component
MP2488DN-LF-Z
Public Made by Adomby adom
Monolithic Power Systems LED Drivers, SOIC-8-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMP2488DN-LF-Z
Monolithic Power Systems · LED Drivers · SOIC-8-EP
MP2488DN-LF-Z from Monolithic Power Systems, in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SW | power_out | Switch node output of the high-side switch; a low-VF Schottky rectifier to ground is required and must be placed close to this pin to reduce switching spikes. |
| 2 | EN | input | Enable input; pulling it below the specified threshold shuts the chip down, while pulling it above the threshold or leaving it floating enables the chip. |
| 3 | COMP | passive | Output of the GM error amplifier where control loop frequency compensation is applied; should not be pulled up beyond 2.6V. |
| 4 | FB | input | Feedback input to the error amplifier, connected to the LED current sensing resistor and compared to the internal 200mV reference to set the regulation current. |
| 5 | GND | power_in | Ground, to be connected close to the output capacitor avoiding high current switch paths; the exposed pad connects to the GND plane for optimal thermal performance. |
| 6 | FREQ | passive | Switching frequency program input; connect a resistor from this pin to ground to set the switching frequency (495kΩ for 200kHz). |
| 7 | VIN | power_in | Input supply (4.5V to 55V recommended) powering all internal control circuitry, the bootstrap regulator and the high-side switch; needs a decoupling capacitor to ground close to the pin. |
| 8 | BST | passive | Bootstrap positive supply for the internal floating high-side MOSFET driver; connect a bypass capacitor between this pin and SW. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Monolithic Power Systems |
| Package | SOIC-8-EP |
| Category | LED Drivers |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VIN | -0.3 | 60 | V | 2 | ||
| Switch Voltage | VSW | -0.5 | V | -0.5V to VIN + 0.5V | 2 | ||
| BST to SW | -0.3 | 5 | V | 2 | |||
| All Other Pins | -0.3 | 5 | V | 2 | |||
| Junction Temperature | TJ | 150 | °C | 2 | |||
| Lead Temperature | 260 | °C | 2 | ||||
| Storage Temperature | -65 | 150 | °C | 2 | |||
| Continuous Power Dissipation SOIC8 (Exposed Pad) | PD | 2.5 | W | TA=+25°C | 2 | ||
| Supply Voltage | VIN | 4.5 | 55 | V | 2 | ||
| Maximum Junction Temperature | TJ | 125 | °C | 2 | |||
| Free Air Temperature | TA | -40 | 85 | °C | 2 | ||
| Thermal Resistance Junction-Ambient SOIC8 (Exposed Pad) | θJA | 50 | °C/W | Measured on JESD51-7 4-layer board | 2 | ||
| Thermal Resistance Junction-Case SOIC8 (Exposed Pad) | θJC | 10 | °C/W | Measured on JESD51-7 4-layer board | 2 | ||
| Feedback Voltage | VFB | 188 | 200 | 212 | mV | 4.5V < VIN < 55V | 3 |
| Upper Switch On Resistance | RDS(ON) | 220 | mΩ | VBST, VSW = 5V | 3 | ||
| Upper Switch Leakage | 0.1 | μA | VEN = 0V, VSW = 0V | 3 | |||
| Current Limit | 2.6 | 3.2 | A | 3 | |||
| Error Amp Voltage Gain | AVEA | 400 | V/V | 3 | |||
| Error Amp Transconductance | GEA | 350 | µA/V | ICOMP = ±3µA | 3 | ||
| Error Amp Min Source current | 10 | µA | VFB = 175mV | 3 | |||
| Error Amp Min Sink current | -10 | µA | VFB = 225mV | 3 | |||
| VIN UVLO Threshold | 2.7 | 3 | 3.3 | V | VIN rising | 3 | |
| VIN UVLO Hysteresis | 0.4 | V | 3 | ||||
| Soft-Start Time | 0.18 | ms | 20mV < VFB < 190mV | 3 | |||
| Oscillator Frequency | fs | 150 | 200 | 250 | kHz | RFREQ = 495kΩ | 3 |
| Minimum Switch On Time | 100 | ns | 3 | ||||
| Shutdown Supply Current | 12 | 25 | µA | VEN < 0.3V | 3 | ||
| Quiescent Supply Current | 130 | µA | No load, VFB = 240mV | 3 | |||
| Thermal Shutdown | 150 | °C | Hysteresis = 20°C | 3 | |||
| Minimum Off Time | 100 | ns | 3 | ||||
| Minimum On Time | 100 | ns | 3 | ||||
| EN Up Threshold | 1.3 | 1.5 | 1.7 | V | 3 | ||
| EN Threshold Hysteresis | 300 | mV | 3 |
CAD (KiCad official)
- Symbol:
MP2488DN-LF-Z - Footprint:
Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm - 3D model: SOIC-8-EP (KiCad packages3D, STEP)
- 3D model files:
mp2488dn-lf-z-etched.step/mp2488dn-lf-z-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mp2488dn-lf-z.step/mp2488dn-lf-z.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Monolithic Power Systems datasheet (14 pp, sha256
405cac378e8aaab1, retrieved 2026-10-23, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).