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MP6538GV-Z

MPS(芯源) · IC · QFN-28(4x5)

MP6538GV-Z from MPS(芯源), in a QFN-28(4x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground reference pin for the device.
2 VIN power_in Input supply voltage, recommended +8V to 100V with an absolute maximum of 110V.
3 CSO output Current-sense amplifier output that amplifies the LSS voltage by 20 and needs at least 1nF from CSO to ground for stability; it also sets the OCP off time.
4 LDO power_out Gate-drive LDO output that also serves as the base drive for an external NPN transistor when more than about 5mA is needed.
5 VREG power_in Gate driver supply voltage, recommended +8.5V to 14V, with an absolute maximum of 14.5V.
6 BSTA power_out Bootstrap output for phase A, rated for -0.3V to 120V.
7 SHA passive High-side source connection for phase A, rated for -5V to 110V.
8 GHA output High-side gate drive output for phase A, limited to (BST-SH) + 0.3V.
9 GLA output Low-side gate drive output for phase A, rated for -0.3V to 14.5V.
10 BSTB power_out Bootstrap output for phase B, rated for -0.3V to 120V.
11 SHB passive High-side source connection for phase B, rated for -5V to 110V.
12 GHB output High-side gate drive output for phase B, limited to (BST-SH) + 0.3V.
13 GLB output Low-side gate drive output for phase B, rated for -0.3V to 14.5V.
14 BSTC power_out Bootstrap output for phase C, rated for -0.3V to 120V.
15 SHC passive High-side source connection for phase C, rated for -5V to 110V.
16 GHC output High-side gate drive output for phase C, limited to (BST-SH) + 0.3V.
17 GLC output Low-side gate drive output for phase C, rated for -0.3V to 14.5V.
18 LSS passive Low-side source connection that feeds the current-sense amplifier; rated for -0.3V to 4V (-1V to 4V for 2µs transients).
19 HC input Phase C Hall-sensor input, which is one of three Hall inputs spaced at 120° for commutation.
20 HB input Phase B Hall-sensor input, which is one of three Hall inputs spaced at 120° for commutation.
21 HA input Phase A Hall-sensor input, which is one of three Hall inputs spaced at 120° for commutation.
22 nBRAKE input Active-low brake input; when low, all low-side gates are turned on, with logic thresholds VIL 0.8V max and VIH 2V min.
23 PWM input External PWM input for speed and torque control, with logic thresholds VIL 0.8V max and VIH 2V min.
24 DIR input Logic input that determines the direction of the motor torque output.
25 nFAULT output Open-drain fault output that is driven low during an OCP, over-temperature or UVLO-related fault condition, with VOL of 0.1V max at 5mA.
26 nSLEEP input Sleep mode input where logic low enters low-power sleep and high enables the device, with an internal 450kΩ pull-down.
27 OCREF input Over-current protection reference input, with a recommended range of 0.125V to 2.4V.
28 DT passive Dead-time setting pin where a resistor from DT to GND sets tDEAD = 0.044×R(kΩ) + 0.1 µs.
29 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer MPS(芯源)
Package QFN-28(4x5)
Category
Pins 29

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage (VIN) VIN -0.3 110 V 3
Input voltage VREG, GLA/B/C -0.3 14.5 V 3
LDO -0.3 14.5 V 3
BSTA/B/C -0.3 120 V 3
GHA/B/C -0.3 V max printed as (BST-SH) + 0.3V 3
GHA/B/C transient -8 V transient 2µs; max printed as (BST-SH) + 0.3V 3
LSS -0.3 4 V 3
LSS transient -1 4 V transient 2µs 3
SHA/B/C -5 110 V 3
SHA/B/C transient -8 110 V transient 2µs 3
All other pins to GND -0.3 6.5 V 3
Continuous power dissipation QFN-28 (4mmx5mm) 3.1 W TA = +25°C 3
Storage temperature -55 150 °C 3
Junction temperature 150 °C 3
Lead temperature (solder) 260 °C 3
Input voltage (VIN) VIN 8 100 V 3
Input voltage (VREG) VREG 8.5 14 V 3
OCREF voltage (VOC) VOC 0.125 2.4 V 3
Operating junction temp (TJ) TJ -40 125 °C 3
Input supply voltage VIN 8 100 V 4
LDO output voltage VLDO 10.8 12 13.2 V ILDO ≤ 5mA, VIN > 15V 4
Gate driver supply voltage VREG 8.5 14 V 4
Logic input current high IIN(H) -2.4 2.4 µA VIH = 0.8V 4
Logic input current low IIN(L) -14 14 µA VIL = 5V 4
VREG UVLO rising threshold VREG_RUVLO 6.5 7.5 8.5 V 4
VREG UVLO falling threshold VREG_FUVLO 6 6.8 7.6 V 4
VIN UVLO rising threshold VVIN_RUVLO 3.6 4 4.4 V 4
VIN UVLO falling threshold VVIN_FUVLO 3.4 3.8 4.3 V 4
OCREF threshold VOC 0.8 1 1.2 V VOC = 1V 4
OCREF threshold VOC 2.18 2.4 2.62 V VOC = 2.4V 4
HS gate drive pull-down resistance RHS-DN 0.6 4.5 Ω VDS = 1V 4
LS gate drive pull-down resistance RLS-DN 0.6 4.5 Ω VDS = 1V 4
Quiescent current (nSLEEP=1) IQ 0.7 mA nSLEEP = 1, not switching 4
Sleep current ISLEEP 1 µA nSLEEP = 0 4
Input logic low threshold VIL 0.8 V 4
Input logic high threshold VIH 2 V 4
nSLEEP pull-down resistance RSLEEP-PD 450 kΩ 4
Internal pull-down resistance RPD 450 kΩ 4
Output low voltage (fault output) VOL 0.1 V IO = 5mA 4
Output high leakage current (fault output) IOH 1 µA VO = 3.3V 4
VREG UVLO hysteresis VREG_HYS 610 mV 4
VIN UVLO hysteresis VVIN_HYS 100 mV 4
VBST UVLO threshold VBST_UVLO 4 V Voltage between SHx and BSTx 4
OCP deglitch time tOC 2.7 µs 4
Sleep wake-up time tSLEEP 2 ms 4
Thermal shutdown TTSD 175 °C Guaranteed by design (note 5) 4
Thermal shutdown hysteresis TTSD_HYS 20 °C Guaranteed by design (note 5) 4
Bootstrap diode forward voltage VFBOOT 1.2 V ID = 10mA 4
Bootstrap diode forward voltage VFBOOT 2.3 V ID = 50mA 4
Maximum source current DSO 0.8 A Guaranteed by design (note 5) 4
Maximum sink current DSI 1 A Guaranteed by design (note 5) 4
Gate drive pull-up resistance RUP 7 Ω VDS = 1V 4
LS automatic turn-on time tLS 4.6 µs 4
Dead time tDEAD 560 ns RDT = 10kΩ 4
Dead time tDEAD 4.5 µs RDT = 100kΩ 4
Dead time tDEAD 77 ns DT tied to GND 4
Thermal resistance junction-to-ambient θJA 40 °C/W Measured on JESD51-7, 4-layer PCB (note 4) 3
Thermal resistance junction-to-case θJC 9 °C/W Measured on JESD51-7, 4-layer PCB (note 4) 3

CAD (KiCad official)

  • Symbol: MP6538GV-Z
  • Footprint: Package_DFN_QFN:QFN-28-1EP_4x5mm_P0.5mm_EP2.65x3.65mm
  • 3D model: QFN-28(4x5) (KiCad packages3D, STEP)
  • 3D model files: mp6538gv-z-etched.step / mp6538gv-z-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mp6538gv-z.step / mp6538gv-z.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MPS(芯源) datasheet (14 pp, sha256 420e9bf2c6fc49c3, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF