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MMBZ5251BLT1G

onsemi · Zener Diodes · SOT-23

MMBZ5251BLT1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Anode passive Anode terminal of the Zener diode; the datasheet gives the pinout only (Style 8: pin 1 = Anode) and no pin-specific electrical limits, with the device forward voltage VF specified as 0.95 V max at IF = 10 mA.
2 NC unconnected No connection (Style 8: pin 2 = No Connection); the datasheet pinout lists this pin as not internally connected.
3 Cathode passive Cathode terminal of the Zener diode, identified on the package by the polarity band; the datasheet gives no pin-specific electrical limits beyond the device ratings.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener Voltage (22 V nominal, 81B) VZ 20.9 22 23.1 V @ IZT 5.6 mA; pulse test at TA = 25°C (Note 3) 3
Maximum Zener Impedance ZZT 29 Ω @ IZT 5.6 mA 3
Maximum Zener Impedance ZZK 600 Ω @ IZK 0.25 mA 3
Reverse Leakage Current IR 0.1 µA @ VR 17 V 3
Forward Voltage VF 0.9 V @ IF 10 mA 3
Total Power Dissipation on FR-5 Board PD 225 mW TA = 25°C; FR-5 board (Note 1) 1
Derating above 25°C (FR-5 Board) PD 1.8 mW/°C Derated above 25°C; FR-5 board (Note 1) 1
Total Power Dissipation on Alumina Substrate PD 300 mW TA = 25°C; alumina substrate (Note 2) 1
Derating above 25°C (Alumina Substrate) PD 2.4 mW/°C Derated above 25°C; alumina substrate (Note 2) 1
Thermal Resistance, Junction-to-Ambient (FR-5 Board) RJA 556 °C/W FR-5 board (Note 1) 1
Thermal Resistance, Junction-to-Ambient (Alumina Substrate) RJA 417 °C/W Alumina substrate (Note 2) 1
Junction and Storage Temperature Range TJ, Tstg -65 150 °C 1

CAD (KiCad official)

  • Symbol: MMBZ5251BLT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: mmbz5251blt1g-etched.step / mmbz5251blt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mmbz5251blt1g.step / mmbz5251blt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (7 pp, sha256 ab7a3f113b952d5a, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF