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Ray Publish 0.1.0 9f2825a 9d ago

MMBZ5237BS-7-F

Diodes Incorporated · Zener Diodes · SOT-363

MMBZ5237BS-7-F from Diodes Incorporated, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Anode of Zener diode 1 (dual isolated 200mW Zener, VZ nominal 8.2V at IZT = 20mA for MMBZ5237BS).
2 NC unconnected No connect pin, not internally connected to either Zener diode.
3 C2 passive Cathode of Zener diode 2 (dual isolated 200mW Zener, VZ nominal 8.2V at IZT = 20mA for MMBZ5237BS).
4 A2 passive Anode of Zener diode 2 (dual isolated 200mW Zener, VZ nominal 8.2V at IZT = 20mA for MMBZ5237BS).
5 NC unconnected No connect pin, not internally connected to either Zener diode.
6 C1 passive Cathode of Zener diode 1 (dual isolated 200mW Zener, VZ nominal 8.2V at IZT = 20mA for MMBZ5237BS).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-363
Category Diodes
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage (nominal 8.2 V) VZ 7.79 8.2 8.61 V @ IZT = 20 mA; short pulse test (Note 5) 2
Maximum Zener impedance ZZT 8 Ω @ IZT = 20 mA, f = 1 kHz (Note 6) 2
Maximum Zener impedance at knee ZZK 500 Ω @ IZK = 0.25 mA 2
Maximum reverse leakage current IR 3 μA @ VR = 6.5 V 2
Power dissipation PD 200 mW Mounted on FR4 PC board with recommended pad layout (Note 1) 1
Forward voltage VF 0.9 V @ IF = 10 mA 1
Operating and storage temperature range TJ, TSTG -65 150 °C 1
Thermal resistance, junction to ambient air RθJA 625 °C/W Mounted on FR4 PC board with recommended pad layout (Note 1) 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Terminals: Solderable per MIL-STD-202, Method 208 • Lead Free Plating (Matte Tin Finish annealed over Alloy 42 1

CAD (KiCad official)

  • Symbol: MMBZ5237BS-7-F
  • Footprint: Package_TO_SOT_SMD:SOT-363_SC-70-6
  • 3D model: SOT-363 (KiCad packages3D, STEP)
  • 3D model files: mmbz5237bs-7-f-etched.step / mmbz5237bs-7-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mmbz5237bs-7-f.step / mmbz5237bs-7-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (4 pp, sha256 b594a591fc6c585d, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF