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MMSZ5260BT1G

Public Made by Adom

by adom

onsemi Zener Diodes, SOD-123. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MMSZ5260BT1G

onsemi · Zener Diodes · SOD-123

MMSZ5260BT1G from onsemi, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode terminal of the Zener diode, identified by the polarity band on the package. Datasheet pinout for SOD-123 Style 1 lists pin 1 as cathode.
2 Anode passive Anode terminal of the Zener diode, opposite the cathode (polarity band) side. Datasheet pinout for SOD-123 Style 1 lists pin 2 as anode.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOD-123
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener Voltage (5% B-suffix tolerance) VZ 40.85 43 45.15 V @ IZT = 3.0 mA; TA = 25°C; nominal measured at TL = 30°C ±1°C 3
Zener voltage tolerance (B suffix) -5 5 % Standard tolerance on nominal Zener voltage (B suffix) 3
Maximum Zener impedance ZZT 93 Ω @ IZT = 3.0 mA; AC 1 kHz; IZ(AC) = 0.1 IZ(dc) 3
Maximum Zener impedance at knee ZZK 900 Ω @ IZK = 0.25 mA; AC 1 kHz; IZ(AC) = 0.1 IZ(dc) 3
Reverse leakage current IR 0.1 µA @ VR = 33 V 3
Forward voltage VF 0.9 V @ IF = 10 mA 3
Total power dissipation on FR-5 board PD 500 mW @ TL = 75°C; FR-5 board, minimum recommended footprint (Note 1) 1
Power dissipation derating PD 6.7 mW/°C Derated above TL = 75°C 1
Thermal resistance, junction-to-ambient RJA 340 °C/W Note 2 (infrared scan method) 1
Thermal resistance, junction-to-lead RJL 150 °C/W Note 2 (infrared scan method) 1
Junction and storage temperature range TJ, Tstg -55 150 °C 1

CAD (KiCad official)

  • Symbol: MMSZ5260BT1G
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123 (KiCad packages3D, STEP)
  • 3D model files: mmsz5260bt1g-etched.step / mmsz5260bt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mmsz5260bt1g.step / mmsz5260bt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (7 pp, sha256 72c34c6ab3cd791c, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF