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MMSZ30T1G

Public Made by Adom

by adom

onsemi Zener Diodes, SOD-123. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MMSZ30T1G

onsemi · Zener Diodes · SOD-123

MMSZ30T1G from onsemi, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode, indicated by the polarity band; for the MMSZ30T1G the nominal Zener voltage is 30 V (28.50 V to 31.50 V) at IZT1 = 2 mA, with the reverse Zener current flowing into this pin.
2 A passive Anode (Style 1, pin 2); the Zener diode forward voltage is 0.9 V max at IF = 10 mA.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOD-123
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener Voltage 1 VZ1 28.5 30 31.5 V IZT1 = 2 mA, TA = 25C, PW = 1 ms 3
Zener Voltage 2 VZ2 27.8 32 V IZT2 = 0.1 mA, TA = 25C, PW = 1 ms 3
Maximum Zener Impedance 1 ZZT1 80 Ω IZT1 = 2 mA, IZ(AC) = 0.1 IZ(DC), f = 1 kHz 3
Maximum Zener Impedance 2 ZZT2 300 Ω IZT2 = 0.1 mA, IZ(AC) = 0.1 IZ(DC), f = 1 kHz 3
Max Reverse Leakage Current IR 0.05 µA VR = 21 V 3
Forward Voltage VF 0.9 V IF = 10 mA, TA = 25C 3
Total Power Dissipation on FR-5 Board PD 500 mW TL = 75C 1
Power Derating above 75C PD 6.7 mW/C Derated above 75C 1
Junction and Storage Temperature Range TJ, Tstg -55 150 C 1
Thermal Resistance, Junction-to-Ambient RθJA 340 C/W Note 2, infrared scan method 1
Thermal Resistance, Junction-to-Lead RθJL 150 C/W Note 2, infrared scan method 1
Zener Voltage Tolerance -5 5 % Standard tolerance on nominal Zener voltage 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PPA  ESD Rating of Class 3 (> 16 kV) per Human Body Model  AEC−Q101 Qualified and PPAP Capable 1

CAD (KiCad official)

  • Symbol: MMSZ30T1G
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123 (KiCad packages3D, STEP)
  • 3D model files: mmsz30t1g-etched.step / mmsz30t1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mmsz30t1g.step / mmsz30t1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (6 pp, sha256 0048ab4ae41ba770, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF