component
MMDL914T1G-CN
Public Made by Adomby adom
ChipNobo Switching Diodes, SOD-323. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMMDL914T1G-CN
ChipNobo · Switching Diodes · SOD-323
MMDL914T1G-CN from ChipNobo, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ChipNobo |
| Package | SOD-323 |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage | BV | 100 | V | IR=100uA | 1 | ||
| Breakdown Voltage | BV | 75 | V | IR=5uA | 1 | ||
| Reverse Leakage Current | IR | 25 | nA | VR=20V | 1 | ||
| Reverse Leakage Current | IR | 5 | uA | VR=75 | 1 | ||
| Forward Voltage | VF | 1 | V | IF=10mA | 1 | ||
| Forward Voltage | VF | 1.25 | V | IF=100mA | 1 | ||
| Reverse Recovery Time | TRR | 4 | nS | IF=IR=30mA, RL=100Ω, IRR=0.1 x IR | 1 | ||
| Capacitance | CT | 4 | pF | VR=0V, f=1MHZ | 1 | ||
| Peak Reverse Voltage | VRM | 100 | V | 1 | |||
| Power Dissipation | Pd | 200 | mW | 1 | |||
| Operating junction temperature | Tj | 150 | ℃ | 1 | |||
| Storage temperature range | Ts | -55 | 150 | ℃ | 1 | ||
| Working Inverse Voltage | WIV | 75 | V | 1 | |||
| Average Rectified Current | IO | 150 | mA | 1 | |||
| Non-repetitive Peak Forward Current | IFM | 300 | mA | 1 | |||
| Peak Forward Surge Current | IFSM | 1 | A | tp=1us; TA=25℃ | 1 | ||
| Thermal Resistance from Junction to Ambient | RθJA | 312 | ℃/W | 1 |
CAD (KiCad official)
- Symbol:
MMDL914T1G-CN - Footprint:
Diode_SMD:D_SOD-323 - 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files:
mmdl914t1g-cn-etched.step/mmdl914t1g-cn-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mmdl914t1g-cn.step/mmdl914t1g-cn.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ChipNobo datasheet (3 pp, sha256
bfaa73755803c4c0, retrieved 2026-10-22, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).