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Contents

README

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MMS8550HE3-H-HXY

HXY MOSFET · Bipolar (BJT) · SOT-23

MMS8550HE3-H-HXY from HXY MOSFET, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 B input Base of the PNP transistor; the datasheet gives no base current rating, and VEBO is -5 V maximum.
2 E passive Emitter of the PNP transistor; VEBO is -5 V maximum.
3 C passive Collector of the PNP transistor; IC is -500 mA maximum, VCEO is -25 V, VCBO is -40 V and PC is 300 mW.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Collector-base breakdown voltage V(BR)CBO -40 V IC=-0.1mA, IE=0 2
Collector-emitter breakdown voltage V(BR)CEO -25 V IC=-1mA, IB=0 2
Emitter-base breakdown voltage V(BR)EBO -5 V IE=-0.1mA, IC=0 2
Collector cut-off current ICBO -0.1 uA VCB=-40V, IE=0 2
Emitter cut-off current IEBO -0.1 uA VEB=-5V, IC=0 2
DC current gain hFE 200 350 VCE=-1V, IC=-50mA 2
Collector-emitter saturation voltage VCE(sat) -0.6 V IC=-500mA, IB=-50mA 2
Base-emitter saturation voltage VBE(sat) -1.2 V IC=-500mA, IB=-50mA 2
Transition frequency fT 150 MHz VCE=-6V, IC=-20mA, f=30MHz 2
Collector output capacitance Cob 5 pF VCB=-10V, IE=0, f=1MHz 2
Collector-base voltage VCBO -40 V 1
Collector-emitter voltage VCEO -25 V 1
Emitter-base voltage VEBO -5 V 1
Collector current IC -500 mA 1
Collector power dissipation PC 300 mW 1
Thermal resistance from junction to ambient RΘJA 416 ℃/W 1
Junction temperature Tj 150 ℃ 1
Storage temperature Tstg -55 150 ℃ 1

CAD (KiCad official)

  • Symbol: MMS8550HE3-H-HXY
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: mms8550he3-h-hxy-etched.step / mms8550he3-h-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mms8550he3-h-hxy.step / mms8550he3-h-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (5 pp, sha256 505e98fb5618bb4a, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF