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MMBZ5230BLT1G

Public Made by Adom

by adom

onsemi Zener Diodes, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MMBZ5230BLT1G

onsemi · Zener Diodes · SOT-23

MMBZ5230BLT1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Anode passive Anode of the 4.7 V Zener diode (VZ 4.46 V min to 4.94 V max at IZT = 20 mA); connects to the low-potential side in reverse-Zener regulation.
2 NC unconnected No connection internally (STYLE 8, pin 2 is No Connection).
3 Cathode passive Cathode of the 4.7 V Zener diode, marked by the polarity band; goes to the positive side in reverse-Zener regulation (VZ 4.46 V min to 4.94 V max at IZT = 20 mA).

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener Voltage VZ 4.46 4.7 4.94 V @ IZT = 20 mA, TA = 25°C 3
Maximum Zener Impedance ZZT 19 Ω @ IZT = 20 mA 3
Maximum Zener Impedance ZZK 1900 Ω @ IZK = 0.25 mA 3
Reverse Leakage Current IR 5 µA @ VR = 2 V 3
Forward Voltage VF 0.9 V IF = 10 mA, all types 3
Forward Voltage VF 0.95 V IF = 10 mA 2
Total Power Dissipation on FR-5 Board PD 225 mW TA = 25°C, FR-5 board 1
Derating above 25°C (FR-5) PD 1.8 mW/°C Derated above 25°C, FR-5 board 1
Total Power Dissipation on Alumina Substrate PD 300 mW TA = 25°C, alumina substrate 1
Derating above 25°C (Alumina) PD 2.4 mW/°C Derated above 25°C, alumina substrate 1
Junction and Storage Temperature Range TJ, Tstg -65 150 °C 1
Thermal Resistance Junction-to-Ambient (FR-5) RθJA 556 °C/W FR-5 board 1
Thermal Resistance Junction-to-Ambient (Alumina) RθJA 417 °C/W Alumina substrate 1
Maximum Soldering Case Temperature 260 °C 10 seconds 1

CAD (KiCad official)

  • Symbol: MMBZ5230BLT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: mmbz5230blt1g-etched.step / mmbz5230blt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mmbz5230blt1g.step / mmbz5230blt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (6 pp, sha256 ecb795b32601f300, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF