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MP2615CGQ-Z

MONOLITHIC POWER SYSTEMS · Battery Management · QFN-16(3x3)

MP2615CGQ-Z from MONOLITHIC POWER SYSTEMS, in a QFN-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SW output Switch output (buck converter switching node, connected to the inductor).
2 VIN power_in Power supply voltage; the datasheet recommends 4.75V to 18V operating input voltage.
3 VCC power_out Coarse regulator output internally generated at 4.5V; bypass with a 1µF capacitor to AGND and do not connect any external load to it.
4 CELL input Command input for the number of Li-ion cells: connect to VCC for single-cell, float or short to AGND for dual-cell.
5 SEL input Input for setting terminal battery voltage: low or floating gives 4.2V/cell, high gives 4.1V/cell.
6 EN input On/off control input pulled to GND through a 1MΩ internal resistor; a 100kΩ resistor in series with the EN pin is recommended.
7 N/C unconnected No connection; leave this pin floating.
8 AGND power_in Analog ground; connect AGND and PGND at a single point per the PCB layout guidelines.
9 BATT power_out Positive battery terminal, connected to the battery and the charge current-sense resistor.
10 CSP input Battery current-sense positive input; connect a resistor (RS1) between CSP and BATT.
11 CHGOK output Charging completion indicator, logic low while charging; becomes an open-drain output once charge is completed or suspended.
12 ACOK output Valid input supply indicator, open-drain; a logic low indicates a valid input power supply is present.
13 NTC input Thermistor input; connect a resistor from this pin to VCC and the thermistor from this pin to ground.
14 TMR passive Internal safety timer control; connect a capacitor from this pin to AGND to set the timer, or connect directly to AGND to disable the timer.
15 BST passive Bootstrap pin; a capacitor connected between SW and BST forms a floating supply for the high-side power switch driver.
16 PGND power_in Power ground.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer MONOLITHIC POWER SYSTEMS
Package QFN-16(3x3)
Category Power Management (PMIC)
Pins 17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage VIN 4.5 5 18 V VCELL = 4V 5
Input voltage VIN 8.75 12 18 V VCELL = 0V 5
Under-voltage lockout rising threshold VUVLO 3.55 3.75 3.95 V 5
Terminal battery voltage VBATT_FULL 4.168 4.2 4.231 V/cell VSEL = 0V 5
Terminal battery voltage VBATT_FULL 4.069 4.1 4.131 V/cell VSEL = 4V 5
Battery over-voltage threshold VBOVP 8.34 8.71 9.08 V VCELL = 0V, VSEL = 0V 5
Battery over-voltage threshold VBOVP 8.14 8.51 8.88 V VCELL = 0V, VSEL = 4V 5
Battery over-voltage threshold VBOVP 4.17 4.36 4.54 V VCELL = 4V, VSEL = 0V 5
Battery over-voltage threshold VBOVP 4.07 4.26 4.44 V VCELL = 4V, VSEL = 4V 5
Constant current charge current ICC 1.9 2.1 2.3 A RS1 = 25mΩ 5
Trickle charge current ITC 5 10 15 % of ICC 5
Termination current threshold IBF 5 10 15 % of ICC 5
Maximum current-sense voltage (CSP to BATT) VSENSE 47.5 52.5 57.5 mV 6
VCC output voltage VCC 4.2 4.5 4.75 V 6
EN input high voltage EN 1.9 V 6
NTC cold temp rising threshold VCOLD 72 73.3 74.6 % of VCC RNTC = NCP18X103, 0°C 6
NTC hot temp falling threshold VHOT 28 29.3 30.6 % of VCC RNTC = NCP18X103, 50°C 6
Switch node voltage VSW -0.3 23 V 4
Input voltage, ACOK and CHGOK pins (VIN) VIN -0.3 23 V 4
ACOK pin voltage VACOK -0.3 23 V 4
CHGOK pin voltage VCHGOK -0.3 23 V 4
Battery pin voltage VBATT -0.3 12 V 4
Current-sense positive pin voltage VCSP -0.3 12 V 4
All other pins voltage -0.3 6 V 4
Junction temperature 150 °C 4
Continuous power dissipation 2.5 W TA = 25°C 4
Operating temperature -40 85 °C 4
Input voltage VIN 4.75 18 V 4
Battery voltage VBATT 2 8.4 V 4
Operating junction temperature TJ -40 85 °C 4
Junction-to-ambient thermal resistance θJA 50 °C/W Measured on JESD51-7, 4-layer PCB 4
Junction-to-case thermal resistance θJC 12 °C/W Measured on JESD51-7, 4-layer PCB 4

CAD (KiCad official)

  • Symbol: MP2615CGQ-Z
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: QFN-16(3x3) (KiCad packages3D, STEP)
  • 3D model files: mp2615cgq-z-etched.step / mp2615cgq-z-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mp2615cgq-z.step / mp2615cgq-z.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MONOLITHIC POWER SYSTEMS datasheet (22 pp, sha256 e00963ef41742839, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF