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Contents

README

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MMSZ5243BT1G

ON Semiconductor · Global Sourcing Parts · SOD-123

MMSZ5243BT1G from ON Semiconductor, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode terminal of the Zener diode, marked by the polarity band on the package (SOD-123 Style 1, pin 1 = Cathode).
2 Anode passive Anode terminal of the Zener diode (SOD-123 Style 1, pin 2 = Anode); the datasheet gives no pin-specific electrical limits.

Key specifications

Parameter Value
Manufacturer ON Semiconductor
Package SOD-123
Category Global Sourcing Parts
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener Voltage (MMSZ5243BT1G, 5% B suffix) VZ 12.35 13 13.65 V @ IZT = 9.5 mA; TA = 25°C; nominal measured at TL = 30°C ±1°C 3
Zener voltage tolerance (B suffix) -5 5 % B suffix, standard tolerance on nominal Zener voltage (Note 3) 3
Maximum Zener impedance ZZT 13 Ω @ IZT = 9.5 mA; IZ(AC) = 0.1 IZ(dc), f = 1 kHz 3
Maximum Zener impedance ZZK 600 Ω @ IZK = 0.25 mA; IZ(AC) = 0.1 IZ(dc), f = 1 kHz 3
Reverse leakage current IR 0.5 µA @ VR = 9.9 V 3
Forward voltage VF 0.9 V @ IF = 10 mA 3
Total power dissipation on FR-5 board PD 500 mW FR-5 board (Note 1) @ TL = 75°C 1
Thermal resistance, junction-to-ambient RθJA 340 °C/W Note 2 (infrared scan method) 1
Thermal resistance, junction-to-lead RθJL 150 °C/W Note 2 (infrared scan method) 1
Junction and storage temperature range TJ, Tstg -55 150 °C 1

CAD (KiCad official)

  • Symbol: MMSZ5243BT1G
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123 (KiCad packages3D, STEP)
  • 3D model files: mmsz5243bt1g-etched.step / mmsz5243bt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mmsz5243bt1g.step / mmsz5243bt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ON Semiconductor datasheet (7 pp, sha256 dd020fc5576bb75b, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF