component
MMBZ9V1ALT1G
Public Made by Adomby adom
onsemi ESD And Surge Protection (TVS/ESD), SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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MMBZ9V1ALT1G
onsemi · ESD And Surge Protection (TVS/ESD) · SOT-23
MMBZ9V1ALT1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CATHODE | passive | Cathode of the first Zener junction; for unidirectional use the circuit is tied to pins 1 and 3, and the MMBZ9V1ALT1G is rated for a 6.0 V working peak reverse voltage and 24 W peak power at 1.0 ms. |
| 2 | CATHODE | passive | Cathode of the second Zener junction; for unidirectional use the circuit is tied to pins 2 and 3, and the device is a dual common-anode design protecting two separate lines. |
| 3 | ANODE | passive | Common anode shared by both Zener junctions, with the single-package dual common-anode design protecting two lines. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOT-23 |
| Category | Circuit Protection |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage | VBR | 8.65 | 9.1 | 9.56 | V | @ IT 1.0 mA (Note 4) | 3 |
| Maximum Reverse Leakage Current | IR | 0.3 | A | @ VRWM 6.0 V; unit printed as 'A' in table (micro prefix lost in text) | 3 | ||
| Clamping Voltage | VC | 14 | V | @ IPP 1.7 A (Note 6) | 3 | ||
| Maximum Reverse Peak Pulse Current | IPP | 1.7 | A | Note 6: surge current per Figure 6, derate per Figure 7 | 3 | ||
| Maximum Temperature Coefficient of VBR | VBR | 7.5 | mV/C | 3 | |||
| Forward Voltage | VF | 0.9 | V | @ IF = 10 mA | 3 | ||
| Peak Power Dissipation | Ppk | 24 | W | @ 1.0 ms, TL <= 25°C (Note 1); applies to MMBZ5V6ALT1G thru MMBZ9V1ALT1G | 2 | ||
| Total Power Dissipation on FR-5 Board | PD | 225 | mW | @ TA = 25°C (Note 2) | 2 | ||
| Total Power Dissipation on Alumina Substrate | PD | 300 | mW | @ TA = 25°C (Note 3) | 2 | ||
| Derating above 25°C, FR-5 Board | PD | 1.8 | mW/°C | Derate above 25°C (FR-5 board, Note 2) | 2 | ||
| Derating above 25°C, Alumina Substrate | PD | 2.4 | mW/°C | Derate above 25°C (alumina, Note 3) | 2 | ||
| Thermal Resistance Junction-to-Ambient (FR-5 Board) | RθJA | 556 | °C/W | FR-5 board (Note 2) | 2 | ||
| Thermal Resistance Junction-to-Ambient (Alumina Substrate) | RθJA | 417 | °C/W | Alumina substrate (Note 3) | 2 | ||
| Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 2 | ||
| Lead Solder Temperature (Maximum) | TL | 260 | °C | 10 second duration | 2 | ||
| Working Peak Reverse Voltage | VRWM | 6 | V | 3 |
CAD (KiCad official)
- Symbol:
MMBZ9V1ALT1G - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
mmbz9v1alt1g-etched.step/mmbz9v1alt1g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mmbz9v1alt1g.step/mmbz9v1alt1g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (9 pp, sha256
4e26688519a3202b, retrieved 2026-10-20, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# MMBZ9V1ALT1G
**onsemi** · ESD And Surge Protection (TVS/ESD) · SOT-23
MMBZ9V1ALT1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CATHODE | passive | Cathode of the first Zener junction; for unidirectional use the circuit is tied to pins 1 and 3, and the MMBZ9V1ALT1G is rated for a 6.0 V working peak reverse voltage and 24 W peak power at 1.0 ms. |
| 2 | CATHODE | passive | Cathode of the second Zener junction; for unidirectional use the circuit is tied to pins 2 and 3, and the device is a dual common-anode design protecting two separate lines. |
| 3 | ANODE | passive | Common anode shared by both Zener junctions, with the single-package dual common-anode design protecting two lines. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOT-23 |
| Category | Circuit Protection |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage | VBR | 8.65 | 9.1 | 9.56 | V | @ IT 1.0 mA (Note 4) | 3 |
| Maximum Reverse Leakage Current | IR | | | 0.3 | A | @ VRWM 6.0 V; unit printed as 'A' in table (micro prefix lost in text) | 3 |
| Clamping Voltage | VC | | | 14 | V | @ IPP 1.7 A (Note 6) | 3 |
| Maximum Reverse Peak Pulse Current | IPP | | | 1.7 | A | Note 6: surge current per Figure 6, derate per Figure 7 | 3 |
| Maximum Temperature Coefficient of VBR | VBR | | | 7.5 | mV/C | | 3 |
| Forward Voltage | VF | | | 0.9 | V | @ IF = 10 mA | 3 |
| Peak Power Dissipation | Ppk | | | 24 | W | @ 1.0 ms, TL <= 25°C (Note 1); applies to MMBZ5V6ALT1G thru MMBZ9V1ALT1G | 2 |
| Total Power Dissipation on FR-5 Board | PD | | | 225 | mW | @ TA = 25°C (Note 2) | 2 |
| Total Power Dissipation on Alumina Substrate | PD | | | 300 | mW | @ TA = 25°C (Note 3) | 2 |
| Derating above 25°C, FR-5 Board | PD | | 1.8 | | mW/°C | Derate above 25°C (FR-5 board, Note 2) | 2 |
| Derating above 25°C, Alumina Substrate | PD | | 2.4 | | mW/°C | Derate above 25°C (alumina, Note 3) | 2 |
| Thermal Resistance Junction-to-Ambient (FR-5 Board) | RθJA | | 556 | | °C/W | FR-5 board (Note 2) | 2 |
| Thermal Resistance Junction-to-Ambient (Alumina Substrate) | RθJA | | 417 | | °C/W | Alumina substrate (Note 3) | 2 |
| Junction and Storage Temperature Range | TJ, Tstg | -55 | | 150 | °C | | 2 |
| Lead Solder Temperature (Maximum) | TL | | | 260 | °C | 10 second duration | 2 |
| Working Peak Reverse Voltage | VRWM | | 6 | | V | | 3 |
## CAD (KiCad official)
- Symbol: `MMBZ9V1ALT1G`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `mmbz9v1alt1g-etched.step` / `mmbz9v1alt1g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mmbz9v1alt1g.step` / `mmbz9v1alt1g.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [onsemi datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588905067872837632) (9 pp, sha256 `4e26688519a3202b`, retrieved 2026-10-20, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/mmbz9v1alt1g-datasheet.pdf)