main
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 16d ago
viewers mp2460gj-z: viewers · Ray 16d ago
mp2460gj-z-etched.glb Publish 0.1.0 · Ray 16d ago
mp2460gj-z-etched.step mp2460gj-z: factory component page (tier=lcsc) · Ray 16d ago
mp2460gj-z-hero.glb mp2460gj-z: hero GLB from the etched model (keeps the MPN mark) · Ray 16d ago
mp2460gj-z-hero.overlay.json Publish 0.1.0 · Ray 16d ago
mp2460gj-z.glb Publish 0.1.0 · Ray 16d ago
mp2460gj-z.kicad_mod Publish 0.1.0 · Ray 16d ago
mp2460gj-z.kicad_sym Publish 0.1.0 · Ray 16d ago
mp2460gj-z.lbr Publish 0.1.0 · Ray 16d ago
mp2460gj-z.step Publish 0.1.0 · Ray 16d ago
package.json Publish 0.1.0 · Ray 16d ago
page.json Set visibility: public · Ray 16d ago
README.md Publish 0.1.0 · Ray 16d ago

MP2460GJ-Z

Monolithic Power Systems · DC-DC Converters · TSOT-23-6

MP2460GJ-Z from Monolithic Power Systems, in a TSOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BST power_out BST is the positive power supply for the internal floating high-side MOSFET driver, and a bypass capacitor must be connected between BST and SW.
2 GND power_in Ground; the output capacitor should be connected as close to GND as possible, and GND should be kept away from high-current switch paths.
3 FB input Error amplifier input that connects to an external resistor divider between the output and GND, and is compared to the internal 0.8V reference to set the regulation voltage.
4 EN input Enable input: pulling EN below the specified threshold shuts the chip down, pulling it above the threshold enables the chip, and floating EN disables the chip; EN current should be limited below 50µA with a pull-up resistor.
5 VIN power_in Input supply for the internal control circuitry, both BST regulators and the high-side switch, with a recommended supply range of 4.5V to 45V and an absolute maximum of -0.3V to +48V.
6 SW output Switch node and converter switching output, internally connected to the high-side FET source and low-side FET drain and to be connected to a power inductor; switch voltage absolute maximum is -0.6V (-5V in 10ns) to VIN + 0.3V (50V in 10ns).

Key specifications

Parameter Value
Manufacturer Monolithic Power Systems
Package TSOT-23-6
Category Power Management (PMIC)
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (VIN) VIN 4.5 45 V 4
Output voltage (VOUT) VOUT 0.8 V Max printed as 0.98 x VIN 4
EN current 50 µA 4
Operating junction temp (TJ) TJ -40 125 °C 4
Supply voltage (VIN) VIN -0.3 48 V 4
Switch voltage (VSW) DC VSW -0.6 V Max printed as VIN + 0.3V 4
Switch voltage (VSW) transient VSW -5 50 V 10ns 4
BST to SW -0.3 6 V 4
All other pins -0.3 6 V 4
EN current 100 µA 4
Junction temperature 150 °C 4
Storage temperature -65 150 °C 4
ESD Human body model (HBM) -2000 2000 V 4
ESD Charged device model (CDM) -750 750 V 4
Feedback voltage VFB 0.78 0.8 0.82 V TJ = -40°C to +125°C; VIN = 15V, VEN = 2V 5
Feedback voltage VFB 0.788 0.8 0.812 V TJ = 25°C; VIN = 15V, VEN = 2V 5
Low-side current limit ILIM_LS 0.7 0.9 1.1 A 5
VIN UVLO rising threshold VINUVR 4.1 4.3 4.5 V 5
VIN UVLO falling threshold VINUVF 3.75 4 4.25 V 5
Soft-start time tSS 0.35 0.6 0.85 ms VFB from 10% to 90% 5
Oscillator frequency fSW 1.39 1.7 2.04 MHz 5
Shutdown supply current IQS 1 2 μA VEN < 0.3V, VIN = 15V 5
Quiescent supply current IQ 150 220 µA No load, VFB = 0.83V, no switching 5
Enable rising threshold VEN_R 1.5 1.55 1.6 V Low to high 5
Enable falling threshold VEN_F 1.1 1.22 1.3 V High to low 5
High-side switch on resistance RON_HS 420 mΩ VBST - VSW = 5V 5
Low-side switch on resistance RON_LS 220 mΩ VIN = 15V 5
Feedback leakage ILK_FB 0.1 μA VEN = 1V, VFB = 2V 5
High-side switch leakage LKGHS 1 μA VEN = 0V, VSW = 0V 5
Low-side switch leakage LKGLS 1 μA VEN = 0V, VSW = 45V 5
High-side current limit ILIM_HS 1.25 A 5
Minimum switch on time tON_MIN 100 ns 5
Maximum switch on time tON_MAX 5.2 µs 5
Minimum switch off time tOFF_MIN 92 ns 5
VIN UVLO hysteresis VINUV_HYS 0.3 V 5
Thermal shutdown TSD 151 °C 5
Thermal shutdown hysteresis TSD_HYS 21 °C 5
Enable threshold hysteresis VEN_HYS 330 mV 5
Thermal resistance junction-to-ambient, EVL2460-J-00A 2-layer board θJA 74 °C/W EVL2460-J-00A, 2-layer PCB, 50.8mm x 50.8mm 4
Thermal resistance junction-to-ambient, JESD51-7 4-layer board θJA 100 °C/W JESD51-7, 4-layer PCB; not for design use 4

CAD (KiCad official)

  • Symbol: MP2460GJ-Z
  • Footprint: Package_TO_SOT_SMD:TSOT-23-6
  • 3D model: TSOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: mp2460gj-z-etched.step / mp2460gj-z-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mp2460gj-z.step / mp2460gj-z.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Monolithic Power Systems datasheet (23 pp, sha256 06566a989b8bfae1, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF