# MP2236GJ-Z

**MPS(芯源)** · DC-DC Converters · TSOT-23-8

MP2236GJ-Z from MPS(芯源), in a TSOT-23-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | AGND | power_in | Analog ground; connect AGND to GND using a short and wide PCB trace. |
| 2 | IN | power_in | Supply voltage input for a 3V to 18V input rail; decouple with a ceramic capacitor and connect using a wide PCB trace. |
| 3 | SW | output | Switch output; connect using a wide PCB trace. |
| 4 | GND | power_in | System power ground and reference ground of the regulated output voltage; connect to the ground plane with copper traces and vias. |
| 5 | BST | passive | Bootstrap; connect a 0.1µF capacitor between SW and BST to form a floating supply across the high-side switch driver. |
| 6 | EN | input | Enable; drive high to enable the MP2236, and it has a 2MΩ pull-down resistor to GND. |
| 7 | VCC | power_out | Internal bias supply; decouple with a 1µF capacitor placed close to VCC and GND. |
| 8 | FB | input | Feedback; connect to the tap of an external resistor divider from the output to GND to set the output voltage. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MPS(芯源) |
| Package | TSOT-23-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input voltage (VIN) | VIN | -0.3 |  | 20 | V |  | 3 |
| Switch voltage (VSW) | VSW | -0.3 |  |  | V |  | 3 |
| Switch voltage (VSW) transient | VSW | -6.5 |  |  | V | <10ns | 3 |
| Switch voltage (VSW) transient | VSW |  |  | 25 | V | <25ns | 3 |
| EN voltage (VEN) | VEN |  |  | 20 | V |  | 3 |
| All other pins voltage |  | -0.3 |  | 4 | V |  | 3 |
| Continuous power dissipation | PD |  |  | 1.89 | W | TA = 25°C, TSOT23-8 | 3 |
| Junction temperature | TJ |  |  | 150 | °C |  | 3 |
| Lead temperature |  |  |  | 260 | °C |  | 3 |
| Storage temperature |  | -65 |  | 150 | °C |  | 3 |
| Supply voltage (VIN) | VIN | 3 |  | 18 | V |  | 3 |
| Output voltage (VOUT) | VOUT | 0.6 |  | 8 | V | or VIN x DMAX (note 4) | 3 |
| Operating junction temperature (TJ) | TJ | -40 |  | 125 | °C |  | 3 |
| Supply current (shutdown) | IIN |  |  | 1 | μA | VEN = 0V, TJ = 25°C | 4 |
| Supply current (quiescent) | IQ |  | 150 | 210 | μA | VFB = 0.63V, PFM mode | 4 |
| Low-side valley current limit | ILIMIT_L | 6 |  | 7.5 | A |  | 4 |
| Switching frequency | fSW1 | 480 | 600 | 720 | kHz | VIN = 12V, VOUT = 3.3V | 4 |
| Reference voltage | VFB | 594 | 600 | 606 | mV | TJ = 25°C | 4 |
| Reference voltage | VFB | 591 | 600 | 609 | mV | TJ = -40°C to +125°C | 4 |
| EN rising threshold | VEN_RISING | 1.12 | 1.2 | 1.28 | V |  | 4 |
| VIN under-voltage lockout threshold-rising | INUVVth | 2.7 | 2.8 | 2.95 | V |  | 4 |
| FB current | IFB |  | 10 | 50 | nA | VFB = 0.63V | 4 |
| Switch leakage | SWLKG |  |  | 1 | μA | VEN = 0V, VSW = 0V, TJ = 25°C | 4 |
| Soft-start time | tSS | 0.5 | 1 | 1.5 | ms | TJ = 25°C, VOUT from 10% to 90% | 4 |
| HS switch on resistance | HSRDS(ON) |  | 25 |  | mΩ | VBST-SW = 3.3V | 4 |
| LS switch on resistance | LSRDS(ON) |  | 12 |  | mΩ |  | 4 |
| Low-side ZCD threshold | IZCD |  | 50 |  | mA |  | 4 |
| Minimum off time | tOFF_MIN |  | 170 |  | ns |  | 4 |
| Minimum on time | tON_MIN |  | 70 |  | ns |  | 4 |
| EN hysteresis | VEN_HYS |  | 200 |  | mV |  | 4 |
| EN to GND pull-down resistor | REN |  | 2 |  | MΩ | VEN = 2V | 4 |
| VIN under-voltage lockout threshold-hysteresis | INUVHYS |  | 300 |  | mV |  | 4 |
| VCC regulator | VCC |  | 3.5 |  | V | ICC = 5mA | 4 |
| UVP1 threshold | UVTH1 |  | 80 |  | % VREF | Hiccup entry | 4 |
| Thermal shutdown | TTSD |  | 150 |  | °C |  | 4 |
| Thermal hysteresis | TTSD_HYS |  | 20 |  | °C |  | 4 |
| Thermal resistance junction-to-ambient (θJA) | θJA |  | 66 |  | °C/W | EV2236-J-00A board (note 5) | 3 |
| Thermal resistance junction-to-case (θJC) | θJC |  | 23 |  | °C/W | EV2236-J-00A board (note 5) | 3 |
| Thermal resistance junction-to-ambient (θJA) | θJA |  | 100 |  | °C/W | JESD51-7 (note 6) | 3 |
| Thermal resistance junction-to-case (θJC) | θJC |  | 55 |  | °C/W | JESD51-7 (note 6) | 3 |

## CAD (KiCad official)

- Symbol: `MP2236GJ-Z`
- Footprint: `Package_TO_SOT_SMD:TSOT-23-8`
- 3D model: TSOT-23-8 (KiCad packages3D, STEP)
- 3D model files: `mp2236gj-z-etched.step` / `mp2236gj-z-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mp2236gj-z.step` / `mp2236gj-z.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MPS(芯源) datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8604436507180609536) (21 pp, sha256 `a363849f222c577f`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/mp2236gj-z-datasheet.pdf)