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Contents

README

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MP2410AGJ-Z

Monolithic Power Systems · LED Drivers · TSOT-23-6

MP2410AGJ-Z from Monolithic Power Systems, in a TSOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground and the voltage reference for the regulated output; give careful consideration to GND during layout.
2 SW passive Switch output node of the internal high-side and low-side power MOSFETs.
3 VIN power_in Supply input, operates from a 4.2V to 24V unregulated input and needs an input capacitor to prevent large voltage spikes.
4 FB input Current sense feedback input with an internal reference voltage of 0.1V.
5 EN/DIM input On/off and dimming input; floating or above 0.59V turns on the part, analog dimming from 0.7V to 1.44V, PWM dimming with 100Hz to 2kHz signal above 1.5V.
6 BST passive Bootstrap pin; connect a capacitor between SW and BST to form a floating supply for the power switch driver.

Key specifications

Parameter Value
Manufacturer Monolithic Power Systems
Package TSOT-23-6
Category Nixie Tube Driver/LED Driver
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (absolute maximum) VIN 26 V 3
SW voltage (absolute maximum) VSW -0.3 V -0.3V to VIN + 0.3V (max is VIN + 0.3) 3
All other pins -0.3 6 V 3
Continuous power dissipation TSOT23-6 PD 1.25 W TA = 25°C 3
Junction temperature TJ 150 °C 3
Lead temperature 260 °C 3
Storage temperature -65 150 °C 3
ESD capability human body mode 2 kV 3
Supply voltage (recommended) VIN 4.2 24 V 3
Operating junction temperature TJ -40 125 °C 3
Thermal resistance junction-ambient TSOT23-6 θJA 100 °C/W JESD51-7, 4-layer PCB 3
Thermal resistance junction-case TSOT23-6 θJC 55 °C/W JESD51-7, 4-layer PCB 3
Operating range VIN 4.2 24 V After turn on 4
Turn on threshold VIN_ON 3.5 3.7 4 V VIN rising edge 4
Shutdown current ISD 10 50 μA VEN = 0V 4
Quiescent current IQ 0.9 1.1 mA VEN = 2V, VFB = 200mV 4
EN/DIM off threshold VEN_OFF 0.27 0.31 0.35 V VEN/DIM falling edge 4
EN/DIM on threshold VEN_ON 0.545 0.59 0.635 V VEN/DIM rising edge 4
Turn off delay time tOFF_DELAY 16 22 28 ms 4
EN/DIM pull-up current IEN/DIM 2.8 3.8 5.3 μA VEN = 0V 4
Max analog dimming threshold VADIM_MAX 1.31 1.44 1.57 V Theoretically, VFB = 100mV 4
Min analog dimming threshold VADIM_MIN 0.63 0.7 0.78 V VFB = 5mV 4
Feedback voltage VFB 93 100 107 mV 4.2V ≤ VIN ≤ 24V 4
Feedback current IFB 30 75 nA VFB = 150mV 4
High-side MOSFET on resistance RDS(ON)_H 100 170 mΩ VIN = 5.0V 4
High-side MOSFET on resistance RDS(ON)_H 110 180 mΩ VIN = 4.2V 4
Low-side switch on resistance RDS(ON)_L 80 140 mΩ VIN = 5.0V 4
Low-side switch on resistance RDS(ON)_L 90 150 mΩ VIN = 4.2V 4
Switch leakage ISW_LKG 1 μA VEN = 0V, VSW = 0V 4
High-side current limit ILIMIT_H 3.5 5 6.6 A When high-side switch turns on 4
Low-side current limit ILIMIT_L -890 -630 -330 mA When low-side switch turns on 4
OCP current threshold IOCP 3.6 5.5 7 A Both for high side and low side 4
Oscillator frequency fSW 0.8 1 1.2 MHz VFB = 80mV 4
Maximum duty cycle DMAX 90 94 % VFB = 80mV 4
Bias voltage for high-side driver VBST-VSW 4.8 5.1 5.5 V 5.5V ≤ VIN ≤ 24V 4
NTC high-threshold voltage VH_NTC 1.16 1.25 1.34 V VFB = 95mV 4
NTC low-threshold voltage VL_NTC 0.76 0.82 0.88 V VFB = 5mV 4
NTC shutdown threshold VSD_NTC 0.34 0.41 0.47 V VNTC falling edge 4
NTC shutdown voltage hysteresis VSD_NTC_HYS 55 110 185 mV 4
NTC pull-up current source IPULL_UP_NTC 41 58 72 μA 4
NTC leakage current INTC_LKG 1 μA 4
Hysteretic voltage VIN_HYS 0.12 V 4
Minimum on time tON_MIN 70 ns 4
Hiccup timer at fault condition tSTART 2.4 ms 4
Bootstrap bias voltage VBST-VSW 3.6 V VIN = 4.2V 4
Thermal shutdown threshold TSD 150 °C 4
Thermal shutdown hysteresis THYS 60 °C 4

CAD (KiCad official)

  • Symbol: MP2410AGJ-Z
  • Footprint: Package_TO_SOT_SMD:TSOT-23-6
  • 3D model: TSOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: mp2410agj-z-etched.step / mp2410agj-z-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mp2410agj-z.step / mp2410agj-z.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Monolithic Power Systems datasheet (17 pp, sha256 75eb701b1d639604, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF