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MMSZ56T1G

onsemi · Zener Diodes · SOD-123

MMSZ56T1G from onsemi, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode terminal, indicated by the polarity band on the package (SOD-123 Style 1, pin 1).
2 Anode passive Anode terminal of the Zener diode (SOD-123 Style 1, pin 2).

Key specifications

Parameter Value
Manufacturer onsemi
Package SOD-123
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener Voltage @ IZT1 = 2 mA (MMSZ56T1G, Z4) VZ1 53.2 56 58.8 V @ IZT1 = 2 mA 3
Reverse Zener Voltage @ IZT2 (MMSZ56T1G, Z4) VZ2 51.5 60 V @ IZT2 = 0.1 mA 3
Maximum Zener Impedance @ IZT1 (MMSZ56T1G) ZZT1 200 Ω @ IZT1 = 2 mA; IZ(AC) = 0.1 IZ(DC), f = 1 kHz 3
Maximum Zener Impedance @ IZT2 (MMSZ56T1G) ZZT2 425 Ω @ IZT2 = 0.5 mA; IZ(AC) = 0.1 IZ(DC), f = 1 kHz 3
Reverse Leakage Current (MMSZ56T1G) IR 0.05 µA @ VR = 39.2 V 3
Forward Voltage VF 0.9 V @ IF = 10 mA 3
Zener voltage standard tolerance on nominal VZ -5 5 % Standard tolerance on nominal Zener voltage (Note 6); MMSZ56T1G has no alternate tolerance letter printed 3
Total Power Dissipation on FR-5 Board PD 500 mW FR-5 board (3.5 x 1.5 in), @ TL = 75°C (Note 1) 1
Derating of Total Power Dissipation PD 6.7 mW/°C Derated above TL = 75°C 1
Thermal Resistance, Junction-to-Ambient RθJA 340 °C/W Note 2 (infrared scan method) 1
Thermal Resistance, Junction-to-Lead RθJL 150 °C/W Note 2 (infrared scan method) 1
Junction and Storage Temperature Range TJ, Tstg -55 150 °C 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PPA • ESD Rating of Class 3 (> 16 kV) per Human Body Model • AEC−Q101 Qualified and PPAP Capable 1

CAD (KiCad official)

  • Symbol: MMSZ56T1G
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123 (KiCad packages3D, STEP)
  • 3D model files: mmsz56t1g-etched.step / mmsz56t1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mmsz56t1g.step / mmsz56t1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (6 pp, sha256 4a61e8bedacf2866, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF