive IC address setting pin with an 18μA pull-up current; floating sets 0x38, below 0.4V sets 0x3A, and 0.4V to 1.4V sets 0x39.
22 VCC power_out 5V LDO output that powers the internal logic and gate driver; place a ceramic capacitor as close to this pin as possible.
23 SD output External disconnect PMOS gate drive pin used to turn off the external PMOS if a fault occurs; float the pin if it is not used.
24 VIN power_in Power supply input for the IC; recommended operating supply range is 3.5V to 36V.
25 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Monolithic Power Systems
Package QFN-24(4x4)
Category LED Drivers
Pins 25

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage (VIN) absolute maximum VIN -0.3 42 V 7
VSW, VLED1 to VLED6 voltage VSW, VLED1-VLED6 -0.5 50 V 7
VSW transient voltage VSW -1 V for <100ns 7
All other pins voltage -0.3 6 V 7
Junction temperature 150 °C 7
Lead temperature 260 °C 7
Storage temperature -65 150 °C 7
Continuous power dissipation QFN-24 (4mmx4mm) PD 2.97 W TA = 25°C 7
ESD HBM LED1~6 -7 7 kV Human body model 7
ESD HBM all other pins -4 4 kV Human body model 7
ESD CDM -2 2 kV Charged device model 7
Supply voltage (VIN) recommended VIN 3.5 36 V 7
Operating junction temperature (TJ) recommended TJ -40 125 °C 7
Operating input voltage VIN 3.5 36 V 8
Switching frequency RFREQ = 10kΩ fSW 1.98 2.2 2.42 MHz RFREQ = 10kΩ 8
Switching frequency RFREQ = 40kΩ fSW 495 550 605 kHz RFREQ = 40kΩ 8
Switching frequency FSW1:0 = 01, FREQ floating fSW 340 400 460 kHz FSW1:0 = 01, FREQ floating 8
FREQ voltage VFREQ 0.57 0.6 0.63 V 8
PSE active threshold VPSE 0.75 0.9 1 V Phase shift enabled 8
MIX/AD input middle threshold VMIX_MID 0.5 0.8 V PWM dimming threshold 8
MIX/AD input high threshold VMIX_HI 1 1.3 V Analog dimming threshold 8
LEDx regulation voltage at ILED = 100mA VHD 850 1000 mV ILED = 100mA 9
Current matching at ILED = 20mA -2.5 2.5 % ILED = 20mA 9
Current matching at ILED = 100mA -2.5 2.5 % ILED = 100mA 9
LED current at RISET = 24.9kΩ ILED 48.75 50 51.25 mA RISET = 24.9kΩ, TJ = 25°C 9
LED current at 1/50 x 50mA ILED 0.9 1.05 1.2 mA ILED = 1/50 x 50mA = 1mA 9
Over-voltage protection threshold VOVP 1.9 2 2.1 V 9
Supply current (quiescent) IQ 5 mA No switching 8
Supply current (shutdown) IST 1 μA VEN = 0V, VIN = 12V 8
Input UVLO threshold VIN_UVLO 3.1 V Rising edge 8
Input UVLO hysteresis 100 mV 8
LDO output voltage VCC 5 V VEN = 2V, 6V < VIN < 24V, 0 < IVCC < 10mA 8
EN on threshold VEN_ON 1.2 V VEN rising 8
EN off threshold VEN_OFF 0.4 V VEN falling 8
Low-side MOSFET on resistance RDS_LS 100 mΩ VIN = 12V 8
SW leakage current ISW_LK 1 μA VSW = 45V 8
Maximum duty cycle DMAX 90 % fSW = 1MHz 8
Cycle-by-cycle current limit ISW_LIMIT 2.6 A TJ = 25°C, Duty = 90% 8
Cycle-by-cycle current limit ISW_LIMIT 2.3 A Duty = 90% 8
Latch off current limit protection ICL 7.5 A To trigger current limit protection 8
SYNC input low threshold VSYNC_LO 0.4 V VSYNC falling 8
SYNC input high threshold VSYNC_HI 1.2 V VSYNC rising 8
COMP trans-conductance GCOMP 100 μA/V ΔICOMP ≤ 10μA 8
COMP source current limit ICOMP_SO 90 μA 8
COMP sink current limit ICOMP_SI 30 μA 8
DIM input low threshold VDIM_LO 0.4 V VDIM falling 8
DIM input high threshold VDIM_HI 1.2 V VDIM rising 8
MIX/AD input low threshold VMIX_LO 0.3 V Mix dimming threshold 8
Mix dimming transfer point MIXTP 25 % MIXTP = 0 9
LEDx regulation voltage at ILED = 20mA VHD 350 mV ILED = 20mA 9
ISET voltage VISET 1.2 V 9
OVP hysteresis 200 mV 9
LEDx over-voltage threshold VLEDX_OV 5 V TH_S bits= 01 9
Thermal shutdown threshold rising edge TST 170 °C Rising edge 9
SD pull-down current ISD 60 μA 9
I2C input logic low VIL 0.4 V 9
I2C input logic high VIH 1.2 V 9
I2C output logic low VOL 0.4 V ILOAD = 3mA 9
Thermal resistance junction-to-ambient QFN-24 θJA 42 °C/W Measured on JESD51-7, 4-layer PCB 7
Thermal resistance junction-to-case QFN-24 θJC 9 °C/W 7

CAD (KiCad official)

  • Symbol: MPQ3367AGR-AEC1-Z
  • Footprint: Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
  • 3D model: QFN-24(4x4) (KiCad packages3D, STEP)
  • 3D model files: mpq3367agr-aec1-z-etched.step / mpq3367agr-aec1-z-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mpq3367agr-aec1-z.step / mpq3367agr-aec1-z.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Monolithic Power Systems datasheet (29 pp, sha256 430d809499d8df8b, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF