main
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 13d ago
viewers mp8774hgq-z: viewers · Ray 13d ago
mp8774hgq-z-etched.glb Publish 0.1.0 · Ray 13d ago
mp8774hgq-z-etched.step mp8774hgq-z: factory component page (tier=lcsc) · Ray 13d ago
mp8774hgq-z-hero.glb mp8774hgq-z: hero GLB from the etched model (keeps the MPN mark) · Ray 13d ago
mp8774hgq-z-hero.overlay.json Publish 0.1.0 · Ray 13d ago
mp8774hgq-z.glb Publish 0.1.0 · Ray 13d ago
mp8774hgq-z.kicad_mod Publish 0.1.0 · Ray 13d ago
mp8774hgq-z.kicad_sym Publish 0.1.0 · Ray 13d ago
mp8774hgq-z.lbr Publish 0.1.0 · Ray 13d ago
mp8774hgq-z.step Publish 0.1.0 · Ray 13d ago
package.json Publish 0.1.0 · Ray 13d ago
page.json Set visibility: public · Ray 13d ago
README.md Publish 0.1.0 · Ray 13d ago

MP8774HGQ-Z

Monolithic Power Systems · DC-DC Converters · QFN-16(3x3)

MP8774HGQ-Z from Monolithic Power Systems, in a QFN-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connection; NC must be left floating.
2 BST power_out Bootstrap; a capacitor between SW and BST forms the floating high-side driver supply, and a BST resistor below 4.7Ω is recommended.
3 EN input Enable; pull EN high to enable the device (rising threshold 1.25V typical, falling threshold 1V typical), and when floating it is pulled down to GND by an internal 3.3MΩ resistor.
4 FB input Feedback; sets the output voltage when connected to the tap of an external resistor divider between the output and GND.
5 AGND power_in Signal ground, not connected to system ground internally, so it must be tied to system ground in the PCB layout.
6 SS passive Soft start; a capacitor across SS and GND sets the soft-start time and avoids inrush current at start-up, and an SS capacitor below 4.7nF should be avoided.
7 PG output Power good open-drain output that changes state when UVP, OCP, OTP, or OV occurs.
8 VIN power_in Supply voltage input operating from a 3V to 18V rail, decoupled by capacitor C1 and connected with a wide PCB trace.
9 PGND power_in System ground and reference ground of the regulated output voltage, recommended to be connected to GND with copper and vias.
10 PGND power_in System ground and reference ground of the regulated output voltage, recommended to be connected to GND with copper and vias.
11 PGND power_in System ground and reference ground of the regulated output voltage, recommended to be connected to GND with copper and vias.
12 PGND power_in System ground and reference ground of the regulated output voltage, recommended to be connected to GND with copper and vias.
13 PGND power_in System ground and reference ground of the regulated output voltage, recommended to be connected to GND with copper and vias.
14 VCC power_out Internal 3.4V bias supply output that must be decoupled with a 1µF capacitor placed close to VCC and GND.
15 NC unconnected No connection; NC must be left floating.
16 SW output Switch output that must be connected with a wide PCB trace.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Monolithic Power Systems
Package QFN-16(3x3)
Category Power Management (PMIC)
Pins 17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (VIN) absolute maximum VIN -0.3 20 V 3
Switch output voltage VSW (DC) VSW -0.3 V upper limit printed as VIN + 0.7V 3
Switch output voltage VSW transient undershoot VSW -5 V < 10ns 3
Switch output voltage VSW transient overshoot VSW 23 V < 10ns 3
All other pins voltage -0.3 4 V 3
Continuous power dissipation 3.2 W TA = 25°C 3
Junction temperature 150 °C 3
Storage temperature -65 125 °C 3
Supply voltage (VIN) VIN 3 18 V 3
Output voltage (VOUT) VOUT 0.6 12 V upper limit printed as VIN * DMAX or 12V max 3
Operating junction temperature (TJ) TJ -40 125 °C 3
Input voltage range VIN 3 18 V 4
Supply current (shutdown) IIN 5 µA VEN = 0V 4
Supply current (quiescent) IQ 100 150 µA VEN = 2V, VFB = 0.65V 4
Switch leakage SWLKG 1 µA VEN = 0V, VSW = 17V, TJ = 25°C 4
Valley current limit ILIMIT_VY 12 14 A 4
Switching frequency fSW 1200 1400 1600 kHz 4
Feedback voltage (TJ = 25°C) VFB 594 600 606 mV TJ = 25°C 4
Feedback voltage (TJ = -40°C to +125°C) VFB 591 600 609 mV TJ = -40°C to +125°C 4
Feedback current IFB 10 50 nA VFB = 700mV 4
Soft-start current ISS_START 4 6 8 µA 4
EN rising threshold VEN RISING 1.1 1.25 1.4 V 4
EN falling threshold VEN FALLING 0.9 1 1.1 V 4
VCC under-voltage lockout threshold rising VCCVth 2.6 2.8 3 V 4
Power good UV rising threshold PGUVvth_Hi 0.85 0.9 0.95 VFB 5
Power good UV falling threshold PGUVvth_Lo 0.75 0.8 0.85 VFB 5
Power good OV rising threshold PGOVvth_Hi 1.15 1.2 1.25 VFB 5
Power good OV falling threshold PGOVvth_Lo 1.05 1.1 1.15 VFB 5
Power good sink current capability VPG Sink 0.4 V Sink 4mA 5
Switch on resistance (HS) HSRDS(ON) 16 mΩ VBST-SW = 3.3V 4
Switch on resistance (LS) LSRDS(ON) 5.5 mΩ VCC = 3.3V 4
Short hiccup duty cycle DHICCUP 10 % 4
ZCD current IZCD 200 mA 4
Minimum on time tON_MIN 50 ns 4
Minimum off time tOFF_MIN 100 ns 4
EN pull-down resistor REN_PD 1.2 MΩ 4
VCC under-voltage lockout hysteresis VCCHYS 350 mV 4
VCC regulator output VCC 3.4 V 4
VCC load regulation RegVCC 3 % ICC = 5mA 4
Power good delay PGTd 50 µs Both edges 5
Power good leakage current IPG_LEAK 10 μA VPG = 5V 5
Thermal shutdown TSD 150 °C 5
Thermal hysteresis TSD-HYS 20 °C 5
Thermal resistance junction-to-ambient (QFN-16, EV8774H-Q-00A 4-layer PCB) θJA 38 °C/W EV8774H-Q-00A, 4-layer PCB 3
Thermal resistance junction-to-case (QFN-16, EV8774H-Q-00A) θJC 10 °C/W EV8774H-Q-00A 3
Thermal resistance junction-to-ambient (QFN-16, JESD51-7) θJA 50 °C/W JESD51-7 JEDEC board, simulated 3
Thermal resistance junction-to-case (QFN-16, JESD51-7) θJC 12 °C/W JESD51-7 JEDEC board, simulated 3

CAD (KiCad official)

  • Symbol: MP8774HGQ-Z
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: QFN-16(3x3) (KiCad packages3D, STEP)
  • 3D model files: mp8774hgq-z-etched.step / mp8774hgq-z-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mp8774hgq-z.step / mp8774hgq-z.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Monolithic Power Systems datasheet (23 pp, sha256 008cd9554ecb7672, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF