component
MMUN2130LT1G
Public Made by Adomby adom
onsemi Digital Transistors, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 17d ago |
| viewers | 17d ago |
| mmun2130lt1g-etched.glb | 17d ago |
| mmun2130lt1g-etched.step | 17d ago |
| mmun2130lt1g-hero.glb | 17d ago |
| mmun2130lt1g-hero.overlay.json | 17d ago |
| mmun2130lt1g.glb | 17d ago |
| mmun2130lt1g.kicad_mod | 17d ago |
| mmun2130lt1g.kicad_sym | 17d ago |
| mmun2130lt1g.lbr | 17d ago |
| mmun2130lt1g.step | 17d ago |
| package.json | 17d ago |
| page.json | 17d ago |
| README.md | 17d ago |
MMUN2130LT1G
onsemi · Digital Transistors · SOT-23
MMUN2130LT1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BASE | input | Base is the input of the pre-biased PNP transistor, with the datasheet stating a maximum input forward voltage VIN(fwd) of 10 Vdc and a maximum input reverse voltage VIN(rev) of 10 Vdc. |
| 2 | EMITTER | power_in | Emitter is the ground reference (labelled GROUND in the pin connections) for the device and the base-emitter bias resistor R2 connects across it. |
| 3 | COLLECTOR | output | Collector is the output of the transistor, rated at a maximum collector-emitter voltage VCEO of 50 Vdc and a continuous collector current IC of 100 mAdc. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Collector-Base Cutoff Current | ICBO | 100 | nAdc | (VCB = 50 V, IE = 0) | 5 | ||
| Collector-Emitter Cutoff Current | ICEO | 500 | nAdc | (VCE = 50 V, IB = 0) | 5 | ||
| Emitter-Base Cutoff Current | IEBO | 4.3 | mAdc | (VEB = 6.0 V, IC = 0) | 5 | ||
| Collector-Base Breakdown Voltage | V(BR)CBO | 50 | Vdc | (IC = 10 A, IE = 0) | 5 | ||
| Collector-Emitter Breakdown Voltage | V(BR)CEO | 50 | Vdc | (IC = 2.0 mA, IB = 0) | 5 | ||
| DC Current Gain | hFE | 3 | 5 | (IC = 5.0 mA, VCE = 10 V) | 5 | ||
| Collector-Emitter Saturation Voltage | VCE(sat) | 0.25 | Vdc | (IC = 10 mA, IB = 5.0 mA) | 5 | ||
| Input Voltage (off) | Vi(off) | 1.2 | 0.5 | Vdc | (VCE = 5.0 V, IC = 100 A) | 5 | |
| Input Voltage (on) | Vi(on) | 2 | 1.6 | Vdc | (VCE = 0.3 V, IC = 20 mA) | 5 | |
| Output Voltage (on) | VOL | 0.2 | Vdc | (VCC = 5.0 V, VB = 2.5 V, RL = 1.0 k) | 5 | ||
| Output Voltage (off) | VOH | 4.9 | Vdc | (VCC = 5.0 V, VB = 0.05 V, RL = 1.0 k) | 5 | ||
| Input Resistor R1 | R1 | 0.7 | 1 | 1.3 | k | 5 | |
| Resistor Ratio | R1/R2 | 0.8 | 1 | 1.2 | 5 | ||
| Collector-Base Voltage | VCBO | 50 | Vdc | 1 | |||
| Collector-Emitter Voltage | VCEO | 50 | Vdc | 1 | |||
| Collector Current - Continuous | IC | 100 | mAdc | 1 | |||
| Input Forward Voltage | VIN(fwd) | 10 | Vdc | 1 | |||
| Input Reverse Voltage | VIN(rev) | 10 | Vdc | 1 | |||
| Total Device Dissipation (minimum pad) | PD | 246 | mW | TA = 25°C (Note 1: FR-4 @ Minimum Pad) | 4 | ||
| Total Device Dissipation (1.0 x 1.0 inch pad) | PD | 400 | mW | TA = 25°C (Note 2: FR-4 @ 1.0 x 1.0 Inch Pad) | 4 | ||
| Derate above 25°C (minimum pad) | 2 | mW/°C | Note 1: FR-4 @ Minimum Pad | 4 | |||
| Derate above 25°C (1.0 x 1.0 inch pad) | 3.2 | mW/°C | Note 2: FR-4 @ 1.0 x 1.0 Inch Pad | 4 | |||
| Thermal Resistance, Junction to Ambient (minimum pad) | RJA | 508 | °C/W | Note 1: FR-4 @ Minimum Pad | 4 | ||
| Thermal Resistance, Junction to Ambient (1.0 x 1.0 inch pad) | RJA | 311 | °C/W | Note 2: FR-4 @ 1.0 x 1.0 Inch Pad | 4 | ||
| Thermal Resistance, Junction to Lead (minimum pad) | RJL | 174 | °C/W | Note 1: FR-4 @ Minimum Pad | 4 | ||
| Thermal Resistance, Junction to Lead (1.0 x 1.0 inch pad) | RJL | 208 | °C/W | Note 2: FR-4 @ 1.0 x 1.0 Inch Pad | 4 | ||
| Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 4 |
CAD (KiCad official)
- Symbol:
MMUN2130LT1G - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
mmun2130lt1g-etched.step/mmun2130lt1g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mmun2130lt1g.step/mmun2130lt1g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (12 pp, sha256
e986977c0ea65963, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).